Thermally Advantaged Chassis

Last updated

A Thermally Advantaged Chassis (TAC) is a computer enclosure that complies with the Thermally Advantaged Chassis specifications created by Intel. It is capable of maintaining an internal ambient temperature below 38 degrees Celsius when functioning with Intel's Pentium 4 and Celeron D processors based on 90 nm process technology, and an ambient temperature below 39 degrees Celsius when using a Pentium D processor. Intel maintains that using a thermally advantaged chassis is the absolute minimum requirement for using Pentium 4 (Prescott), Pentium D, and Celeron D, processors.

Intel American semiconductor company

Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, in the Silicon Valley. It is the world's second largest and second highest valued semiconductor chip manufacturer based on revenue after being overtaken by Samsung, and is the inventor of the x86 series of microprocessors, the processors found in most personal computers (PCs). Intel ranked No. 46 in the 2018 Fortune 500 list of the largest United States corporations by total revenue.

Pentium 4 is a brand by Intel for an entire series of single-core CPUs for desktops, laptops and entry-level servers. The processors were shipped from November 20, 2000, until August 8, 2008.

Celeron is a brand name given by Intel to a number of different low-end IA-32 and x86-64 computer microprocessor models targeted at low-cost personal computers.

Contents

Overview

In the 1.1 version, the TAC design is intended to disallow internal temperature rises of more than 3 degrees Celsius, and provide the processor with a cooler environment to work in. Its main feature is a Chassis Air Guide that directs room temperature air directly in the path of the CPU fan and heat sink. The chassis air guide is a passive cooling system, and relies completely on internal system fans to guide the air.

Chassis Air Guide or CAG in abbreviation, is Intel's thermal system to PC chassis.

Heat sink hardware component

A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature at optimal levels. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.

Computer fan any fan inside, or attached to, a computer case used for active cooling

A computer fan is any fan inside, or attached to, a computer case used for active cooling. Fans are used to draw cooler air into the case from the outside, expel warm air from inside, and move air across a heat sink to cool a particular component. Both axial and sometimes centrifugal (blower/squirrel-cage) fans are used in computers. Computer fans commonly come in standard sizes, and are powered and controlled using 3- or 4-pin fan connectors.

Airflow pattern

As with most computers, the rear fan and power supply fan exhaust, moving hot air away from the computer. This causes a slight depressurization inside the chassis, and requires all other openings to become intake vents. Airflow from the front of the chassis moves around the Chassis Air Guide, allowing the processor fan to only draw air from outside the chassis, providing more effective cooling.

System fans

The rear chassis exhaust fan is required to be at least 92-mm or larger, providing a minimum of 55 CFM in free air. The processor is required to have an active cooling system, consisting of a fan and heat sink.

Side-panel venting

The side-panel is required to have an add-in card vent, which provides room temperature air to the add-in cards. High-performance graphics cards will benefit from the lower temperature air.


Related Research Articles

Pentium III Line of desktop and mobile microprocessors produced by Intel

The Pentium III brand refers to Intel's 32-bit x86 desktop and mobile microprocessors based on the sixth-generation P6 microarchitecture introduced on February 26, 1999. The brand's initial processors were very similar to the earlier Pentium II-branded microprocessors. The most notable differences were the addition of the SSE instruction set, and the introduction of a controversial serial number embedded in the chip during the manufacturing process.

Overclocking action of increasing a components clock rate

Overclocking in the context of computing devices refers to making them "run faster" than originally intended. More specifically it is the configuration of computer hardware components to operate faster than certified by the original manufacturer, with "faster" specified as clock frequency in megahertz (MHz) or gigahertz (GHz). Commonly operating voltage is also increased to maintain a component's operational stability at accelerated speeds. Semiconductor devices operated at higher frequencies and voltages increase power consumption and heat. An overclocked device may be unreliable or fail completely if the additional heat load is not removed or power delivery components cannot meet increased power demands. Many device warranties state that overclocking and/or over-specification voids any warranty.

