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Bipolar CMOS (BiCMOS) is a semiconductor technology that integrates two formerly separate semiconductor technologies, those of the bipolar junction transistor and the CMOS (complementary metal-oxide-semiconductor) gate, in a single integrated circuit device. [1] [2]


Bipolar junction transistors offer high speed, high gain, and low output resistance, which are excellent properties for high-frequency analog amplifiers, whereas CMOS technology offers high input resistance and is excellent for constructing simple, low-power logic gates. For as long as the two types of transistors have existed in production, designers of circuits utilizing discrete components have realized the advantages of integrating the two technologies; however, lacking implementation in integrated circuits, the application of this free-form design was restricted to fairly simple circuits. Discrete circuits of hundreds or thousands of transistors quickly expand to occupy hundreds or thousands of square centimeters of circuit board area, and for very high-speed circuits such as those used in modern digital computers, the distance between transistors (and the minimum capacitance of the connections between them) also makes the desired speeds grossly unattainable, so that if these designs cannot be built as integrated circuits, then they simply cannot be built.

This technology found application in amplifiers and analog power management circuits, and has some advantages in digital logic. BiCMOS circuits use the characteristics of each type of transistor most appropriately. Generally this means that high current circuits use metal–oxide–semiconductor field-effect transistors (MOSFETs) for efficient control, and portions of specialized very high performance circuits use bipolar devices. Examples of this include radio frequency (RF) oscillators, bandgap-based references and low-noise circuits.[ citation needed ]

The Pentium, Pentium Pro, and SuperSPARC microprocessors also used BiCMOS.


Many of the advantages of CMOS fabrication, for example, do not transfer directly to BiCMOS fabrication. An inherent difficulty arises from the fact that optimizing both the BJT and MOS components of the process is impossible without adding many extra fabrication steps and consequently increasing the process cost. Finally, in the area of high performance logic, BiCMOS may never offer the (relatively) low power consumption of CMOS alone, due to the potential for higher standby leakage current.


In July 1968, Hung-Chang Lin and Ramachandra R. Iyer demonstrated an integrated bipolar-MOS (BiMOS) audio amplifier, combining bipolar junction transistor (BJT) and metal-oxide-semiconductor (MOS) technologies, at Westinghouse Electric Corporation. [3] Lin and Iyer later demonstrated, with C.T. Ho, the first BiCMOS integrated circuit, combining BJT and complementary MOS (CMOS) technologies on a single integrated circuit, at Westinghouse in October 1968. [4] [5] In 1984, BiCMOS large-scale integration (LSI) was demonstrated by a Hitachi research team led by H. Higuchi, Goro Kitsukawa and Takahide Ikeda. [6]

In the 1990s,[ citation needed ] modern integrated circuit fabrication technologies began to make commercial BiCMOS technology a reality. This technology rapidly found application in amplifiers and analog power management circuits.

A type of BiCMOS technology is bipolar-CMOS-DMOS (BCD) technology, which combines BiCMOS with DMOS (double-diffused MOS), a type of power MOSFET technology. BCD technology combines three semiconductor device fabrication processes on a power IC (power integrated circuit) chip: bipolar for precise analog functions, CMOS for digital design, and DMOS for power electronic and high-voltage elements. It was developed by ST Microelectronics in the mid-1980s. There are two types of BCD: high-voltage BCD and high-density BCD. They have a wide range of applications, such as silicon-on-insulator (SOI) BCD being used for medical electronics, automotive safety and audio technology. [7]

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Integrated circuit electronic circuit manufactured by lithography; set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon

An integrated circuit or monolithic integrated circuit is a set of electronic circuits on one small flat piece of semiconductor material that is normally silicon. The integration of large numbers of tiny MOS transistors into a small chip results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs.

Semiconductor device fabrication manufacturing process used to create integrated circuits

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically the metal-oxide-semiconductor (MOS) devices used in the integrated circuit (IC) chips that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photolithographic and chemical processing steps during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.

Transistor Basic electronics component

A transistor is a semiconductor device used to amplify or switch electronic signals and electrical power. It is composed of semiconductor material usually with at least three terminals for connection to an external circuit. A voltage or current applied to one pair of the transistor's terminals controls the current through another pair of terminals. Because the controlled (output) power can be higher than the controlling (input) power, a transistor can amplify a signal. Today, some transistors are packaged individually, but many more are found embedded in integrated circuits.

