↑ G.H. Bernstein, Q. Liu, M. Yan, Z. Sun, W. Porod, G. Snider and P. Fay, "Quilt Packaging: High Density, High-Speed Interchip Communications," IEEE Trans. on Advanced Packaging, 30(4), 731-740, 2007
↑ P. Fay, D. Kopp, T. Lu, D. Neal, G.H. Bernstein, J.M. Kulick, "Ultrawide Bandwidth Chip-to-Chip Interconnects for III-V MMICS, " IEEE Microwaves and Wireless Components Letters, Vol. PP, Issue 99, November 2013.