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Solder is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to adhere to and connect the pieces after cooling, which requires that an alloy suitable for use as solder have a lower melting point than the pieces being joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.
Tin is a chemical element with the symbol Sn and atomic number 50. Tin is a silvery metal that characteristically has a faint yellow hue.
Electroplating is a general name for processes that produce a metal coating on a solid substrate through the reduction of cations of that metal by means of a direct electric current. The part to be coated acts as the cathode of an electrolytic cell; the electrolyte is a solution of a salt of the metal to be coated; and the anode is usually either a block of that metal, or of some inert conductive material. The current is provided by an external power supply.
A printed circuit board (PCB) is a laminated sandwich structure of conductive and insulating layers. PCBs have two complementary functions. The first is to affix electronic components in designated locations on the outer layers by means of soldering. The second is to provide reliable electrical connections between the component's terminals in a controlled manner often referred to as PCB design. Each of the conductive layers is designed with an artwork pattern of conductors that provides electrical connections on that conductive layer, while another manufacturing process adds vias - small and precisely located holes that are drilled through the laminate and then plated with copper. The vias are the electrical interconnection between layers that are otherwise insulated in the laminate structure and this allows a third dimension of connection between conductive layers in a controlled manner that is both reliable and cost-effective for mass production of electronic products.
In physics and electrical engineering, a conductor is an object or type of material that allows the flow of charge in one or more directions. Materials made of metal are common electrical conductors. Electrical current is generated by the flow of negatively charged electrons, positively charged holes, and positive or negative ions in some cases.
A halide is a binary phase, of which one part is a halogen atom and the other part is an element or radical that is less electronegative than the halogen, to make a, e.g., fluoride, chloride, or theoretically tennesside compound. The alkali metals combine directly with halogens under appropriate conditions forming halides of the general formula, MX. Many salts are halides; the hal- syllable in halide and halite reflects this correlation. All Group 1 metals form halides that are white solids at room temperature.
Wood easily degrades without sufficient preservation. Apart from structural wood preservation measures, there are a number of different chemical preservatives and processes that can extend the life of wood, timber, and their associated products, including engineered wood. These generally increase the durability and resistance from being destroyed by insects or fungi.
In metallurgy, a flux is a chemical cleaning agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time. They are used in both extractive metallurgy and metal joining.
OSP may refer to:
Plating is a surface covering in which a metal is deposited on a conductive surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for radiation shielding, and for other purposes. Jewelry typically uses plating to give a silver or gold finish.
Succinimide is an organic compound with the formula (CH2)2(CO)2NH. This white solid is used in a variety of organic syntheses, as well as in some industrial silver plating processes. The compound is classified as a cyclic imide. It may be prepared by thermal decomposition of ammonium succinate.
Metal whiskering is a phenomenon which occurs in electrical devices when metals form long whisker-like projections over time. Tin whiskers were noticed and documented in the vacuum tube era of electronics early in the 20th century in equipment that used pure, or almost pure, tin solder in their production. It was noticed that small metal hairs or tendrils grew between metal solder pads causing short circuits. Metal whiskers form in the presence of compressive stress. Zinc, cadmium, and even lead whiskers have been documented. Many techniques are used to mitigate the problem including changes to the annealing process, addition of elements like copper and nickel, and the inclusion of conformal coatings. Traditionally, lead has been added to slow down whisker growth in tin-based solders.
Gold plating is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver, by chemical or electrochemical plating. This article covers plating methods used in the modern electronics industry; for more traditional methods, often used for much larger objects, see gilding.
The role of the substrate in power electronics is to provide the interconnections to form an electric circuit, and to cool the components. Compared to materials and techniques used in lower power microelectronics, these substrates must carry higher currents and provide a higher voltage isolation. They also must operate over a wide temperature range.
Electroless nickel-phosphorus plating is a chemical process that deposits an even layer of nickel-phosphorus alloy on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing nickel salt and a phosphorus-containing reducing agent, usually a hypophosphite salt. It is the most common version of electroless nickel plating and is often referred by that name. A similar process uses a borohydride reducing agent, yielding a nickel-boron coating instead.
HASL or HAL is a type of finish used on printed circuit boards (PCBs).
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes. It consists of an electroless nickel plating, covered with a thin layer of gold, which protects the nickel from oxidation. The gold is typically applied by quick immersion in a solution containing gold salts. Some of the nickel is oxidized to Ni2+ while the gold is reduced to metallic state. A variant of this process adds a thin layer of electroless palladium over the nickel, a process known by the acronym ENEPIG.
Immersion silver plating is a surface plating process that creates a thin layer of silver over copper objects. It consists in dipping the object briefly into a solution containing silver ions.
Ellington Electronics Technology Group 依頓電子科技股份有限公司 is one of the leading printed circuit board (PCB) manufacturers in China. It is a Hong Kong based company which is listed on the Shanghai Stock Exchange on 1 July 2014. In Year 2018, the company was ranked Top 10 in China and 41st in the world by revenue.
Flowers of sulfur (FOS) testing was developed to determine the porosity of metallic coatings susceptible to sulfur induced corrosion [see below ASTM B809-95(2018)]. Applicable substrates are silver, copper, copper alloys and any other metal or metal alloy with which sulfur will react. For porosity testing, coatings can be single or multiple layers of any metal that is not corroded and sealed by a self-limiting reaction in the reducing sulfur environment of the FOS test. The simplest recommended technique is to identify any porosity of the coating as revealed by the presence of surface spots. These surface spots form where the environmental sulfur has penetrated and reacted with the base metal, producing a metal sulfide. Chalcocite, copper (I) sulfide is dark-grey to black. Silver (I) sulfide is also grey-black.
References
- Tong, K. H., M. T. Ku, K. L. Hsu, Q. Tang, C. Y. Chan, and K. W. Yee. “The Evolution of Organic Solderability Preservative (OSP) Process in PCB Application.” 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT). Institute of Electrical & Electronics Engineers (IEEE), October 2013. doi:10.1109/impact.2013.6706620.
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