MOSFET Transistor used for amplifying or switching electronic signals.

The metal–oxide–semiconductor field-effect transistor (MOSFET, MOS-FET, or MOS FET), also known as the metal–oxide–silicon transistor (MOS transistor, or MOS), is a type of insulated-gate field-effect transistor (IGFET) that is fabricated by the controlled oxidation of a semiconductor, typically silicon. The voltage of the covered gate determines the electrical conductivity of the device; this ability to change conductivity with the amount of applied voltage can be used for amplifying or switching electronic signals. The MOSFET was invented by Egyptian engineer Mohamed M. Atalla and Korean engineer Dawon Kahng at Bell Labs in November 1959. It is the basic building block of modern electronics, and the most frequently manufactured device in history, with an estimated total of 13 sextillion (1.3 × 1022) MOSFETs manufactured between 1960 and 2018.

Bipolar junction transistor transistor that uses both electron and hole charge carriers.In contrast,unipolar transistors such as field-effect transistors,only use one kind of charge carrier.For their operation,BJTs use 2 junctions between 2 semiconductor types,n-type and p-type

A bipolar junction transistor is a type of transistor that uses both electrons and holes as charge carriers.

CMOS Technology for constructing integrated circuits

Complementary metal–oxide–semiconductor (CMOS), also known as complementary-symmetry metal–oxide–semiconductor (COS-MOS), is a type of MOSFET fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips, and other digital logic circuits. CMOS technology is also used for analog circuits such as image sensors, data converters, RF circuits, and highly integrated transceivers for many types of communication.

4000-series integrated circuits

The 4000 series is a CMOS logic family of integrated circuits (ICs) first introduced in 1968 by RCA. Almost all IC manufacturers active during this initial era fabricated models for this series. It is still in use today.

A MESFET is a field-effect transistor semiconductor device similar to a JFET with a Schottky (metal-semiconductor) junction instead of a p-n junction for a gate.

In computer engineering, a logic family may refer to one of two related concepts. A logic family of monolithic digital integrated circuit devices is a group of electronic logic gates constructed using one of several different designs, usually with compatible logic levels and power supply characteristics within a family. Many logic families were produced as individual components, each containing one or a few related basic logical functions, which could be used as "building-blocks" to create systems or as so-called "glue" to interconnect more complex integrated circuits. A "logic family" may also refer to a set of techniques used to implement logic within VLSI integrated circuits such as central processors, memories, or other complex functions. Some such logic families use static techniques to minimize design complexity. Other such logic families, such as domino logic, use clocked dynamic techniques to minimize size, power consumption and delay.

The heterojunction bipolar transistor (HBT) is a type of bipolar junction transistor (BJT) which uses differing semiconductor materials for the emitter and base regions, creating a heterojunction. The HBT improves on the BJT in that it can handle signals of very high frequencies, up to several hundred GHz. It is commonly used in modern ultrafast circuits, mostly radio-frequency (RF) systems, and in applications requiring a high power efficiency, such as RF power amplifiers in cellular phones. The idea of employing a heterojunction is as old as the conventional BJT, dating back to a patent from 1951. Detailed theory of heterojunction bipolar transistor was developed by Herbert Kroemer in 1957.

Electronic component basic discrete device or physical entity in an electronic system used to affect electrons or their associated fields

An electronic component is any basic discrete device or physical entity in an electronic system used to affect electrons or their associated fields. Electronic components are mostly industrial products, available in a singular form and are not to be confused with electrical elements, which are conceptual abstractions representing idealized electronic components.

Power MOSFET power MOS field-effect transistor

A power MOSFET is a specific type of metal–oxide–semiconductor field-effect transistor (MOSFET) designed to handle significant power levels. Compared to the other power semiconductor devices, such as an insulated-gate bipolar transistor (IGBT) or a thyristor, its main advantages are high switching speed and good efficiency at low voltages. It shares with the IGBT an isolated gate that makes it easy to drive. They can be subject to low gain, sometimes to a degree that the gate voltage needs to be higher than the voltage under control.

