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Conformal coating material is a thin polymeric film which conforms to the contours of a printed circuit board to protect the board's components. Typically applied at 25-250 μm(micrometers) thickness, it is applied to electronic circuitry to protect against moisture, dust, chemicals, and temperature extremes.
A printed circuit board (PCB) mechanically supports and electrically connects electronic components or electrical components using conductive tracks, pads and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.
Coatings can be applied in a number of ways, including brushing, spraying, dispensing and dip coating. Furthermore, a number of materials can be used as a conformal coating, such as acrylics, silicones, urethanes and parlyene.Each has their own characteristics, making them preferred for certain environments and manufacturing scenarios. Most circuit board assembly firms coat assemblies with a layer of transparent conformal coating, which is lighter and easier to inspect than potting.
In electronics, potting is a process of filling a complete electronic assembly with a solid or gelatinous compound for resistance to shock and vibration, and for exclusion of moisture and corrosive agents. Thermosetting plastics or silicone rubber gels are often used, though epoxy resins are also very common. Many sites recommend using a potting product to protect sensitive electronic components from impact, vibration, and loose wires.
Conformal coatings are used to protect electronic components from the environmental factors they are exposed to. Examples of these factors include moisture, dust, salt, chemicals, temperature changes and mechanical abrasion. Successful conformal coating will prevent the board from corroding.More recently, conformal coatings are being used to reduce the formation of whiskers , and can also prevent current bleed between closely positioned components.
Metal whiskering is a phenomenon which occurs in electrical devices when metals form long whisker-like projections over time. Tin whiskers were noticed and documented in the vacuum tube era of electronics early in the 20th century in equipment that used pure, or almost pure, tin solder in their production. It was noticed that small metal hairs or tendrils grew between metal solder pads causing short circuits. Metal whiskers form in the presence of compressive stress. Zinc, cadmium, and even lead whiskers have been documented. Many techniques are used to mitigate the problem including changes to the annealing process, addition of elements like copper and nickel, and the inclusion of conformal coatings. Traditionally, lead was added to slow down whisker growth in tin-based solders.
Conformal coatings are breathable, allowing trapped moisture in electronic boards to escape while maintaining protection from contamination. These coatings are not sealants, and prolonged exposure to vapors will cause transmission and degradation to occur. There are typically four classes of conformal coatings: Acrylic, Urethane, Silicone, and Varnish. While each has its own specific physical and chemical properties each are able to perform the following functions:
Precision analog circuitry may suffer degraded accuracy if insulating surfaces become contaminated with ionic substances such as fingerprint residues, which can become weakly conductive in the presence of moisture. (The classic symptom of micro-contamination on an analog circuit board is sudden changes in performance at high humidity, for example when a technician breathes on it). A suitably chosen material coating can reduce the effects of mechanical stress and vibrations on the circuit and its ability to perform in extreme temperatures.
Analogue electronics are electronic systems with a continuously variable signal, in contrast to digital electronics where signals usually take only two levels. The term "analogue" describes the proportional relationship between a signal and a voltage or current that represents the signal. The word analogue is derived from the Greek word ανάλογος (analogos) meaning "proportional".
In chemistry, an ionic compound is a chemical compound composed of ions held together by electrostatic forces termed ionic bonding. The compound is neutral overall, but consists of positively charged ions called cations and negatively charged ions called anions. These can be simple ions such as the sodium (Na+) and chloride (Cl−) in sodium chloride, or polyatomic species such as the ammonium (NH+
4) and carbonate (CO2−
3) ions in ammonium carbonate. Individual ions within an ionic compound usually have multiple nearest neighbours, so are not considered to be part of molecules, but instead part of a continuous three-dimensional network, usually in a crystalline structure.
For example, in a chip-on-board assembly process, a silicon die is mounted on the board with an adhesive or a soldering process, then electrically connected by wire bonding, typically with .001-inch-diameter gold or aluminum wire. The chip and the wire are delicate, so they are encapsulated in a version of conformal coating called "glob top." This prevents accidental contact from damaging the wires or the chip. Another use of conformal coatingis to increase the voltage rating of a dense circuit assembly. An insulating coating can withstand a much stronger electric field than air, particularly at high altitude.
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor through processes such as photolithography. The wafer is cut (diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.
Soldering is a process in which two or more items are joined together by melting and putting a filler metal (solder) into the joint, the filler metal having a lower melting point than the adjoining metal. Unlike welding, soldering does not involve melting the work pieces. In brazing, the filler metal melts at a higher temperature, but the work piece metal does not melt. In the past, nearly all solders contained lead, but environmental and health concerns have increasingly dictated use of lead-free alloys for electronics and plumbing purposes.
Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding can be used at frequencies above 100 GHz.
With the exception of parylene, most organic coatings are readily penetrated by water molecules. A coating preserves the performance of electronics primarily by preventing ionizable contaminants such as salts from reaching circuit nodes, and combining there with water to form a microscopically thin electrolyte film. For this reason, coating is far more effective if all surface contamination is removed first, using a highly repeatable industrial process such as vapor degreasing or semi-aqueous washing. Extreme cleanliness also improves adhesion. Pinholes defeat the purpose of the coating, because a contaminant film would make contact with circuit nodes and form undesired conductive paths.
The coating material can be applied by various methods, including brushing, spraying, dipping or selectively coating by robots. Different methods of curing and drying are available depending on the conformal coating material. Nearly all modern conformal coatings contain a fluorescent dye to aid in coating coverage inspection.
This works by flow coating the material onto the board and is suitable for low volume application, finishing and repair. The finish tends to be cosmetically inferior and can be subject to many defects such as bubbles.The coating also tends to be thicker unless skilled operators apply the coating.
This coating can be completed with a spray aerosol or dedicated spray booth with spray gun and is suitable for low and medium volume processing.The quality of the surface finish can be superior to all other methods when a skilled operator completes the process, provided that the circuit board is clean and the coating has no adhesion problems. The coating application may be limited due to 3D effects. Masking requirements are more of a shield nature rather than a barrier, since there is less penetration. The lack of penetration can be a problem where the coating is desired to penetrate beneath devices.
Spray application can be one of the most cost-effective ways of applying conformal coating, as it can be done on the bench top for small rework and repair jobs. This method can be done in spray booths for medium scale production.
One of the key attributes of atomised spraying is giving excellent tip coverage to components. When conformal coatings are applied to a PCB they have a tendency to slump. The first layer of a coating can give a thin edge on the corner of components. This can be improved with a second coat by double dipping or brushing, but this is a repeat process and may not be acceptable. To eliminate this problem atomised spraying can be used.
This coating is a highly repeatable process. If the printed circuit board (PCB) is designed correctly, it can be the highest volume technique.The coating penetrates everywhere, including beneath devices, hence masking must be perfect to prevent leakage. Therefore, many PCBs are unsuitable for dipping due to design.
The issue of thin tip coverage where the material slumps around sharp edges can be a problem, especially in a condensing atmosphere. This tip coverage effect can be eliminated by either double dipping the PCB or using several thin layers of atomised spraying to achieve good coverage without exceeding coating thickness recommendations. A combination of the two techniques may also be used.
This method is the best choice for high volume applications. It is a fast and accurate way of applying the coating to the exact areas of the board where it is required.
It works by using a needle and atomised spray applicator, non-atomised spray or ultrasonic valve technologies that can move above the circuit board and dispense / spray the coating material in select areas. Flow rates and material viscosity are programmed into the computer system controlling the applicator so that the desired coating thickness is maintained.This method is effective for large volumes, provided that the PCBs are designed for the method. There are limitations in the select coat process Choice of method is dependent on the complexity of the substrate to be coated, the required coating performance, and the throughput requirements.
For standard solvent-based acrylics, air drying (film forming) is the normal process except where speed is essential. Then heat curing can be used, using batch or inline ovens with conveyors and using typical cure profiles.
Water-based conformal coatings can be treated in the same manner, but with more care in the heat application due to longer drying times.
UV curing of conformal coatings is becoming important for high volume users in fields such as automotive and consumer electronics.
This increase in the popularity of UV curable conformal coatings is due to its rapid cure speed, ease of processing, environmental friendliness and thermal cycling resistance.
UV conformal coatings can be cured with arc and microwave lamps.
Coating material (after curing) should have a thickness of 30–130 μm (0.0012–0.0051 in) when using acrylic resin, epoxy resin, or urethane resin. For silicone resin, the coating thickness recommended by the IPC standards is 50–210 μm (0.0020–0.0083 in).
There are several methods for measuring coating thickness, and they fall into two categories: wet film and dry film.
The wet film method ensures quality control while the coating is still wet.
Applying too much coating can be expensive. Also, wet film measurements are useful for conformal coatings where the dry film thickness can only be measured destructively or where over-application of conformal coating is a problem.
The wet film gauges are applied to the wet conformal coating; the teeth indicate the coating thickness. The dry film thickness can then be calculated from the measurement.
An alternative to wet film measurement is by using using eddy currents. The system works by placing the test head on the surface of the conformal coating. The measurement is almost instantaneous and provides an immediate repeatable result for thickness measurement.
