|Launched||October 27, 2014|
|L1 cache||64 KB per core|
|L2 cache||256 KB per core|
|L3 cache||2-6 MB (shared)|
|L4 cache||128 MB of eDRAM (Iris Pro models only)|
|Architecture and classification|
|Min. feature size||14 nm (Tri-Gate)|
|Products, models, variants|
Broadwell is the fifth generation of the Intel Core Processor. It's Intel's codename for the 14 nanometer die shrink of its Haswell microarchitecture. It is a "tick" in Intel's tick–tock principle as the next step in semiconductor fabrication.Like some of the previous tick-tock iterations, Broadwell did not completely replace the full range of CPUs from the previous microarchitecture (Haswell), as there were no low-end desktop CPUs based on Broadwell.
Some of the processors based on the Broadwell microarchitecture are marketed as "5th-generation Core" i3, i5 and i7 processors. This moniker is however not used for marketing of the Broadwell-based Celeron, Pentium or Xeon chips. This microarchitecture also introduced the Core M processor branding.
Broadwell is the last Intel platform on which Windows 7 is supported by either Intel or Microsoft; however, third-party hardware vendors have offered limited Windows 7 support on more recent platforms.
Broadwell's H and C variants are used in conjunction with Intel 9 Series chipsets (Z97, H97 and HM97), [ citation needed ]in addition to retaining backward compatibility with some of the Intel 8 Series chipsets.
Broadwell has been launched in three major variants:
Broadwell introduces some instruction set architecture extensions:
ADCXfor improving performance of arbitrary-precision integer operations
RDSEEDfor generating 16-, 32- or 64-bit random numbers from a thermal noise entropy stream, according to NIST SP 800-90B and 800-90C
Broadwell's Intel Quick Sync Video hardware video decoder adds VP8 hardware decodingand encoding support. It adds VP9 and HEVC 10-bit decoding support through the integrated GPU. HEVC decode is achieved through a combination of the fixed function video decoder and shaders. Also, it has two independent bit stream decoder (BSD) rings to process video commands on GT3 GPUs; this allows one BSD ring to process decoding and the other BSD ring to process encoding at the same time.
Broadwell's integrated GPU supports on Windows Direct3D 11.2, OpenGL 4.4 (OpenGL 4.5 on Linux ) and OpenCL 2.0. However, it is marketed as Direct3D-12-ready. Broadwell-E introduced Intel Turbo Boost Max Technology 3.0.
|Processor branding |
|GPU model||CPU frequency||TDP||Graphics clock rate||L3 cache||L4 cache||Release|
|Performance||4 (8)||Core i7||5775C||Iris Pro 6200||3.3 GHz||3.7 GHz||65 W||300 MHz||1.15 GHz||6 MB||128 MB||June 2, 2015||$366||LGA|