Depletion-load NMOS logic form of nMOS logic family

In integrated circuits, depletion-load NMOS is a form of digital logic family that uses only a single power supply voltage, unlike earlier nMOS logic families that needed more than one different power supply voltage. Although manufacturing these integrated circuits required additional processing steps, improved switching speed and the elimination of the extra power supply made this logic family the preferred choice for many microprocessors and other logic elements.

A linear integrated circuit or analog chip is a set of miniature electronic analog circuits formed on a single piece of semiconductor material.

Active-pixel sensor an image sensor consisting of an integrated circuit

An active-pixel sensor (APS) is an image sensor where each pixel sensor unit cell has a photodetector and one or more active transistors. There are different types of active-pixel sensors, including the complementary metal–oxide–semiconductor (CMOS) APS used most commonly in digital camera technologies such as cell phone cameras, web cameras, most modern digital pocket cameras, most digital single-lens reflex cameras (DSLRs), and mirrorless interchangeable-lens cameras (MILCs). CMOS sensors emerged as an alternative to charge-coupled device (CCD) image sensors and eventually outsold them by the mid-2000s.

LDMOS is a planar double-diffused MOSFET used in microwave/RF power amplifiers as well as audio power amplifiers. These transistors are often fabricated on p/p+ silicon epitaxial layers. The fabrication of LDMOS devices mostly involves various ion-implantation and subsequent annealing cycles. As an example, The drift region of this power MOSFET is fabricated using up to three ion implantation sequences in order to achieve the appropriate doping profile needed to withstand high electric fields.

Tower Semiconductor company

Tower Semiconductor Ltd. (TowerJazz), and its fully owned U.S. subsidiaries Jazz Semiconductor and TowerJazz Texas, operate collectively under the brand name TowerJazz. TowerJazz manufactures integrated circuits offering a range of customizable analog specialty process technologies, including SiGe, BiCMOS, SOI, mixed-signal and RFCMOS, CMOS image sensors, power management (BCD), and non-volatile memory (NVM) as well as MEMS capabilities. TowerJazz also owns 51% of TowerJazz Panasonic Semiconductor Co. (TPSCo), an enterprise with Panasonic Corporation.

The following outline is provided as an overview of and topical guide to electronics:

Field-effect transistor transistor that uses an electric field to control the electrical behaviour of the device. FETs are also known as unipolar transistors since they involve single-carrier-type operation

The field-effect transistor (FET) is a type of transistor which uses an electric field to control the flow of current. FETs are devices with three terminals: source, gate, and drain. FETs control the flow of current by the application of a voltage to the gate, which in turn alters the conductivity between the drain and source.


  1. BiCMOS Process Technology. H Puchner 1996
  2. BiCMOS Process Flow. H Puchner 1996
  3. Lin, Hung Chang; Iyer, Ramachandra R. (July 1968). "A Monolithic Mos-Bipolar Audio Amplifier". IEEE Transactions on Broadcast and Television Receivers. 14 (2): 80–86. doi:10.1109/TBTR1.1968.4320132.
  4. Lin, Hung Chang; Iyer, Ramachandra R.; Ho, C. T. (October 1968). "Complementary MOS-bipolar structure". 1968 International Electron Devices Meeting: 22–24. doi:10.1109/IEDM.1968.187949.
  5. Alvarez, Antonio R. (1990). "Introduction To BiCMOS". BiCMOS Technology and Applications. Springer Science & Business Media. pp. 1-20 (2). doi:10.1007/978-1-4757-2029-7_1. ISBN   9780792393849.
  6. Higuchi, H.; Kitsukawa, Goro; Ikeda, Takahide; Nishio, Y.; Sasaki, N.; Ogiue, Katsumi (December 1984). "Performance and structures of scaled-down bipolar devices merged with CMOSFETs". 1984 International Electron Devices Meeting: 694–697. doi:10.1109/IEDM.1984.190818.
  7. "BCD (Bipolar-CMOS-DMOS) - Key Technology for Power ICs". ST Microelectronics . Archived from the original on 2016-06-06. Retrieved 27 November 2019.Cite uses deprecated parameter |dead-url= (help)