Test coupons are the ideal method for measuring coating thickness, and can be archived as a physical record. Apply the coating to test coupons at the same time as the circuit boards provides a permanent record of coating thickness.
Thicker coatings or better-applied coatings may be required when liquid water is present due to possible pinhole formation in the coating [ citation needed ]or when the coating is too thin on sharp edges of components due to poor application. This is considered a defect and can be eliminated with appropriate steps and training. These techniques effectively "pot" or "conform" to components by completely covering them.
Traditionally, conformal coating inspection has been done manually. A typical situation is an inspector sitting in a booth, examining each PCB under a high intensity long wave UV lamp. The inspector checks for proper workmanship and that standards are met.
Recent developments in conformal coating automated optical inspection (AOI) have begun to address these manual processes and issues. Automated Inspection Systems can be camera- or scanner-based, hence the technology can be matched to the project.
The selection of conformal coating material needs to be done carefully, and in relation to the application method.Incorrect selection can affect long term reliability of the circuit board, and can cause processing and cost problems.
The most common[ citation needed ] standards for conformal coating are IPC A-610 and IPC-CC-830. These standards list indications of good and bad coverage and describe various failure mechanisms such as dewetting and orange peel.
Another type of coating called parylene is applied with a vacuum deposition process at ambient temperature. Film coatings from 0.100 to 76 μm can be applied in a single operation. The advantage of parylene coatings is that they cover hidden surfaces and other areas where spray and needle application are not possible. Coating thickness is uniform, even on irregular surfaces. Desired contact points such as battery contacts or connectors must be covered with an air-tight mask to prevent the parylene from coating the contacts. Applying parylene is a batch process which does not lend itself to high volume processing. The cost per PCB can be high due to high capital investment and the cost per batch.
There are many chemistries of conformal coatings available. It is important to choose a coating chemistry meeting the application needs. Below are five common attributes for each coating chemistry.
The basics of conformal coating processing are found in a presentation available at:
Selecting the correct coating material is one of the process engineer's most critical decisions. This criteria includes:
Answers will determine the suitability of a particular material, be it acrylic, polyurethane, silicone, epoxy, etc. Process, production and commercial issues will then enter the equation:
Paint is any pigmented liquid, liquefiable, or mastic composition that, after application to a substrate in a thin layer, converts to a solid film. It is most commonly used to protect, color, or provide texture to objects. Paint can be made or purchased in many colors—and in many different types, such as watercolor, synthetic, etc. Paint is typically stored, sold, and applied as a liquid, but most types dry into a solid.
Varnish is a clear transparent hard protective finish or film. Varnish has little or no color and has no added pigment as opposed to paint or wood stain which contains pigment. However, some varnish products are marketed as a combined stain and varnish. Varnish is primarily used in wood finishing applications where the natural tones and grains in the wood are intended to be visible. It is applied over wood stains as a final step to achieve a film for gloss and protection. Varnish finishes are usually glossy but may be designed to produce satin or semi-gloss sheens by the addition of "flatting" agents.
A thermosetting polymer, resin, or plastic, often called a thermoset, is a polymer that is irreversibly hardened by curing from a soft solid or viscous liquid prepolymer or resin. Curing is induced by heat or suitable radiation and may be promoted by high pressure, or mixing with a catalyst. It results in chemical reactions that create extensive cross-linking between polymer chains to produce an infusible and insoluble polymer network.
Stucco or render is a material made of aggregates, a binder, and water. Stucco is applied wet and hardens to a very dense solid. It is used as a decorative coating for walls and ceilings, and as a sculptural and artistic material in architecture. Stucco may be used to cover less visually appealing construction materials, such as metal, concrete, cinder block, or clay brick and adobe.
A thin film is a layer of material ranging from fractions of a nanometer (monolayer) to several micrometers in thickness. The controlled synthesis of materials as thin films is a fundamental step in many applications. A familiar example is the household mirror, which typically has a thin metal coating on the back of a sheet of glass to form a reflective interface. The process of silvering was once commonly used to produce mirrors, while more recently the metal layer is deposited using techniques such as sputtering. Advances in thin film deposition techniques during the 20th century have enabled a wide range of technological breakthroughs in areas such as magnetic recording media, electronic semiconductor devices, LEDs, optical coatings, hard coatings on cutting tools, and for both energy generation and storage. It is also being applied to pharmaceuticals, via thin-film drug delivery. A stack of thin films is called a multilayer.
A coating is a covering that is applied to the surface of an object, usually referred to as the substrate. The purpose of applying the coating may be decorative, functional, or both. The coating itself may be an all-over coating, completely covering the substrate, or it may only cover parts of the substrate. An example of all of these types of coating is a product label on many drinks bottles- one side has an all-over functional coating and the other side has one or more decorative coatings in an appropriate pattern to form the words and images.