|Mainstream||4 (4)||Core i5||5675C||3.1 GHz||3.6 GHz||1.1 GHz||4 MB||$276|
|TDP||Socket||I/O bus||Memory||Release date||Part|
|Core i7-6950X||10||3.0 GHz||3.5 GHz||10 × 256 KiB||25 MB|
|LGA 2011-3||4 × DDR4-2400||30 May 2016||$1723|
|Core i7-6900K||8||3.2 GHz||3.7 GHz||8 × 256 KiB||20 MB|
|LGA 2011-3||4 × DDR4-2400||Q2 2016||$1089|
|Core i7-6850K||6||3.6 GHz||3.8 GHz||6 × 256 KiB||15 MB|
|LGA 2011-3||4 × DDR4-2400||Q2 2016||$617|
|Core i7-6800K||6||3.4 GHz||3.6 GHz||6 × 256 KiB||15 MB|
|LGA 2011-3||4 × DDR4-2400||Q2 2016||$434|
|GPU model||CPU frequency||TDP||Graphics clock rate|| L3|
|Performance||4 (8)||Core i7||5775R||Iris Pro 6200||3.3 GHz||3.8 GHz||65 W||300 MHz||1.15 GHz||6 MB||128 MB||June 2, 2015||$348||BGA|
|Mainstream||4 (4)||Core i5||5675R||3.1 GHz||3.6 GHz||1.1 GHz||4 MB||$265|
|5575R||2.8 GHz||3.3 GHz||1.05 GHz||$244|
|Server||4 (8)||Xeon E3||1284Lv4||Iris Pro P6300||2.9 GHz||3.8 GHz||47 W||1.15 GHz||6 MB||OEM|
|1278Lv4||2.0 GHz||3.3 GHz||800 MHz||1.0 GHz||$546|
|1258Lv4||P5700||1.8 GHz||3.2 GHz||700 MHz||N/A||$481|
|Turbo frequency||TDP||cTDP down||Graphics|
|Single Core||Dual Core||Base||Max|
|Performance||4 (8)||Core i7||5950HQ||Iris Pro 6200||2.9 GHz||3.7 GHz||N/A||47 W||N/A||300 MHz||1.15 GHz||6 MB||June 2015||$623|
|5850HQ||Iris Pro 6200||2.7 GHz||3.6 GHz||N/A||47 W||N/A||300 MHz||1.1 GHz||6 MB||June 2015||$434|
|5750HQ||Iris Pro 6200||2.5 GHz||3.4 GHz||N/A||47 W||600 MHz / 37 W||300 MHz||1.05 GHz||6 MB||June 2015||$434|
|5700HQ||HD 5600||2.7 GHz||3.5 GHz||N/A||47 W||600 MHz / 37 W||300 MHz||1.05 GHz||6 MB||June 2015||$378|
|Mainstream||2 (4)||5650U||HD 6000||2.2 GHz||3.2 GHz||3.1 GHz||15 W||600 MHz / 9.5 W||300 MHz||1 GHz||4 MB||Q1 2015||$426|
|5600U||HD 5500||2.6 GHz||3.2 GHz||3.1 GHz||15 W||600 MHz / 7.5 W||300 MHz||950 MHz||4 MB||Q1 2015||$393|
|5557U||Iris 6100||3.1 GHz||3.4 GHz||3.4 GHz||28 W||N/A / 23 W||300 MHz||1.1 GHz||4 MB||Q1 2015||$426|
|5550U||HD 6000||2.0 GHz||3.0 GHz||2.9 GHz||15 W||600 MHz / 9.5 W||300 MHz||1 GHz||4 MB||Q1 2015||$426|
|5500U||HD 5500||2.4 GHz||3.0 GHz||2.9 GHz||15 W||600 MHz / 7.5 W||300 MHz||950 MHz||4 MB||Q1 2015||$393|
|Core i5||5350H||Iris Pro 6200||3.1 GHz||3.5 GHz||N/A||47 W||N/A||300 MHz||1.05 GHz||4 MB||June 2015||$289|
|5350U||HD 6000||1.8 GHz||2.9 GHz||2.7 GHz||15 W||600 MHz / 9.5 W||300 MHz||1 GHz||3 MB||Q1 2015||$315|
|5300U||HD 5500||2.3 GHz||2.9 GHz||2.7 GHz||15 W||600 MHz / 7.5 W||300 MHz||900 MHz||3 MB||Q1 2015||$281|
|5287U||Iris 6100||2.9 GHz||3.3 GHz||3.3 GHz||28 W||600 MHz / 23 W||300 MHz||1.1 GHz||3 MB||Q1 2015||$315|
|5257U||Iris 6100||2.7 GHz||3.1 GHz||3.1 GHz||28 W||600 MHz / 23 W||300 MHz||1.05 GHz||3 MB||Q1 2015||$315|
