Gold plating is the act of depositing a thin layer of gold on the surface of other metals in the modern electronics industry
Gold plating may also refer to:
Electroplating, also known as electrochemical deposition or electrodeposition, is a process for producing a metal coating on a solid substrate through the reduction of cations of that metal by means of a direct electric current. The part to be coated acts as the cathode of an electrolytic cell; the electrolyte is a solution of a salt of the metal to be coated; and the anode is usually either a block of that metal, or of some inert conductive material. The current is provided by an external power supply.
Gilding is a decorative technique for applying a very thin coating of gold over solid surfaces such as metal, wood, porcelain, or stone. A gilded object is also described as "gilt". Where metal is gilded, the metal below was traditionally silver in the West, to make silver-gilt objects, but gilt-bronze is commonly used in China, and also called ormolu if it is Western. Methods of gilding include hand application and gluing, typically of gold leaf, chemical gilding, and electroplating, the last also called gold plating. Parcel-gilt objects are only gilded over part of their surfaces. This may mean that all of the inside, and none of the outside, of a chalice or similar vessel is gilded, or that patterns or images are made up by using a combination of gilt and ungilted areas.
Patina is a thin layer that variously forms on the surface of copper, brass, bronze, and similar metals and metal alloys, or certain stones and wooden furniture, or any similar acquired change of a surface through age and exposure.
Chrome plating is a technique of electroplating a thin layer of chromium onto a metal object. A chrome plated part is called chrome, or is said to have been chromed. The chromium layer can be decorative, provide corrosion resistance, facilitate cleaning, or increase surface hardness. Sometimes, a less expensive substitute for chrome such as nickel may be used for aesthetic purposes.
A thin film is a layer of material ranging from fractions of a nanometer (monolayer) to several micrometers in thickness. The controlled synthesis of materials as thin films is a fundamental step in many applications. A familiar example is the household mirror, which typically has a thin metal coating on the back of a sheet of glass to form a reflective interface. The process of silvering was once commonly used to produce mirrors, while more recently the metal layer is deposited using techniques such as sputtering. Advances in thin film deposition techniques during the 20th century have enabled a wide range of technological breakthroughs in areas such as magnetic recording media, electronic semiconductor devices, integrated passive devices, LEDs, optical coatings, hard coatings on cutting tools, and for both energy generation and storage. It is also being applied to pharmaceuticals, via thin-film drug delivery. A stack of thin films is called a multilayer.
Stratigraphy is a key concept to modern archaeological theory and practice. Modern excavation techniques are based on stratigraphic principles. The concept derives from the geological use of the idea that sedimentation takes place according to uniform principles. When archaeological finds are below the surface of the ground, the identification of the context of each find is vital in enabling the archaeologist to draw conclusions about the site and about the nature and date of its occupation. It is the archaeologist's role to attempt to discover what contexts exist and how they came to be created. Archaeological stratification or sequence is the dynamic superimposition of single units of stratigraphy, or contexts.
Plating is a finishing process in which a metal is deposited on a surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for radiation shielding, and for other purposes. Jewelry typically uses plating to give a silver or gold finish.
Copper electroplating is the process of electroplating a layer of copper onto the surface of a metal object. Copper is used both as a standalone coating and as an undercoat onto which other metals are subsequently plated. The copper layer can be decorative, provide corrosion resistance, increase electrical and thermal conductivity, or improve the adhesion of additional deposits to the substrate.
Gold plating is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver, by chemical or electrochemical plating. This article covers plating methods used in the modern electronics industry; for more traditional methods, often used for much larger objects, see gilding.
Metallizing is the general name for the technique of coating metal on the surface of objects. Metallic coatings may be decorative, protective or functional.
Silvering is the chemical process of coating a non-conductive substrate such as glass with a reflective substance, to produce a mirror. While the metal is often silver, the term is used for the application of any reflective metal.
A diffusion barrier is a thin layer of metal usually placed between two other metals. It is done to act as a barrier to protect either one of the metals from corrupting the other.
Electroless nickel-phosphorus plating, also referred to as E-nickel, is a chemical process that deposits an even layer of nickel-phosphorus alloy on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing nickel salt and a phosphorus-containing reducing agent, usually a hypophosphite salt. It is the most common version of electroless nickel plating and is often referred by that name. A similar process uses a borohydride reducing agent, yielding a nickel-boron coating instead.
Vacuum deposition is a group of processes used to deposit layers of material atom-by-atom or molecule-by-molecule on a solid surface. These processes operate at pressures well below atmospheric pressure. The deposited layers can range from a thickness of one atom up to millimeters, forming freestanding structures. Multiple layers of different materials can be used, for example to form optical coatings. The process can be qualified based on the vapor source; physical vapor deposition uses a liquid or solid source and chemical vapor deposition uses a chemical vapor.
Substrate is a term used in materials science and engineering to describe the base material on which processing is conducted. Surfaces have different uses, including producing new film or layers of material and being a base to which another substance is bonded.
Electrogalvanizing is a process in which a layer of zinc is bonded to steel in order to protect against corrosion. The process involves electroplating, running a current of electricity through a saline/zinc solution with a zinc anode and steel conductor. Such Zinc electroplating or Zinc alloy electroplating maintains a dominant position among other electroplating process options, based upon electroplated tonnage per annum. According to the International Zinc Association, more than 5 million tons are used yearly for both hot dip galvanizing and electroplating. The plating of zinc was developed at the beginning of the 20th century. At that time, the electrolyte was cyanide based. A significant innovation occurred in the 1960s, with the introduction of the first acid chloride based electrolyte. The 1980s saw a return to alkaline electrolytes, only this time, without the use of cyanide. The most commonly used electrogalvanized cold rolled steel is SECC, acronym of "Steel, Electrogalvanized, Cold-rolled, Commercial quality". Compared to hot dip galvanizing, electroplated zinc offers these significant advantages:
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes. It consists of an electroless nickel plating, covered with a thin layer of gold, which protects the nickel from oxidation. The gold is typically applied by quick immersion in a solution containing gold salts. Some of the nickel is oxidized to Ni2+ while the gold is reduced to metallic state. A variant of this process adds a thin layer of electroless palladium over the nickel, a process known by the acronym ENEPIG.
Colored gold is the name given to any gold that has been treated using techniques to change its natural color. Pure gold is slightly reddish yellow in color, but colored gold can come in a variety of different colors by alloying it with different elements.
Nickel plating may refer to:
Nickel electroplating is a technique of electroplating a thin layer of nickel onto a metal object. The nickel layer can be decorative, provide corrosion resistance, wear resistance, or used to build up worn or undersized parts for salvage purposes.