Powder coating is a type of coating that is applied as a free-flowing, dry powder. The main difference between a conventional liquid paint and a powder coating is that the powder coating does not require a solvent to keep the binder and filler parts in coating and is then cured under heat to allow it to flow and form a "skin". The powder may be a thermoplastic or a thermoset polymer. It is usually used to create a hard finish that is tougher than conventional paint. Powder coating is mainly used for coating of metals, such as household appliances, aluminium extrusions, drum hardware and automobile and bicycle parts. Newer technologies allow other materials, such as MDF, to be powder coated using different methods. The powder coating process was invented around 1945 by Daniel Gustin US Patent 2538562.
Fusion bonded epoxy coating, also known as fusion-bond epoxy powder coating and commonly referred to as FBE coating, is an epoxy-based powder coating that is widely used to protect steel pipe used in pipeline construction, concrete reinforcing bars (rebar) and on a wide variety of piping connections, valves etc. from corrosion. FBE coatings are thermoset polymer coatings. They come under the category of protective coatings in paints and coating nomenclature. The name fusion-bond epoxy is due to resin cross-linking and the application method, which is different from a conventional paint. The resin and hardener components in the dry powder FBE stock remain unreacted at normal storage conditions. At typical coating application temperatures, usually in the range of 180 to 250 °C, the contents of the powder melt and transform to a liquid form. The liquid FBE film wets and flows onto the steel surface on which it is applied, and soon becomes a solid coating by chemical cross-linking, assisted by heat. This process is known as “fusion bonding”. The chemical cross-linking reaction taking place in this case is irreversible. Once the curing takes place, the coating cannot be returned to its original form by any means. Application of further heating will not “melt” the coating and thus it is known as a “thermoset” coating.
A UV coating is a surface treatment which either is cured by ultraviolet radiation, or which protects the underlying material from such radiation's harmful effects.
Parylene is the trade name for a variety of chemical vapor deposited poly(p-xylylene) polymers used as moisture and dielectric barriers. Among them, Parylene C is the most popular due to its combination of barrier properties, cost, and other processing advantages.
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge. Product safety standards may dictate particular features of a consumer product, for example, external case temperature or grounding of exposed metal parts. Prototypes and industrial equipment made in small quantities may use standardized commercially available enclosures such as card cages or prefabricated boxes. Mass-market consumer devices may have highly specialized packaging to increase consumer appeal. Electronic packaging is a major discipline within the field of mechanical engineering.
Solder mask or solder stop mask or solder resist is a thin lacquer-like layer of polymer that is usually applied to the copper traces of a printed circuit board (PCB) for protection against oxidation and to prevent solder bridges from forming between closely spaced solder pads. A solder bridge is an unintended electrical connection between two conductors by means of a small blob of solder. PCBs use solder masks to prevent this from happening. Solder mask is not always used for hand soldered assemblies, but is essential for mass-produced boards that are soldered automatically using reflow or solder bath techniques. Once applied, openings must be made in the solder mask wherever components are soldered, which is accomplished using photolithography. Solder mask is traditionally green but is now available in many colors.
Industrial ovens are heated chambers used for a variety of industrial applications, including drying, curing, or baking components, parts or final products. Industrial ovens can be used for large or small volume applications, in batches or continuously with a conveyor line, and a variety of temperature ranges, sizes and configurations.
Automotive paint is paint used on automobiles for both protection and decoration purposes. Water-based acrylic polyurethane enamel paint is currently the most widely used paint for reasons including reducing paint's environmental impact.
Adhesive bonding describes a wafer bonding technique with applying an intermediate layer to connect substrates of different types of materials. Those connections produced can be soluble or insoluble. The commercially available adhesive can be organic or inorganic and is deposited on one or both substrate surfaces. Adhesives, especially the well-established SU-8, and benzocyclobutene (BCB), are specialized for MEMS or electronic component production.
Ultrasonic nozzles are a type of spray nozzle that uses high frequency vibration produced by piezoelectric transducers acting upon the nozzle tip that will create capillary waves in a liquid film. Once the amplitude of the capillary waves reaches a critical height, they become too tall to support themselves and tiny droplets fall off the tip of each wave resulting in atomization.
Liquid Roofing is the process of waterproofing a roof by the application of a specialist liquid roof coating. It is suited to all types of roof, including flat, pitched, and domed.
Film capacitors, plastic film capacitors, film dielectric capacitors, or polymer film capacitors, generically called “film caps” as well as power film capacitors, are electrical capacitors with an insulating plastic film as the dielectric, sometimes combined with paper as carrier of the electrodes.