|5250U||HD 6000||1.6 GHz||2.7 GHz||2.5 GHz||15 W||600 MHz / 9.5 W||300 MHz||950 MHz||3 MB||Q1 2015||$315|
|5200U||HD 5500||2.2 GHz||2.7 GHz||2.5 GHz||15 W||600 MHz / 7.5 W||300 MHz||900 MHz||3 MB||February 2015||$281|
|Core i3||5157U||Iris 6100||2.5 GHz||N/A||N/A||28 W||600 MHz / 23 W||300 MHz||1 GHz||3 MB||January 2015||$315|
|5020U||HD 5500||2.2 GHz||N/A||N/A||15 W||600 MHz / 10 W||300 MHz||900 MHz||3 MB||March 2015||$281|
|5015U||HD 5500||2.1 GHz||N/A||N/A||15 W||600 MHz / 10 W||300 MHz||850 MHz||3 MB||March 2015||$275|
|5010U||HD 5500||2.1 GHz||N/A||N/A||15 W||600 MHz / 10 W||300 MHz||900 MHz||3 MB||January 2015||$281|
|5005U||HD 5500||2.0 GHz||N/A||N/A||15 W||600 MHz / 10 W||300 MHz||850 MHz||3 MB||January 2015||$275|
|Pentium||3825U||HD Graphics||1.9 GHz||N/A||N/A||15 W||600 MHz / 10 W||300 MHz||850 MHz||2 MB||March 2015|
|2 (2)||3805U||HD Graphics||1.9 GHz||N/A||N/A||15 W||600 MHz / 10 W||100 MHz||800 MHz||2 MB||Q1 2015||$161|
|Celeron||3755U||HD Graphics||1.7 GHz||N/A||N/A||15 W||600 MHz / 10 W||100 MHz||800 MHz||2 MB||Q1 2015||$107|
|3205U||HD Graphics||1.5 GHz||N/A||N/A||15 W||600 MHz / 10 W||100 MHz||800 MHz||2 MB||Q1 2015||$107|
Branding & Model
|GPU Model||Programmable TDP :69–72||CPU Turbo||Graphics Clock rate|| L3|
|SDP :71||cTDP down [a]||Nominal TDP [b]||cTDP up [c]||1-core||Normal||Turbo|
|Mainstream||2 (4)||Core M (vPro)||5Y71||HD 5300 |
|3.5 W||3.5 W / 600 MHz||4.5 W / 1.2 GHz||6 W / 1.4 GHz||2.9 GHz||300 MHz||900 MHz||4 MB||October 27, 2014||$281|
|5Y70||N/A||N/A||4.5 W / 1.1 GHz||N/A||2.6 GHz||100 MHz||850 MHz||September 5, 2014|
|Core M||5Y51||3.5 W||3.5 W / 600 MHz||6 W / 1.3 GHz||300 MHz||900 MHz||October 27, 2014|
|5Y31||4.5 W / 900 MHz||6 W / 1.1 GHz||2.4 GHz||850 MHz|
|5Y10c||4.5 W / 800 MHz||6 W / 1 GHz||2.0 GHz||800 MHz|
|5Y10a||N/A||N/A||N/A||100 MHz||September 5, 2014|
|5Y10||4 W / ? MHz|
|Single core||All cores||Type||Channel|
|SoC server||16 (32)||Xeon D||D-1587||1.7 GHz||N/A||2.3 GHz||65 W||FCBGA 1667||DDR4|
|Dual||24 MB||Q1 2016||$1754|
|D-1577||1.3 GHz||2.1 GHz||45 W||Q1 2016||$1477|
|D-1571||1.3 GHz||2.1 GHz||Q1 2016||$1222|
|12 (24)||D-1567||2.1 GHz||2.7 GHz||65 W||18 MB||Q1 2016||$1299|
|D-1559||1.5 GHz||2.1 GHz||45 W||Q2 2016||$883|
|D-1557||1.5 GHz||2.1 GHz||Q1 2016||$844|
|8 (16)||D-1553N||2.3 GHz||2.7 GHz||65 W||12 MB||Q3 2017||$855|
|D-1548||2.0 GHz||2.6 GHz||45 W||Q4 2015||$675|
|D-1543N||1.9 GHz||2.4 GHz||Q3 2017||$652|
|D-1541||2.1 GHz||2.7 GHz||Q4 2015||$581|
|D-1540||2.0 GHz||2.6 GHz||Q1 2015||$581|
|D-1539||1.6 GHz||2.2 GHz||35 W||Q2 2016||$590|
|D-1537||1.7 GHz||2.3 GHz||Q4 2015||$571|
|6 (12)||D-1533N||2.1 GHz||2.7 GHz||45 W||9 MB||Q3 2017||$470|
|D-1531||2.2 GHz||2.7 GHz||Q4 2015||$348|
