Bumpless Build-up Layer or BBUL is a processor packaging technology developed by Intel. It is bumpless, because it does not use the usual tiny solder bumps to attach the silicon die to the processor package wires. It has build-up layers, because is grown or built up around the silicon die. The usual way is to manufacture them separately and bond them together.
A central processing unit (CPU), also called a central processor or main processor, is the electronic circuitry within a computer that carries out the instructions of a computer program by performing the basic arithmetic, logic, controlling, and input/output (I/O) operations specified by the instructions. The computer industry has used the term "central processing unit" at least since the early 1960s. Traditionally, the term "CPU" refers to a processor, more specifically to its processing unit and control unit (CU), distinguishing these core elements of a computer from external components such as main memory and I/O circuitry.
Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California, in the Silicon Valley. It is the world's second largest and second highest valued semiconductor chip manufacturer based on revenue after being overtaken by Samsung Electronics, and is the inventor of the x86 series of microprocessors, the processors found in most personal computers (PCs). Intel ranked No. 46 in the 2018 Fortune 500 list of the largest United States corporations by total revenue.
Solder is a fusible metal alloy used to create a permanent bond between metal workpieces. The word solder comes from the Middle English word soudur, via Old French solduree and soulder, from the Latin solidare, meaning "to make solid". In fact, solder must first be melted in order to adhere to and connect the pieces together after cooling, which requires that an alloy suitable for use as solder have a lower melting point than the pieces being joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.
It was presented in October 2001. It should have been a key component in the 8 GHz and 15 GHz processors that should have been in the market by 2005 and 2007 respectively. [1] Also 20 GHz should have been possible before the year 2010.[ citation needed ] The BBUL is not needed yet[ when? ] because there is no longer the clock-frequency competition.
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Dept., Utica, N.Y. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry, it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and wires are used to interconnect the chip pads to external circuitry.
Athlon is the brand name applied to a series of x86-compatible microprocessors designed and manufactured by Advanced Micro Devices (AMD). The original Athlon was the first seventh-generation x86 processor and was the first desktop processor to reach speeds of one gigahertz (GHz). It made its debut on June 23, 1999.
An integrated circuit or monolithic integrated circuit is a set of electronic circuits on one small flat piece of semiconductor material that is normally silicon. The integration of large numbers of tiny transistors into a small chip results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs.
Semiconductor device fabrication is the process used to create the integrated circuits that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photolithographic and chemical processing steps during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
An EPROM, or erasable programmable read-only memory, is a type of memory chip that retains its data when its power supply is switched off. Computer memory that can retrieve stored data after a power supply has been turned off and back on is called non-volatile. It is an array of floating-gate transistors individually programmed by an electronic device that supplies higher voltages than those normally used in digital circuits. Once programmed, an EPROM can be erased by exposing it to strong ultraviolet light source. EPROMs are easily recognizable by the transparent fused quartz window in the top of the package, through which the silicon chip is visible, and which permits exposure to ultraviolet light during erasing.
Celeron is a brand name given by Intel to a number of different low-end IA-32 and x86-64 computer microprocessor models targeted at low-cost personal computers.
Pentium 4 is a brand by Intel for an entire series of single-core CPUs for desktops, laptops and entry-level servers. The processors were shipped from November 20, 2000, until August 8, 2008.
The Pentium III brand refers to Intel's 32-bit x86 desktop and mobile microprocessors based on the sixth-generation P6 microarchitecture introduced on February 26, 1999. The brand's initial processors were very similar to the earlier Pentium II-branded microprocessors. The most notable differences were the addition of the SSE instruction set, and the introduction of a controversial serial number embedded in the chip during the manufacturing process.
The Pentium M is a family of mobile 32-bit single-core x86 microprocessors introduced in March 2003 and forming a part of the Intel Carmel notebook platform under the then new Centrino brand. The Pentium M processors had a maximum thermal design power (TDP) of 5–27 W depending on the model, and were intended for use in laptops. They evolved from the core of the last Pentium III–branded CPU by adding the front-side bus (FSB) interface of Pentium 4, an improved instruction decoding and issuing front end, improved branch prediction, SSE2 support, and a much larger cache. The first Pentium M–branded CPU, code-named Banias, was followed by Dothan. The Pentium M-branded processors were succeeded by the Core-branded dual-core mobile Yonah CPU with a modified microarchitecture.
