BT-Epoxy

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BT-Epoxy (BT short for Bismaleimide-Triazine resin) is one of a number of thermoset resins used in printed circuit boards (PCBs). It is a mixture of epoxy resin, a common raw material for PCBs and BT resins. This is in turn a mixture of bismaleimide, which is also used as a raw material for PCBs and cyanate ester. Three cyano groups of the cyanate ester are trimerized to a triazine ring structure, hence the T in the name. In presence of a bismaleimide, the double bond of the maleimide group can copolymerize with the cyano groups to heterocyclic 6-membered aromatic ring structures with two nitrogen atoms (pyrimidines). The cure reaction occurs at temperatures up to 250 °C (482 °F), and is catalyzed by strongly basic molecules like Dabco (diazabicyclooctane) and 4-DMAP (4-dimethylaminopyridine). Products with very high glass transition temperatures (Tg) up to 300 °C (572 °F) and very low dielectric constant can be obtained. These properties make these materials very attractive for use in PCBs, which are often subjected to such conditions. [1] [2]

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References

  1. Ren, Yumei; Yang, Shuai; Xu, Yuxi (2025-02-04). "Crystalline Covalent Triazine Frameworks and 2D Triazine Polymers: Synthesis and Applications". Accounts of Chemical Research. 58 (3): 474–487. doi:10.1021/acs.accounts.4c00729. ISSN   0001-4842.
  2. Tain, Ra-Min; Wang, Chi-Chuan (2019-05-01). "Thermal Material for PCB Substrate and Its Measurement Method". Journal of The Japan Institute of Electronics Packaging. 22 (3): 205–208. doi:10.5104/jiep.22.205. ISSN   1343-9677.