|4 (8)||D-1529||1.3 GHz||1.3 GHz||20 W||6 MB||Q2 2016||$324|
|6 (12)||D-1528||1.9 GHz||2.5 GHz||35 W||9 MB||Q4 2015||$389|
|4 (8)||D-1527||2.2 GHz||2.7 GHz||6 MB||Q4 2015||$259|
|D-1523N||2.0 GHz||2.6 GHz||45 W||Q3 2017||$256|
|D-1521||2.4 GHz||2.7 GHz||Q4 2015||$199|
|D-1520||2.2 GHz||2.6 GHz||Q1 2015||$199|
|D-1518||2.2 GHz||2.2 GHz||35 W||Q4 2015||$234|
|D-1513N||1.6 GHz||2.2 GHz||Q3 2017||$192|
|Pentium D||D1519||1.5 GHz||2.1 GHz||25 W||Q2 2016||$200|
|D1517||1.6 GHz||2.2 GHz||Q4 2015||$194|
|2 (2)||D1509||1.5 GHz||TBA||19 W||3 MB||$156|
|2 (4)||D1508||2.2 GHz||2.6 GHz||25 W||$129|
|2 (2)||D1507||1.2 GHz||TBA||20 W||$103|
branding and model
tray / box
|Server||4 (8)||Xeon E3 v4||1285v4||Iris Pro P6300||3.5 GHz||3.8 GHz||300 MHz||1.15 GHz||6 MB||95 W||Q2 15||$556 / —|| LGA|
| DMI 2.0 |
|DDR3 or DDR3L |
|1285Lv4||3.4 GHz||65 W||$445 / —|
|1265Lv4||2.3 GHz||3.3 GHz||1.05 GHz||35 W||$417 / —|
branding and model
|CPU clock rate||L3|
|22 (44)||Xeon E5 v4||2699v4||2.2 GHz||3.6 GHz||55 MB||145 W||Q1 16||$4115|| LGA|
|PCIe 3.0||DDR4 |
|20 (40)||2698v4||2.2 GHz||3.6 GHz||50 MB||135 W||$3226|
|18 (36)||2697v4||2.3 GHz||3.6 GHz||45 MB||145 W||$2702|
|16 (32)||2697Av4||2.6 GHz||3.6 GHz||40 MB||145 W||$2891|
|18 (36)||2695v4||2.1 GHz||3.3 GHz||45 MB||120 W||$2424|
|14 (28)||2690v4||2.6 GHz||3.5 GHz||35 MB||135 W||$2090|
|10 (20)||2689v4||3.1 GHz||3.8 GHz||25 MB||165 W||$2723|
|12 (24)||2687Wv4||3.0 GHz||3.5 GHz||30 MB||160 W||$2141|
|16 (32)||2683v4||2.1 GHz||3.0 GHz||40 MB||120 W||$1846|
|14 (28)||2680v4||2.4 GHz||3.3 GHz||35 MB||120 W||$1745|
|8 (16)||2667v4||3.2 GHz||3.6 GHz||25 MB||135 W||$2057|
|14 (28)||2660v4||2.0 GHz||3.2 GHz||35 MB||105 W||$1445|
|2658v4||2.3 GHz||2.8 GHz||$1832|
|12 (24)||2650v4||2.2 GHz||2.9 GHz||30 MB||105 W||$1166 - $1171|
|14 (28)||2650Lv4||1.7 GHz||2.5 GHz||35 MB||65 W||$1329|
|2648Lv4||1.8 GHz||2.5 GHz||75 W||$1544|
|6 (12)||2643v4||3.4 GHz||3.7 GHz||20 MB||135 W||$1552|
|10 (20)||2640v4||2.4 GHz||3.4 GHz||25 MB||90 W||$939||DDR4 |
|4 (8)||2637v4||3.5 GHz||3.7 GHz||15 MB||135 W||$996||DDR4 |
|10 (20)||2630v4||2.2 GHz||3.1 GHz||25 MB||85 W||$667||DDR4 |
|2630Lv4||1.8 GHz||2.9 GHz||55 W||$612|
|12 (24)||2628Lv4||1.9 GHz||2.4 GHz||30 MB||75 W||$1364|
|4 (8)||2623v4||2.6 GHz||3.2 GHz||10 MB||85 W||$444|
|8 (16)||2620v4||2.1 GHz||3.0 GHz||20 MB||$417|
|10 (20)||2618Lv4||2.2 GHz||3.2 GHz||25 MB||75 W||$779|
|8 (8)||2609v4||1.7 GHz||1.7 GHz||20 MB||85 W||$306 - $310||DDR4 |
|8 (16)||2608Lv4||1.6 GHz||1.7 GHz||50 W||$363|
|6 (6)||2603v4||1.7 GHz||1.7 GHz||15 MB||85 W||$213|
|8 (16)||1680v4||3.4 GHz||4.0 GHz||20 MB||140 W||Q2 16||$1723||DDR4 |
|1660v4||3.2 GHz||3.8 GHz||$1113|
|6 (12)||1650v4||3.6 GHz||4.0 GHz||15 MB||$617 - $621|
