Chalcogenide chemical vapor deposition is a proposed technology for depositing thin films of chalcogenides, i.e. materials derived from sulfides, selenides, and tellurides. Conventional CVD can be used to deposit films of most metals, many non-metallic elements (notably silicon) as well as a wide range of compounds including carbides, nitrides, oxides. CVD can also be used to synthesize chalcogenide glasses. [1]
The fabrication of chalcogenide thin films is a topic of research. [2] For example, routes to germanium disulfide films could entail germanium chloride and hydrogen sulphide:
Alternatively via plasma enhanced CVD there is the reaction GeH4/H2S. [3] [4]
Phase change random access memory (PCRAM) has attracted considerable interest as a candidate for non-volatile devices for higher density and operation speed. [6] [7] The ternary Ge2Sb2Te5 (GST) compound is widely regarded as the most viable and practical phase change family of materials for this application. [8] CVD techniques have been applied to deposit GST materials in sub micron cell pores. [9] Challenges include the need to control device to device variability and undesirable changes in the phase change material that can be induced by the fabrication procedure. A confined cell structure where the phase change material is formed inside a contact via is expected to be essential for the next generation PCRAM device because it requires lower switching power. [10] This structure however requires more complex deposition of the active chalcogenide into a cell pore. CVD techniques could provide better performance and enable the production of thin films with superior quality compared to those obtained by sputtering, especially in terms of conformality, coverage, and stoichiometry control, and allows implementation of phase-change films in nanoelectronic devices. In addition, CVD deposition is well known to provide higher purity materials and provides the scope for new phase change materials with optimized properties to be deposited.
The CVD apparatus for Ge-Sb-Te thin film deposition is shown schematically to the right.
Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high-quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films.
Germanium is a chemical element; it has symbol Ge and atomic number 32. It is lustrous, hard-brittle, grayish-white and similar in appearance to silicon. It is a metalloid in the carbon group that is chemically similar to its group neighbors silicon and tin. Like silicon, germanium naturally reacts and forms complexes with oxygen in nature.
SiGe, or silicon–germanium, is an alloy with any molar ratio of silicon and germanium, i.e. with a molecular formula of the form Si1−xGex. It is commonly used as a semiconductor material in integrated circuits (ICs) for heterojunction bipolar transistors or as a strain-inducing layer for CMOS transistors. IBM introduced the technology into mainstream manufacturing in 1989. This relatively new technology offers opportunities in mixed-signal circuit and analog circuit IC design and manufacture. SiGe is also used as a thermoelectric material for high-temperature applications (>700 K).
Phase-change memory is a type of non-volatile random-access memory. PRAMs exploit the unique behaviour of chalcogenide glass. In PCM, heat produced by the passage of an electric current through a heating element generally made of titanium nitride is used to either quickly heat and quench the glass, making it amorphous, or to hold it in its crystallization temperature range for some time, thereby switching it to a crystalline state. PCM also has the ability to achieve a number of distinct intermediary states, thereby having the ability to hold multiple bits in a single cell, but the difficulties in programming cells in this way has prevented these capabilities from being implemented in other technologies with the same capability.
Chalcogenide glass is a glass containing one or more heavy chalcogens. Chalcogenide materials behave rather differently from oxides, in particular their lower band gaps contribute to very dissimilar optical and electrical properties.
Indium gallium arsenide (InGaAs) is a ternary alloy of indium arsenide (InAs) and gallium arsenide (GaAs). Indium and gallium are group III elements of the periodic table while arsenic is a group V element. Alloys made of these chemical groups are referred to as "III-V" compounds. InGaAs has properties intermediate between those of GaAs and InAs. InGaAs is a room-temperature semiconductor with applications in electronics and photonics.
Atomic layer deposition (ALD) is a thin-film deposition technique based on the sequential use of a gas-phase chemical process; it is a subclass of chemical vapour deposition. The majority of ALD reactions use two chemicals called precursors. These precursors react with the surface of a material one at a time in a sequential, self-limiting, manner. A thin film is slowly deposited through repeated exposure to separate precursors. ALD is a key process in fabricating semiconductor devices, and part of the set of tools for synthesizing nanomaterials.
GeSbTe (germanium-antimony-tellurium or GST) is a phase-change material from the group of chalcogenide glasses used in rewritable optical discs and phase-change memory applications. Its recrystallization time is 20 nanoseconds, allowing bitrates of up to 35 Mbit/s to be written and direct overwrite capability up to 106 cycles. It is suitable for land-groove recording formats. It is often used in rewritable DVDs. New phase-change memories are possible using n-doped GeSbTe semiconductor. The melting point of the alloy is about 600 °C (900 K) and the crystallization temperature is between 100 and 150 °C.
