Conformance testing — an element of conformity assessment, and also known as compliance testing, or type testing — is testing or other activities that determine whether a process, product, or service complies with the requirements of a specification, technical standard, contract, or regulation. Testing is often either logical testing or physical testing. The test procedures may involve other criteria from mathematical testing or chemical testing. Beyond simple conformance, other requirements for efficiency, interoperability or compliance may apply. Conformance testing may be undertaken by the producer of the product or service being assessed, by a user, or by an accredited independent organization, which can sometimes be the author of the standard being used. When testing is accompanied by certification, the products or services may then be advertised as being certified in compliance with the referred technical standard. Manufacturers and suppliers of products and services rely on such certification including listing on the certification body's website, to assure quality to the end user and that competing suppliers are on the same level.
Electrostatic discharge (ESD) is a sudden and momentary flow of electric current between two electrically charged objects caused by contact, an electrical short or dielectric breakdown. A buildup of static electricity can be caused by tribocharging or by electrostatic induction. The ESD occurs when differently-charged objects are brought close together or when the dielectric between them breaks down, often creating a visible spark.
The JEDEC Solid State Technology Association is an independent semiconductor engineering trade organization and standardization body headquartered in Arlington County, Virginia, United States.
Static electricity is an imbalance of electric charges within or on the surface of a material or between materials. The charge remains until it is able to move away by means of an electric current or electrical discharge. Static electricity is named in contrast with current electricity, where the electric charge flows through an electrical conductor or space, and transmits energy.
In electrical engineering, partial discharge (PD) is a localized dielectric breakdown (DB) of a small portion of a solid or fluid electrical insulation (EI) system under high voltage (HV) stress. While a corona discharge (CD) is usually revealed by a relatively steady glow or brush discharge (BD) in air, partial discharges within solid insulation system are not visible.
A humidity indicator card (HIC) is a card on which a moisture-sensitive chemical is impregnated such that it will change color when the indicated relative humidity is exceeded. This has usually been a blotting paper impregnated with cobalt(II) chloride base; Less toxic alternatives include other chemicals such as cobalt-free chloride base and special plastic films.
An electronic symbol is a pictogram used to represent various electrical and electronic devices or functions, such as wires, batteries, resistors, and transistors, in a schematic diagram of an electrical or electronic circuit. These symbols are largely standardized internationally today, but may vary from country to country, or engineering discipline, based on traditional conventions.
A sound level meter is used for acoustic measurements. It is commonly a hand-held instrument with a microphone. The best type of microphone for sound level meters is the condenser microphone, which combines precision with stability and reliability. The diaphragm of the microphone responds to changes in air pressure caused by sound waves. That is why the instrument is sometimes referred to as a sound pressure level meter (SPL). This movement of the diaphragm, i.e. the sound pressure, is converted into an electrical signal. While describing sound in terms of sound pressure, a logarithmic conversion is usually applied and the sound pressure level is stated instead, in decibels (dB), with 0 dB SPL equal to 20 micropascals.
Body capacitance is the physical property of the human body that has it act as a capacitor. Like any other electrically-conductive object, a human body can store electric charge if insulated. The actual amount of capacitance varies with the surroundings; it would be low when standing on top of a pole with nothing nearby, but high when leaning against an insulated, but grounded large metal surface, such as a household refrigerator, or a metal wall in a factory.
An antistatic device is any device that reduces, dampens, or otherwise inhibits electrostatic discharge, or ESD, which is the buildup or discharge of static electricity. ESD can damage electrical components such as computer hard drives, and even ignite flammable liquids and gases.
Transmission-Line Pulse (TLP) is a way to study integrated circuit technologies and circuit behavior in the current and time domain of electrostatic-discharge (ESD) events. The concept was described shortly after WWII in pp. 175–189 of Pulse Generators, Vol. 5 of the MIT Radiation Lab Series. Also, D. Bradley, J. Higgins, M. Key, and S. Majumdar realized a TLP-based laser-triggered spark gap for kilovolt pulses of accurately variable timing in 1969. For investigation of ESD and electrical-overstress (EOS) effects a measurement system using a TLP generator has been introduced first by T. Maloney and N. Khurana in 1985. Since then, the technique has become indispensable for integrated circuit ESD protection development.
The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices. For the purpose of this standard, the term "devices" includes such items as monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices.
Reliability of semiconductor devices can be summarized as follows:
- Semiconductor devices are very sensitive to impurities and particles. Therefore, to manufacture these devices it is necessary to manage many processes while accurately controlling the level of impurities and particles. The finished product quality depends upon the many layered relationship of each interacting substance in the semiconductor, including metallization, chip material and package.
- The problems of micro-processes, and thin films and must be fully understood as they apply to metallization and wire bonding. It is also necessary to analyze surface phenomena from the aspect of thin films.
- Due to the rapid advances in technology, many new devices are developed using new materials and processes, and design calendar time is limited due to non-recurring engineering constraints, plus time to market concerns. Consequently, it is not possible to base new designs on the reliability of existing devices.
- To achieve economy of scale, semiconductor products are manufactured in high volume. Furthermore, repair of finished semiconductor products is impractical. Therefore, incorporation of reliability at the design stage and reduction of variation in the production stage have become essential.
- Reliability of semiconductor devices may depend on assembly, use, environmental, and cooling conditions. Stress factors affecting device reliability include gas, dust, contamination, voltage, current density, temperature, humidity, mechanical stress, vibration, shock, radiation, pressure, and intensity of magnetic and electrical fields.
An ESD simulator, also known as an ESD gun, is a handheld unit used to test the immunity of devices to electrostatic discharge (ESD). These simulators are used in special electromagnetic compatibility (EMC) laboratories. ESD pulses are fast, high-voltage pulses created when two objects with different electrical charges come into close proximity or contact. Recreating them in a test environment helps to verify that the device under test is immune to static electricity discharges.
The charged-device model (CDM) is a model for characterizing the susceptibility of an electronic device to damage from electrostatic discharge (ESD). The model is an alternative to the human-body model (HBM).
High Bandwidth Memory (HBM) is a high-speed computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix. It is used in conjunction with high-performance graphics accelerators, network devices, high-performance datacenter AI ASICs and FPGAs and in some supercomputers. The first HBM memory chip was produced by SK Hynix in 2013, and the first devices to use HBM were the AMD Fiji GPUs in 2015.
IEC 61000-4-5 is an international standard by the International Electrotechnical Commission on surge immunity. In an electrical installation, disruptive surges can appear on power and data lines. Their sources include abrupt load switching and faults in the power system, as well as induced lightning transients from an indirect lightning strike. It necessitates the test of surge immunity in electrical or electronic equipment. IEC 61000-4-5 defines test set-up, procedures, and classification levels.
IEC 61000-4-2 is the International Electrotechnical Commission's immunity standard on electrostatic discharge (ESD). The publication is one of the basic EMC standards of the IEC 61000–4 series. The European equivalent of the standard is called EN 61000-4-2. The current version of the IEC standard is the second edition dated 2008-12-09. The basic standards (61000-4) are usually called by product or family specific standards, which use these basic standards as a common reference.