|4 (8)||1630v4||3.7 GHz||4.0 GHz||10 MB||$406|
|1620v4||3.5 GHz||3.8 GHz||$294 - $297|
On September 10, 2013, Intel showcased the Broadwell 14 nm processor in a demonstration at IDF. Intel CEO Brian Krzanich claimed that the chip would allow systems to provide a 30 percent improvement in power use over the Haswell chips released in mid-2013. Krzanich also claimed that the chips would ship by the end of 2013; however, the shipment was delayed due to low yields from Intel's 14 nm process.
On October 21, 2013, a leaked Intel roadmap indicated a late 2014 or early 2015 release of the K-series Broadwell on the LGA 1150 platform, in parallel with the previously announced Haswell refresh. This would coincide with the release of Intel's 9-series chipset, which would be required for Broadwell processors due to a change in power specifications for its LGA 1150 socket.
On May 18, 2014, Reuters quoted Intel's CEO promising that Broadwell-based PCs would be on shelves for the holiday season, but probably not for the back-to-school shopping.
Mobile CPUs were expected in Q4 2014 and high-performance quad-core CPUs in 2015. The mobile CPUs would benefit from the reduced energy consumption of the die shrink.
On June 18, 2014, Intel told CNET that while some specialized Broadwell-based products would be out in Q4 2014, "broader availability" (including mobile CPUs) would only happen in 2015.
As of July 2014 [update] , Broadwell CPUs were available to Intel's hardware partners in sample quantities. Intel was expected to release 17 Broadwell U series family microprocessors at CES 2015. Also, according to a leak posted on vr-zone, Broadwell-E chips would be available in 2016.
On August 11, 2014, Intel unveiled formally its 14 nm manufacturing process, and indicated that mobile variants of the process would be known as Core M products. Additionally, Core M products were announced to be shipping during the end of 2014, with desktop variants shipping shortly after.
With Broadwell, Intel focused mainly on laptops, miniature desktops, and all-in-one systems.This left traditional desktop users with no new socketed CPU options beyond fourth-generation Haswell, which first arrived in 2013. Even though the company finally introduced two Broadwell desktop chips in the summer of 2015, it launched its high-end sixth-generation Skylake CPUs very shortly thereafter. In September 2015, Kirk Skaugen, senior vice president and general manager of Intel's Client Computing Group, admitted that skipping desktops with Broadwell was a poor decision. Between the end-of-life for Windows XP in 2014 and the lack of new desktop chips, Intel had not given desktop PC users any good reasons to upgrade in 2015.