Germanium telluride (GeTe) is a chemical compound of germanium and tellurium and is a component of chalcogenide glass. It shows semimetallic conduction and ferroelectric behaviour.
Isobutylgermane (IBGe, Chemical formula: (CH3)2CHCH2GeH3, is an organogermanium compound. It is a colourless, volatile liquid that is used in MOVPE (Metalorganic Vapor Phase Epitaxy) as an alternative to germane. IBGe is used in the deposition of Ge films and Ge-containing thin semiconductor films such as SiGe in strained silicon application, and GeSbTe in NAND Flash applications.
A copper indium gallium selenide solar cell is a thin-film solar cell used to convert sunlight into electric power. It is manufactured by depositing a thin layer of copper indium gallium selenide solid solution on glass or plastic backing, along with electrodes on the front and back to collect current. Because the material has a high absorption coefficient and strongly absorbs sunlight, a much thinner film is required than of other semiconductor materials.
Chemical vapor deposition of ruthenium is a method to deposit thin layers of ruthenium on substrates by Chemical vapor deposition (CVD).
Tantalum(V) ethoxide is a metalorganic compound with formula Ta2(OC2H5)10, often abbreviated as Ta2(OEt)10. It is a colorless solid that dissolves in some organic solvents but hydrolyzes readily. It is used to prepare films of tantalum(V) oxide.
Gallium lanthanum sulfide glass is the name of a family of chalcogenide glasses, referred to as gallium lanthanum sulfide (Ga-La-S) glasses. They are mixtures of La2S3, La2O3, and Ga2S3, which form the basic glass with other glass modifiers added as needed. Gallium-lanthanum-sulfide glasses have a wide range of vitreous formation centered around a 70% Ga2S3 : 30% La2S3 mixture, and readily accept other modifier materials into their structure. This means that Ga-La-S composition can be adjusted to give a wide variety of optical and physical properties.
Tungsten diselenide is an inorganic compound with the formula WSe2. The compound adopts a hexagonal crystalline structure similar to molybdenum disulfide. The tungsten atoms are covalently bonded to six selenium ligands in a trigonal prismatic coordination sphere while each selenium is bonded to three tungsten atoms in a pyramidal geometry. The tungsten–selenium bond has a length of 0.2526 nm, and the distance between selenium atoms is 0.334 nm. It is a well studied example of a layered material. The layers stack together via van der Waals interactions. WSe2 is a very stable semiconductor in the group-VI transition metal dichalcogenides.
A two-dimensional semiconductor is a type of natural semiconductor with thicknesses on the atomic scale. Geim and Novoselov et al. initiated the field in 2004 when they reported a new semiconducting material graphene, a flat monolayer of carbon atoms arranged in a 2D honeycomb lattice. A 2D monolayer semiconductor is significant because it exhibits stronger piezoelectric coupling than traditionally employed bulk forms. This coupling could enable applications. One research focus is on designing nanoelectronic components by the use of graphene as electrical conductor, hexagonal boron nitride as electrical insulator, and a transition metal dichalcogenide as semiconductor.
A rapidly increasing list of graphene production techniques have been developed to enable graphene's use in commercial applications.
Molecular layer deposition (MLD) is a vapour phase thin film deposition technique based on self-limiting surface reactions carried out in a sequential manner. Essentially, MLD resembles the well established technique of atomic layer deposition (ALD) but, whereas ALD is limited to exclusively inorganic coatings, the precursor chemistry in MLD can use small, bifunctional organic molecules as well. This enables, as well as the growth of organic layers in a process similar to polymerization, the linking of both types of building blocks together in a controlled way to build up organic-inorganic hybrid materials.
Low-energy plasma-enhanced chemical vapor deposition (LEPECVD) is a plasma-enhanced chemical vapor deposition technique used for the epitaxial deposition of thin semiconductor films. A remote low energy, high density DC argon plasma is employed to efficiently decompose the gas phase precursors while leaving the epitaxial layer undamaged, resulting in high quality epilayers and high deposition rates.
Beta-tungsten (β-W) is a metastable phase of tungsten widely observed in tungsten thin films. While the commonly existing stable alpha-tungsten (α-W) has a body-centered cubic (A2) structure, β-W adopts the topologically close-packed A15 structure containing eight atoms per unit cell, and it irreversibly transforms to the stable α phase through thermal annealing of up to 650 °C. It has been found that β-W possesses the giant spin Hall effect, wherein the applied charge current generates a transverse spin current, and this leads to potential applications in magnetoresistive random access memory devices.