Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips that are present in everyday electronic devices. It is a multiple-step photolithographic and physio-chemical process during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
Taiwan Semiconductor Manufacturing Company Limited is a Taiwanese multinational semiconductor contract manufacturing and design company. It is the world's second most valuable semiconductor company, the world's largest dedicated independent ("pure-play") semiconductor foundry, and its country's largest company, with headquarters and main operations located in the Hsinchu Science Park in Hsinchu, Taiwan. It is majority owned by foreign investors, and the central government of Taiwan is the largest shareholder. In 2023, the company was ranked 44th in the Forbes Global 2000.
Altera Corporation is a manufacturer of programmable logic devices (PLDs) headquartered in San Jose, California. It was founded in 1983 and acquired by Intel in 2015 before becoming independent once again in 2024.
Xilinx, Inc. was an American technology and semiconductor company that primarily supplied programmable logic devices. The company is known for inventing the first commercially viable field-programmable gate array (FPGA). It also created the first fabless manufacturing model.
A fin field-effect transistor (FinFET) is a multigate device, a MOSFET built on a substrate where the gate is placed on two, three, or four sides of the channel or wrapped around the channel, forming a double or even multi gate structure. These devices have been given the generic name "FinFETs" because the source/drain region forms fins on the silicon surface. The FinFET devices have significantly faster switching times and higher current density than planar CMOS technology.
In electronic design, a semiconductor intellectual property core, IP core or IP block is a reusable unit of logic, cell, or integrated circuit layout design that is the intellectual property of one party. IP cores can be licensed to another party or owned and used by a single party. The term comes from the licensing of the patent or source code copyright that exists in the design. Designers of system on chip (SoC), application-specific integrated circuits (ASIC) and systems of field-programmable gate array (FPGA) logic can use IP cores as building blocks.
The "14 nanometer process" refers to a marketing term for the MOSFET technology node that is the successor to the "22 nm" node. The "14 nm" was so named by the International Technology Roadmap for Semiconductors (ITRS). Until about 2011, the node following "22 nm" was expected to be "16 nm". All "14 nm" nodes use FinFET technology, a type of multi-gate MOSFET technology that is a non-planar evolution of planar silicon CMOS technology.
A multigate device, multi-gate MOSFET or multi-gate field-effect transistor (MuGFET) refers to a metal–oxide–semiconductor field-effect transistor (MOSFET) that has more than one gate on a single transistor. The multiple gates may be controlled by a single gate electrode, wherein the multiple gate surfaces act electrically as a single gate, or by independent gate electrodes. A multigate device employing independent gate electrodes is sometimes called a multiple-independent-gate field-effect transistor (MIGFET). The most widely used multi-gate devices are the FinFET and the GAAFET, which are non-planar transistors, or 3D transistors.
In semiconductor fabrication, the International Technology Roadmap for Semiconductors (ITRS) defines the "10 nanometer process" as the MOSFET technology node following the "14 nm" node.
Alchip is a fabless semiconductor company founded in 2003 and headquartered in Taipei, Taiwan. Alchip specializes in the design and manufacture of digital CMOS ASICs.
GlobalFoundries Inc. (GF) is a multinational semiconductor contract manufacturing and design company incorporated in the Cayman Islands and headquartered in Malta, New York. Created by the divestiture of the manufacturing arm of AMD, the company was privately owned by Mubadala Investment Company, a sovereign wealth fund of the United Arab Emirates, until an initial public offering (IPO) in October 2021.
Dolphin Design is a semiconductor design company, founded in 2018 following its acquisition by Soitec. Formerly known as Dolphin Integration, it is based in Meylan in the Grenoble region.
Global Unichip Corporation (GUC) is a worldwide fabless ASIC design service company, with its headquarters located in the Hsinchu Science Park in Hsinchu, Taiwan.
In semiconductor manufacturing, the International Roadmap for Devices and Systems defines the "5 nm" process as the MOSFET technology node following the "7 nm" node. In 2020, Samsung and TSMC entered volume production of "5 nm" chips, manufactured for companies including Apple, Marvell, Huawei and Qualcomm.
In semiconductor manufacturing, the "7 nm" process is a marketing term for the MOSFET technology node following the "10 nm" node, defined by the International Technology Roadmap for Semiconductors. It is based on FinFET technology, a type of multi-gate MOSFET technology.
Achronix Semiconductor Corporation is an American fabless semiconductor company based in Santa Clara, California with an additional R&D facility in Bangalore, India, and an additional sales office in Shenzhen, China. Achronix is a diversified fabless semiconductor company that sells FPGA products, embedded FPGA (eFPGA) products, system-level products and supporting design tools. Achronix was founded in 2004 in Ithaca, New York based on technology licensed from Cornell University. In 2006, Achronix moved its headquarters to Silicon Valley.
High Bandwidth Memory (HBM) is a computer memory interface for 3D-stacked synchronous dynamic random-access memory (SDRAM) initially from Samsung, AMD and SK Hynix. It is used in conjunction with high-performance graphics accelerators, network devices, high-performance datacenter AI ASICs, as on-package cache in CPUs and on-package RAM in upcoming CPUs, and FPGAs and in some supercomputers. The first HBM memory chip was produced by SK Hynix in 2013, and the first devices to use HBM were the AMD Fiji GPUs in 2015.
Inphi Corporation is an American company that produces 10G-800G high-speed analog and mixed-signal semiconductor components and optical subsystems to networking original equipment manufacturers (OEMs), optical module, cloud and telecom service providers. Its headquarters are located in Santa Clara, California. Inphi develops linear transimpedance amplifiers, modulator drivers, optical physical layer devices, coherent DSPs, and silicon photonic-based subsystems for long haul, metro, and data center applications. As of April 20, 2021, the company was acquired by Marvell Technology, Inc.
In semiconductor manufacturing, the "3 nm" process is the next die shrink after the "5 nm" MOSFET technology node. South Korean chipmaker Samsung started shipping its "3 nm" gate all around (GAA) process, named "3GAA", in mid-2022. On 29 December 2022, Taiwanese chip manufacturer TSMC announced that volume production using its "3 nm" semiconductor node ("N3") was under way with good yields. An enhanced "3 nm" chip process called "N3E" may have started production in 2023. American manufacturer Intel planned to start 3 nm production in 2023.
In semiconductor manufacturing, the "2 nm process" is the next MOSFET die shrink after the "3 nm" process node.