On September 5, 2014, Intel launched the first three Broadwell-based processors that belong to the low-TDP Core M family, Core M 5Y10, Core M 5Y10a and Core M 5Y70.
On October 9, 2014, the first laptop with Broadwell Intel Core M 5Y70 CPU, Lenovo Yoga 3 Pro, was launched.
On October 31, 2014, four more Broadwell based CPUs were launched belonging to Core M Family, increasing the number of launched Broadwell CPUs to seven.
On January 5, 2015, 17 additional Broadwell laptop CPUs were launched for the Celeron, Pentium and Core i3, i5 and i7 series.
On March 31, 2016, Intel officially launched 14 nm Broadwell-EP Xeon E5 V4 CPUs.
On May 30, 2016, Intel officially launched 14 nm Broadwell-E Core i7 69xx/68xx processor family.
Xeon is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have advanced features such as support for ECC memory, higher core counts, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability (RAS) features responsible for handling hardware exceptions through the Machine Check Architecture. They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the machine-check exception (MCE). Some also support multi-socket systems with two, four, or eight sockets through use of the Quick Path Interconnect (QPI) bus.
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board.
The Intel Core microarchitecture is a multi-core processor microarchitecture unveiled by Intel in Q1 2006. It is based on the Yonah processor design and can be considered an iteration of the P6 microarchitecture introduced in 1995 with Pentium Pro. High power consumption and heat intensity, the resulting inability to effectively increase clock rate, and other shortcomings such as an inefficient pipeline were the primary reasons why Intel abandoned the NetBurst microarchitecture and switched to a different architectural design, delivering high efficiency through a small pipeline rather than high clock rates. The Core microarchitecture initially did not reach the clock rates of the NetBurst microarchitecture, even after moving to 45 nm lithography. However after many generations of successor microarchitectures which used Core as their basis, Intel managed to eventually surpass the clock rates of Netburst with the Devil's Canyon microarchitecture reaching a base frequency of 4 GHz and a maximum tested frequency of 4.4 GHz using 22 nm lithography.
Sandy Bridge is the codename for the microarchitecture used in the "second generation" of the Intel Core processors. The Sandy Bridge microarchitecture is the successor to Nehalem microarchitecture. Intel demonstrated a Sandy Bridge processor in 2009, and released first products based on the architecture in January 2011 under the Core brand.
The AMD Accelerated Processing Unit (APU), formerly known as Fusion, is the marketing term for a series of 64-bit microprocessors from Advanced Micro Devices (AMD), designed to act as a central processing unit (CPU) and graphics processing unit (GPU) on a single die. APUs are general purpose processors that feature integrated graphics processors (IGPs).
Tick–tock was a production model adopted in 2007 by chip manufacturer Intel. Under this model, every microarchitecture change (tock) was followed by a die shrink of the process technology (tick). It was replaced by the process–architecture–optimization model, which was announced in 2016 and is like a tick–tock cycle followed by an optimization phase. As a general engineering model, tick-tock is a model that refreshes one side of a binary system each release cycle.
The Platform Controller Hub (PCH) is a family of Intel's single-chip chipsets, first introduced in 2009. It is the successor to the Intel Hub Architecture, which used two chips - a northbridge and southbridge instead, and first appeared in the Intel 5 Series.
Haswell is the codename for a processor microarchitecture developed by Intel as the "fourth-generation core" successor to the Ivy Bridge. Intel officially announced CPUs based on this microarchitecture on June 4, 2013, at Computex Taipei 2013, while a working Haswell chip was demonstrated at the 2011 Intel Developer Forum. With Haswell, which uses a 22 nm process, Intel also introduced low-power processors designed for convertible or "hybrid" ultrabooks, designated by the "Y" suffix.
Intel Core are streamlined midrange consumer, workstation and enthusiast computers central processing units (CPU) marketed by Intel Corporation. These processors displaced the existing mid- to high-end Pentium processors at the time of their introduction, moving the Pentium to the entry level, and bumping the Celeron series of processors to the low end. Identical or more capable versions of Core processors are also sold as Xeon processors for the server and workstation markets.