A quiet PC is a personal computer that makes very little, or no noise. Common uses for quiet PCs include video editing, sound mixing and home theater PCs, but noise reduction techniques can also be used to greatly reduce the noise from servers. There is currently no standard definition for a "quiet PC", and the term is generally not used in a business context, but by individuals and the businesses catering to them.

Socket 370

Socket 370 is a CPU socket first used by Intel for Pentium III and Celeron processors to first complement and later replace the older Slot 1 CPU interface on personal computers. The "370" refers to the number of pin holes in the socket for CPU pins.

Northbridge (computing) chip on a computer motherboard

A northbridge or host bridge is one of the two chips in the core logic chipset architecture on a PC motherboard, the other being the southbridge. Unlike the southbridge, northbridge is connected directly to the CPU via the front-side bus (FSB) and is thus responsible for tasks that require the highest performance. The northbridge is usually paired with a southbridge, also known as I/O controller hub. In systems where they are included, these two chips manage communications between the CPU and other parts of the motherboard, and constitute the core logic chipset of the PC motherboard.

BTX (form factor) form factor for motherboards

BTX is a form factor for motherboards, originally intended to be the replacement for the aging ATX motherboard form factor in late 2004 and early 2005.

Computer cooling

Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipset, graphics cards, and hard disk drives.

LGA 775 Intel desktop CPU socket

LGA 775, also known as Socket T, is an Intel desktop CPU socket. LGA stands for land grid array. Unlike earlier common CPU sockets, such as its predecessor Socket 478, the LGA 775 has no socket holes; instead, it has 775 protruding pins which touch contact points on the underside of the processor (CPU).

Computer case enclosure that contains most of the components of a computer

A computer case, also known as a computer chassis, tower, system unit, CPU, or cabinet, is the enclosure that contains most of the components of a computer.

A wax motor is a linear actuator device that converts thermal energy into mechanical energy by exploiting the phase-change behaviour of waxes. During melting, wax typically expands in volume by 5% to 20%.

Thermal management (electronics)

All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.

TM2, or Thermal Monitoring 2, is a throttling control method used on LGA 775 versions of the Pentium 4, Pentium D and Celeron processors and also on the Pentium M series of processors. TM2 reduces processor temperature by lowering the CPU clock multiplier, and thereby the processor core speed.

Passive cooling is a building design approach that focuses on heat gain control and heat dissipation in a building in order to improve the indoor thermal comfort with low or no energy consumption. This approach works either by preventing heat from entering the interior or by removing heat from the building. Natural cooling utilizes on-site energy, available from the natural environment, combined with the architectural design of building components, rather than mechanical systems to dissipate heat. Therefore, natural cooling depends not only on the architectural design of the building but on how the site's natural resources are used as heat sinks. Examples of on-site heat sinks are the upper atmosphere, the outdoor air (wind), and the earth/soil.

Conroe (microprocessor)

Conroe is the code name for many Intel processors sold as Core 2 Duo, Xeon, Pentium Dual-Core and Celeron. It was the first desktop processor to be based on the Core microarchitecture, replacing the NetBurst microarchitecture based Cedar Mill processor. It has product code 80557, which is shared with Allendale and Conroe-L that are very similar but have a smaller L2 cache. Conroe-L has only one processor core and a new CPUID model. The mobile version of Conroe is Merom, the dual-socket server version is Woodcrest, and the quad-core desktop version is Kentsfield. Conroe was replaced by the 45 nm Wolfdale processor.

An operating temperature is the temperature at which an electrical or mechanical device operates. The device will operate effectively within a specified temperature range which varies based on the device function and application context, and ranges from the minimum operating temperature to the maximum operating temperature. Outside this range of safe operating temperatures the device may fail. Aerospace and military-grade devices generally operate over a broader temperature range than industrial devices; commercial-grade devices generally have the narrowest operating temperature range.

The Dell Inspiron series of laptop computers was introduced in 2000 as a consumer oriented line, available to the general public through electronics and department stores, contrasting to the business/enterprise-oriented Dell Latitude series of laptop computers, and are usually ordered from Dell directly via the website, phone, or mail-order.