A personal computer (PC) is a multi-purpose computer whose size, capabilities, and price make it feasible for individual use. Personal computers are intended to be operated directly by an end user, rather than by a computer expert or technician. Unlike large costly minicomputer and mainframes, time-sharing by many people at the same time is not used with personal computers.
The system includes an air duct for CPU, because in an environment of increasing thermal loads, the processor is generally the most demanding component in terms of system thermal design.
An intake or inlet is an opening on a car or aircraft body capturing air for operation of an internal combustion engine.
An exhaust system is usually piping used to guide reaction exhaust gases away from a controlled combustion inside an engine or stove. The entire system conveys burnt gases from the engine and includes one or more exhaust pipes. Depending on the overall system design, the exhaust gas may flow through one or more of:
Lower chassis temperature brings lower processor die temperature, while most computer enclosures typically provide an internal thermal environment of approximately 40-45°C at a 35°Croom, Intel claims. CAG provides a system to lower processor's thermal environment.
Colloquially, room temperature is the range of air temperatures that most people prefer for indoor settings, which feel comfortable when wearing typical indoor clothing. Human comfort can extend beyond this range depending on humidity, air circulation and other factors. In certain fields, like science and engineering, and within a particular context, room temperature can mean different agreed-on ranges. In contrast, ambient temperature is the actual temperature of the air in any particular place, as measured by a thermometer. It may be very different from usual room temperature, for example an unheated room in winter.
The initial revision known as CAG 1.0 was released on May 2002. The recent version known as CAG 1.1 was then released on September 2003.
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Heating, ventilation, and air conditioning (HVAC) is the technology of indoor and vehicular environmental comfort. Its goal is to provide thermal comfort and acceptable indoor air quality. HVAC system design is a subdiscipline of mechanical engineering, based on the principles of thermodynamics, fluid mechanics and heat transfer. "Refrigeration" is sometimes added to the field's abbreviation, as HVAC&R or HVACR or "ventilation" is dropped, as in HACR.
A heat pump is a device that transfers heat energy from a source of heat to what is called a heat sink. Heat pumps move thermal energy in the opposite direction of spontaneous heat transfer, by absorbing heat from a cold space and releasing it to a warmer one. A heat pump uses a small amount of external power to accomplish the work of transferring energy from the heat source to the heat sink.
The most common design of a heat pump involves four main components – a condenser, an expansion valve, an evaporator and a compressor. The heat transfer medium circulated through these components is called refrigerant.
Pentium 4 is a brand by Intel for an entire series of single-core CPUs for desktops, laptops and entry-level servers. The processors were shipped from November 20, 2000, until August 8, 2008.
Overclocking in the context of computing devices refers to making them "run faster" than originally intended. More specifically it is the configuration of computer hardware components to operate faster than certified by the original manufacturer, with "faster" specified as clock frequency in megahertz (MHz) or gigahertz (GHz). Commonly operating voltage is also increased to maintain a component's operational stability at accelerated speeds. Semiconductor devices operated at higher frequencies and voltages increase power consumption and heat. An overclocked device may be unreliable or fail completely if the additional heat load is not removed or power delivery components cannot meet increased power demands. Many device warranties state that overclocking and/or over-specification voids any warranty.
Heat transfer is a discipline of thermal engineering that concerns the generation, use, conversion, and exchange of thermal energy (heat) between physical systems. Heat transfer is classified into various mechanisms, such as thermal conduction, thermal convection, thermal radiation, and transfer of energy by phase changes. Engineers also consider the transfer of mass of differing chemical species, either cold or hot, to achieve heat transfer. While these mechanisms have distinct characteristics, they often occur simultaneously in the same system.
The Pentium M is a family of mobile 32-bit single-core x86 microprocessors introduced in March 2003 and forming a part of the Intel Carmel notebook platform under the then new Centrino brand. The Pentium M processors had a maximum thermal design power (TDP) of 5–27 W depending on the model, and were intended for use in laptops. They evolved from the core of the last Pentium III–branded CPU by adding the front-side bus (FSB) interface of Pentium 4, an improved instruction decoding and issuing front end, improved branch prediction, SSE2 support, and a much larger cache. The first Pentium M–branded CPU, code-named Banias, was followed by Dothan. The Pentium M-branded processors were succeeded by the Core-branded dual-core mobile Yonah CPU with a modified microarchitecture.
Underclocking, also known as downclocking, is modifying a computer or electronic circuit's timing settings to run at a lower clock rate than is specified. Underclocking is used to reduce a computer's power consumption, increase battery life, reduce heat emission, and it may also increase the system's stability and compatibility. Underclocking may be implemented by the factory, but many computers and components may be underclocked by the end user.
Relative humidity (RH) is the ratio of the partial pressure of water vapor to the equilibrium vapor pressure of water at a given temperature. Relative humidity depends on temperature and the pressure of the system of interest. The same amount of water vapor results in higher relative humidity in cool air than warm air. A related parameter is that of dewpoint.