Intel Graphics Technology (GT) is the collective name for a series of integrated graphics processors (IGPs) produced by Intel that are manufactured on the same package or die as the central processing unit (CPU). It was first introduced in 2010 as Intel HD Graphics.
LGA 2011, also called Socket R, is a CPU socket by Intel. Released on November 14, 2011, it replaces Intel's LGA 1366 and LGA 1567 in the performance and high-end desktop and server platforms. The socket has 2011 protruding pins that touch contact points on the underside of the processor.
Skylake is the codename used by Intel for a processor microarchitecture that was launched in August 2015 succeeding the Broadwell microarchitecture. Skylake is a microarchitecture redesign using the same 14 nm manufacturing process technology as its predecessor, serving as a "tock" in Intel's "tick–tock" manufacturing and design model. According to Intel, the redesign brings greater CPU and GPU performance and reduced power consumption. Skylake CPUs share their microarchitecture with Kaby Lake, Coffee Lake, Cannon Lake, Whiskey Lake, and Comet Lake CPUs.
Ivy Bridge is the codename for the "third generation" of the Intel Core processors. Ivy Bridge is a die shrink to 22 nanometer manufacturing process based on the 32 nanometer Sandy Bridge —see tick–tock model. The name is also applied more broadly to the 22 nm die shrink of the Sandy Bridge microarchitecture based on FinFET ("3D") Tri-Gate transistors, which is also used in the Xeon and Core i7 Ivy Bridge-EX (Ivytown), Ivy Bridge-EP and Ivy Bridge-E microprocessors released in 2013.
Intel X99, codenamed "Wellsburg", is a Platform Controller Hub (PCH) designed and manufactured by Intel, targeted at the high-end desktop (HEDT) and enthusiast segments of the Intel product lineup. The X99 chipset supports both Intel Core i7 Extreme and Intel Xeon E5-16xx v3 and E5-26xx v3 processors, which belong to the Haswell-E and Haswell-EP variants of the Haswell microarchitecture, respectively. All supported processors use the LGA 2011-v3 socket.
Kaby Lake is Intel's codename for its seventh generation Core microprocessor family announced on August 30, 2016. Like the preceding Skylake, Kaby Lake is produced using a 14 nanometer manufacturing process technology. Breaking with Intel's previous "tick–tock" manufacturing and design model, Kaby Lake represents the optimized step of the newer process–architecture–optimization model. Kaby Lake began shipping to manufacturers and OEMs in the second quarter of 2016, and mobile chips have started shipping while Kaby Lake (desktop) chips were officially launched in January 2017.
Coffee Lake is Intel's codename for its eighth generation Core microprocessor family, announced on September 25, 2017. It is manufactured using Intel's second 14 nm process node refinement. Desktop Coffee Lake processors introduced i5 and i7 CPUs featuring six cores and Core i3 CPUs with four cores and no hyperthreading.
Configurable TDP (cTDP) and Low-Power Mode (LPM) form a design vector where the processor behavior and package TDP are dynamically adjusted to a desired system performance and power envelope. [...] With cTDP, the processor is now capable of altering the maximum sustained power with an alternate guaranteed frequency. Configurable TDP allows operation in situations where extra cooling is available or situations where a cooler and quieter mode of operation is desired.
If the CPU needs to work hard for an extended period of time and the laptop gets warmer, it will slowly ramp down its speed until it's operating at its stated TDP. [...] There are two OEM-configurable "power level" states that define how quick the CPU can be in these situations: PL2 tells the processor how much power it's allowed to use when it needs a short burst of speed, and PL1 defines how quickly the processor can run under sustained load. [...] This is at the heart of what Intel is doing with the Y-series processors: their maximum TDP has been lowered four watts, from 17 to 13. Intel is also validating them for use at two lower PL1 values: 10 watts and 7 watts. This is where the marketing we discussed earlier comes in—rather than keeping these values under the covers as it has so far been content to do, Intel has taken that lowest value, put it on its product pages, and called it SDP.