Thin Small Outline Package

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An outline drawing of a Type I TSOP with 32 leads TSOP 32 (T1) BW.svg
An outline drawing of a Type I TSOP with 32 leads

Thin Small Outline Package, or TSOP is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm).

Integrated circuit electronic circuit manufactured by lithography; set of electronic circuits on one small flat piece (or "chip") of semiconductor material, normally silicon 639-1 ısoo

An integrated circuit or monolithic integrated circuit is a set of electronic circuits on one small flat piece of semiconductor material that is normally silicon. The integration of large numbers of tiny transistors into a small chip results in circuits that are orders of magnitude smaller, cheaper, and faster than those constructed of discrete electronic components. The IC's mass production capability, reliability and building-block approach to circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs.


They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by ball grid array packages which can achieve even higher densities. The prime application for this technology is memory. SRAM, Flash memory, FSRAM and E2PROM manufacturers find this package well suited to their end-use products. It answers the needs required by telecom, cellular, memory modules, PC Cards (PCMCIA cards), wireless, netbooks and countless other product applications.

Ball grid array

A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.

Flash memory electronic non-volatile computer storage device

Flash memory is an electronic (solid-state) non-volatile computer storage medium that can be electrically erased and reprogrammed.

PC Card

In computing, PC Card is a configuration for computer parallel communication peripheral interface, designed for laptop computers. Originally introduced as PCMCIA, the PC Card standard as well as its successors like CardBus were defined and developed by the Personal Computer Memory Card International Association (PCMCIA).

TSOP is the smallest leaded form factor for flash memory. [1]

Physical properties

TSOP type I: Atmel AT29C010A IBM PCMCIA Data-Fax Modem V.34 FRU 42H4326 - Atmel AT29C010A-9352.jpg
TSOP type I: Atmel AT29C010A

TSOPs are rectangular in shape and come in two varieties: Type I and Type II. Type I ICs have the pins on the shorter side and Type II have the pins on the longer side. The table below shows basic measurements for common TSOP packages. [2]

Type I

Part NumberPinsBody Width/mmBody Length/mmLead Pitch/mm

Type II

Part NumberPinsBody Width/mmBody Length/mmLead Pitch/mm

Similar packages

There are a variety of small form-factor IC carrier available other than TSOPs

See also

Chip carrier one of several kinds of surface mount technology packages for integrated circuits

In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits. Connections are made on all four edges of a square package; Compared to the internal cavity for mounting the integrated circuit, the package overall size is large.

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Dual in-line package

In microelectronics, a dual in-line package, or dual in-line pin package (DIPP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads ; eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density packages. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages.

Surface-mount technology method for producing electronic circuits

Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD). In industry, it has largely replaced the through-hole technology construction method of fitting components with wire leads into holes in the circuit board. Both technologies can be used on the same board, with the through-hole technology used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.

Zig-zag in-line package type of electronic packaging

The zig-zag in-line package or ZIP is a packaging technology for integrated circuits. It was intended as a replacement for dual in-line packaging. A ZIP is an integrated circuit encapsulated in a slab of plastic with 20 or 40 pins, measuring about 3 mm x 30 mm x 10 mm. The package's pins protrude in two rows from one of the long edges. The two rows are staggered by 1.27 mm (0.05"), giving them a zig-zag appearance, and allowing them to be spaced more closely than a rectangular grid would allow. The pins are inserted into holes in a printed circuit board, with the packages standing at right-angles to the board, allowing them to be placed closer together than DIPs of the same size. ZIPs have now been superseded by surface-mount packages such as the thin small-outline packages (TSOPs) but they are still in use.

MultiMediaCard memory card standard used for solid-state storage.