Xeon is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have some advanced features such as support for ECC memory, higher core counts, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability features responsible for handling hardware exceptions through the Machine Check Architecture. They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the Machine Check Exception. Some also support multi-socket systems with two, four, or eight sockets through use of the Quick Path Interconnect bus.
A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature at optimal levels. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.
Computer cooling is required to remove the waste heat produced by computer components, to keep components within permissible operating temperature limits. Components that are susceptible to temporary malfunction or permanent failure if overheated include integrated circuits such as central processing units (CPUs), chipset, graphics cards, and hard disk drives.
The thermal design power (TDP), sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or component that the cooling system in a computer is designed to dissipate under any workload.
The Pentium D brand refers to two series of desktop dual-core 64-bit x86-64 microprocessors with the NetBurst microarchitecture, which is the dual-core variant of Pentium 4 "Prescott" manufactured by Intel. Each CPU comprised two dies, each containing a single core, residing next to each other on a multi-chip module package. The brand's first processor, codenamed Smithfield, was released by Intel on May 25, 2005. Nine months later, Intel introduced its successor, codenamed Presler, but without offering significant upgrades in design, still resulting in relatively high power consumption. By 2004, the NetBurst processors reached a clock speed barrier at 3.8 GHz due to a thermal limit exemplified by the Presler's 130 watt thermal design power. The future belonged to more energy efficient and slower clocked dual-core CPUs on a single die instead of two. The final shipment date of the dual die Presler chips was August 8, 2008, which marked the end of the Pentium D brand and also the NetBurst microarchitecture.
TM2, or Thermal Monitoring 2, is a throttling control method used on LGA 775 versions of the Pentium 4, Pentium D and Celeron processors and also on the Pentium M series of processors. TM2 reduces processor temperature by lowering the CPU clock multiplier, and thereby the processor core speed.
A Thermally Advantaged Chassis (TAC) is a computer enclosure that complies with the Thermally Advantaged Chassis specifications created by Intel. It is capable of maintaining an internal ambient temperature below 38 degrees Celsius when functioning with Intel's Pentium 4 and Celeron D processors based on 90 nm process technology, and an ambient temperature below 39 degrees Celsius when using a Pentium D processor. Intel maintains that using a thermally advantaged chassis is the absolute minimum requirement for using Pentium 4 (Prescott), Pentium D, and Celeron D, processors.
Passive cooling is a building design approach that focuses on heat gain control and heat dissipation in a building in order to improve the indoor thermal comfort with low or no energy consumption. This approach works either by preventing heat from entering the interior or by removing heat from the building. Natural cooling utilizes on-site energy, available from the natural environment, combined with the architectural design of building components, rather than mechanical systems to dissipate heat. Therefore, natural cooling depends not only on the architectural design of the building but on how the site's natural resources are used as heat sinks. Examples of on-site heat sinks are the upper atmosphere, the outdoor air (wind), and the earth/soil.
Thermal comfort is the condition of mind that expresses satisfaction with the thermal environment and is assessed by subjective evaluation. The human body can be viewed as a heat engine where food is the input energy. The human body will generate excess heat into the environment, so the body can continue to operate. The heat transfer is proportional to temperature difference. In cold environments, the body loses more heat to the environment and in hot environments the body does not exert enough heat. Both the hot and cold scenarios lead to discomfort. Maintaining this standard of thermal comfort for occupants of buildings or other enclosures is one of the important goals of HVAC design engineers. Most people will feel comfortable at room temperature, colloquially a range of temperatures around 20 to 22 °C, but this may vary greatly between individuals and depending on factors such as activity level, clothing, and humidity.
A thermal oxidizer is a process unit for air pollution control in many chemical plants that decomposes hazardous gases at a high temperature and releases them into the atmosphere.
An operating temperature is the temperature at which an electrical or mechanical device operates. The device will operate effectively within a specified temperature range which varies based on the device function and application context, and ranges from the minimum operating temperature to the maximum operating temperature. Outside this range of safe operating temperatures the device may fail. Aerospace and military-grade devices generally operate over a broader temperature range than industrial devices; commercial-grade devices generally have the narrowest operating temperature range.
Underfloor air distribution (UFAD) is an air distribution strategy for providing ventilation and space conditioning in buildings as part of the design of a HVAC system. UFAD systems use an underfloor supply plenum located between the structural concrete slab and a raised floor system to supply conditioned air through floor diffusers directly into the occupied zone of the building. UFAD systems are similar to conventional overhead systems (OH) in terms of the types of equipment used at the cooling and heating plants and primary air-handling units (AHU). Key differences include the use of an underfloor air supply plenum, warmer supply air temperatures, localized air distribution and thermal stratification.Thermal stratification is one of the featured characteristics of UFAD systems, which allows higher thermostat setpoints compared to the traditional overhead systems (OH). UFAD cooling load profile is different from a traditional OH system due to the impact of raised floor, particularly UFAD may have a higher peak cooling load than that of OH systems. This is because heat is gained from building penetrations and gaps within the structure itself.