Tejas was a code name for Intel's microprocessor, which was to be a successor to the latest Pentium 4 with the Prescott core and was sometimes referred to as Pentium V. Jayhawk was a code name for its Xeon counterpart. The cancellation of the processors in May 2004 underscored Intel's historical transition of its focus on single-core processors to multi-core processors.
A pin grid array, often abbreviated PGA, is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package.
Xeon is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have some advanced features such as support for ECC memory, higher core counts, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability features responsible for handling hardware exceptions through the Machine Check Architecture. They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the Machine Check Exception. Some also support multi-socket systems with two, four, or eight sockets through use of the Quick Path Interconnect bus.
Montecito is the code-name of a major release of Intel's Itanium 2 Processor Family (IPF), which implements the Intel Itanium architecture on a dual-core processor. It was officially launched by Intel on July 18, 2006 as the "Dual-Core Intel Itanium 2 processor". According to Intel, Montecito doubles performance versus the previous, single-core Itanium 2 processor, and reduces power consumption by about 20%. It also adds multi-threading capabilities, a greatly expanded cache subsystem, and silicon support for virtualization.
SGI Visual Workstation is a series of workstation computers that are designed and manufactured by SGI. Unlike its other product lines, which used the 64-bit MIPS RISC architecture, the line used Intel Pentium II and III processors and shipped with Windows NT 4.0 or Windows 2000 as its operating system in lieu of IRIX. However, the Visual Workstation 320 and 540 models deviated from the architecture of IBM-compatible PCs by using SGI's ARCS firmware instead of a traditional BIOS, internal components adapted from its MIPS-based products, and other proprietary components that made them incompatible with internal hardware designed for standard PCs and hence unable to run other versions of Microsoft Windows, especially Windows 9x. By contrast, the remaining models in the line are standard PCs, using VIA Technologies chipsets, Nvidia video cards, and standard components.
The Pentium D brand refers to two series of desktop dual-core 64-bit x86-64 microprocessors with the NetBurst microarchitecture, which is the dual-core variant of Pentium 4 "Prescott" manufactured by Intel. Each CPU comprised two dies glued together, each containing a single core, residing next to each other on a multi-chip module package. The brand's first processor, codenamed Smithfield, was released by Intel on May 25, 2005. Nine months later, Intel introduced its successor, codenamed Presler, but without offering significant upgrades in design, still resulting in relatively high power consumption. By 2004, the NetBurst processors reached a clock speed barrier at 3.8 GHz due to a thermal limit exemplified by the Presler's 130 watt thermal design power. The future belonged to more energy efficient and slower clocked dual-core CPUs on a single die instead of two. The final shipment date of the dual die Presler chips was August 8, 2008, which marked the end of the Pentium D brand and also the NetBurst microarchitecture.
The Intel QuickPath Interconnect (QPI) is a point-to-point processor interconnect developed by Intel which replaced the front-side bus (FSB) in Xeon, Itanium, and certain desktop platforms starting in 2008. It increased the scalability and bandwidth available. Prior to the name's announcement, Intel referred to it as Common System Interface (CSI). Earlier incarnations were known as Yet Another Protocol (YAP) and YAP+.
In microelectronics, a three-dimensional integrated circuit is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. 3D IC is just one of a host of 3D integration schemes that exploit the z-direction to achieve electrical performance benefits.
The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. The diameter of a thermal bump is 238 μm and 60 μm high.
The UltraSPARC III, code-named "Cheetah", is a microprocessor that implements the SPARC V9 instruction set architecture (ISA) developed by Sun Microsystems and fabricated by Texas Instruments. It was introduced in 2001 and operates at 600 to 900 MHz. It was succeeded by the UltraSPARC IV in 2004. Gary Lauterbach was the chief architect.
Intel Core is a line of mid- to high-end consumer, workstation, and enthusiast central processing units (CPU) marketed by Intel Corporation. These processors displaced the existing mid- to high-end Pentium processors of the time, moving the Pentium to the entry level, and bumping the Celeron series of processors to the low end. Identical or more capable versions of Core processors are also sold as Xeon processors for the server and workstation markets.
![]() | This microcomputer- or microprocessor-related article is a stub. You can help Wikipedia by expanding it. |