MultiMediaCard, officially abbreviated as MMC, is a memory card standard used for solid-state storage. Unveiled in 1997 by SanDisk and Siemens AG, MMC is based on a surface-contact low pin-count serial interface using a single memory stack substrate assembly, and is therefore much smaller than earlier systems based on high pin-count parallel interfaces using traditional surface-mount assembly such as CompactFlash. Both products were initially introduced using SanDisk NOR-based flash technology. MMC is about the size of a postage stamp: 24 mm × 32 mm × 1.4 mm. MMC originally used a 1-bit serial interface, but newer versions of the specification allow transfers of 4 or 8 bits at a time. MMC can be used in many devices that can use Secure Digital (SD) cards.

Integrated circuit packaging

In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the block of semiconductor material is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board.

Quad Flat Package surface mount integrated circuit package

A QFP or Quad Flat Package is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP).

Lead (electronics) connecting wire or pad within an electronic device; electrical connection consisting of a length of wire or metal pad (SMD) that comes from a device

In electronics, a lead is an electrical connection consisting of a length of wire or a metal pad (SMD) that is designed to connect two locations electrically. Leads are used for many purposes, including: transfer of power; testing of an electrical circuit to see if it is working, using a test light or a multimeter; transmiting information, as when the leads from an electrocardiograph, or ECG are attached to a person's body to transmit information about their heart rhythm; and sometimes to act as a heatsink. The tiny leads coming off through-hole components are also often called pins.

Small Outline Integrated Circuit

A Small Outline Integrated Circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins. For example, a 14-pin 4011 would be housed in an SOIC-14 or SO-14 package.

Multi-chip module

A multi-chip module (MCM) is generically an electronic assembly where multiple integrated circuits, semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it is treated as if it were a single component . Other terms, such as "hybrid" or "hybrid integrated circuit", also refer to MCMs.

DataFlash flash memory

DataFlash is a low pin-count serial interface for flash memory. It was developed as an Atmel proprietary interface, compatible with the SPI standard. In October 2012, the AT45 series DataFlash product lines, related intellectual property, and supporting employee teams were purchased by Adesto Technologies.

Memory module

In computing, a memory module is a printed circuit board on which memory integrated circuits are mounted. Memory modules permit easy installation and replacement in electronic systems, especially computers such as personal computers, workstations, and servers. The first memory modules were proprietary designs that were specific to a model of computer from a specific manufacturer. Later, memory modules were standardized by organizations such as JEDEC and could be used in any system designed to use them.

Through-silicon via

In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.

In microelectronics, a three-dimensional integrated circuit is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. 3D IC is just one of a host of 3D integration schemes that exploit the z-direction to achieve electrical performance benefits.

Flashrom is a universal flash programming utility used to detect, read, verify, erase, or write BIOS chips in dual in-line package (DIP), plastic leaded chip carrier (PLCC), small-outline integrated circuit (SOIC), thin small-outline package (TSOP), or ball grid array (BGA) packages. It supports parallel, Low Pin Count (LPC), FWH, and Serial Peripheral Interface Bus (SPI) flash interfaces. It can be used to flash firmware images such as BIOS or coreboot, or to backup an existing firmware.

A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers before being diced into die, tested, and packaged. The package provides a means for connecting the package to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader. There are thousands of package types in use. Some are defined by international, national, or industry standards, while others are particular to an individual manufacturer.

Quadracs are a special type of thyristor which combines a "diac" and a "triac" in a single package. The diac is the triggering device for the triac. Thyristors are four-layer (PNPN) semiconductor devices that act as switches, rectifiers or voltage regulators in a variety of applications. When triggered, thyristors turn on and become low-resistance current paths. They remain so even after the trigger is removed, and until the current is reduced to a certain level. Diacs are bi-directional diodes that switch AC voltages and trigger triacs or silicon-controlled rectifiers (SCRs). Except for a small leakage current, diacs do not conduct until the breakover voltage is reached. Triacs are three-terminal, silicon devices that function as two SCRs configured in an inverse, parallel arrangement. They provide load current during both halves of the AC supply voltage. By combining the functions of diacs and triacs, quadracs eliminate the need to buy and assemble discrete parts.


  1. Intel. "Small Outline Package Guide". 1999. p. 1-1.
  2. SiliconFarEast: "TSOP - Thin Small Outline Package"