Solder is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.
Electroplating, also known as electrochemical deposition or electrodeposition, is a process for producing a metal coating on a solid substrate through the reduction of cations of that metal by means of a direct electric current. The part to be coated acts as the cathode of an electrolytic cell; the electrolyte is a solution of a salt of the metal to be coated, and the anode is usually either a block of that metal, or of some inert conductive material. The current is provided by an external power supply.
A printed circuit board (PCB), also called printed wiring board (PWB), is a medium used to connect or "wire" components to one another in a circuit. It takes the form of a laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with a pattern of traces, planes and other features etched from one or more sheet layers of copper laminated onto or between sheet layers of a non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers, generally by means of soldering, which both electrically connects and mechanically fastens the components to the board. Another manufacturing process adds vias, drilled holes that allow electrical interconnections between conductive layers.
Brazing is a metal-joining process in which two or more metal items are joined by melting and flowing a filler metal into the joint, with the filler metal having a lower melting point than the adjoining metal.
Anodizing is an electrolytic passivation process used to increase the thickness of the natural oxide layer on the surface of metal parts.
Plating is a finishing process in which a metal is deposited on a surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for radiation shielding, and for other purposes. Jewelry typically uses plating to give a silver or gold finish.
Copper electroplating is the process of electroplating a layer of copper onto the surface of a metal object. Copper is used both as a standalone coating and as an undercoat onto which other metals are subsequently plated. The copper layer can be decorative, provide corrosion resistance, increase electrical and thermal conductivity, or improve the adhesion of additional deposits to the substrate.
Metallizing is the general name for the technique of coating metal on the surface of objects. Metallic coatings may be decorative, protective or functional.
Electroless deposition (ED) or electroless plating is defined as the autocatalytic process through which metals and metal alloys are deposited onto conductive and nonconductive surfaces. These nonconductive surfaces include plastics, ceramics, and glass etc., which can then become decorative, anti-corrosive, and conductive depending on their final functions. Electroplating, unlike electroless deposition, only deposits on other conductive or semi-conductive materials when an external current is applied. Electroless deposition deposits metals onto 2D and 3D structures such as screws, nanofibers, and carbon nanotubes, unlike other plating methods such as Physical Vapor Deposition ( PVD), Chemical Vapor Deposition (CVD), and electroplating, which are limited to 2D surfaces. Commonly the surface of the substrate is characterized via pXRD, SEM-EDS, and XPS which relay set parameters based their final funtionality. These parameters are referred to a Key Performance Indicators crucial for a researcher’ or company's purpose. Electroless deposition continues to rise in importance within the microelectronic industry, oil and gas, and aerospace industry.
Electroless nickel-phosphorus plating, also referred to as E-nickel, is a chemical process that deposits an even layer of nickel-phosphorus alloy on the surface of a solid substrate, like metal or plastic. The process involves dipping the substrate in a water solution containing nickel salt and a phosphorus-containing reducing agent, usually a hypophosphite salt. It is the most common version of electroless nickel plating and is often referred by that name. A similar process uses a borohydride reducing agent, yielding a nickel-boron coating instead.
Electrogalvanizing is a process in which a layer of zinc is bonded to steel in order to protect against corrosion. The process involves electroplating, running a current of electricity through a saline/zinc solution with a zinc anode and steel conductor. Such Zinc electroplating or Zinc alloy electroplating maintains a dominant position among other electroplating process options, based upon electroplated tonnage per annum. According to the International Zinc Association, more than 5 million tons are used yearly for both hot dip galvanizing and electroplating. The plating of zinc was developed at the beginning of the 20th century. At that time, the electrolyte was cyanide based. A significant innovation occurred in the 1960s, with the introduction of the first acid chloride based electrolyte. The 1980s saw a return to alkaline electrolytes, only this time, without the use of cyanide. The most commonly used electrogalvanized cold rolled steel is SECC, acronym of "Steel, Electrogalvanized, Cold-rolled, Commercial quality". Compared to hot dip galvanizing, electroplated zinc offers these significant advantages:
Glass-to-metal seals are a type of mechanical seal which joins glass and metal surfaces. They are very important elements in the construction of vacuum tubes, electric discharge tubes, incandescent light bulbs, glass-encapsulated semiconductor diodes, reed switches, glass windows in metal cases, and metal or ceramic packages of electronic components.
Electroless nickel immersion gold (ENIG or ENi/IAu), also known as immersion gold (Au), chemical Ni/Au or soft gold, is a metal plating process used in the manufacture of printed circuit boards (PCBs), to avoid oxidation and improve the solderability of copper contacts and plated through-holes. It consists of an electroless nickel plating, covered with a thin layer of gold, which protects the nickel from oxidation. The gold is typically applied by quick immersion in a solution containing gold salts. Some of the nickel is oxidized to Ni2+ while the gold is reduced to metallic state. A variant of this process adds a thin layer of electroless palladium over the nickel, a process known by the acronym ENEPIG.
Organic solderability preservative or OSP is a method for coating of printed circuit boards. It uses a water-based organic compound that selectively bonds to copper and protects the copper until soldering.
Colored gold is the name given to any gold that has been treated using techniques to change its natural color. Pure gold is slightly reddish yellow in color, but colored gold can come in a variety of different colors by alloying it with different elements.
Reactive multi-layer foils are a class of reactive materials, sometimes referred to as a pyrotechnic initiator of two mutually reactive metals, sputtered to form thin layers that create a laminated foil. On initiation by a heat pulse, delivered by a bridge wire, a laser pulse, an electric spark, a flame, or by other means, the metals undergo self-sustaining exothermic reaction, producing an intermetallic compound. The reaction occurs in solid and liquid phase only, without releasing any gas.
Nickel electroplating is a technique of electroplating a thin layer of nickel onto a metal object. The nickel layer can be decorative, provide corrosion resistance, wear resistance, or used to build up worn or undersized parts for salvage purposes.
Materials for use in vacuum are materials that show very low rates of outgassing in vacuum and, where applicable, are tolerant to bake-out temperatures. The requirements grow increasingly stringent with the desired degree of vacuum to be achieved in the vacuum chamber. The materials can produce gas by several mechanisms. Molecules of gases and water can be adsorbed on the material surface. Materials may sublimate in vacuum. Or the gases can be released from porous materials or from cracks and crevices. Traces of lubricants, residues from machining, can be present on the surfaces. A specific risk is outgassing of solvents absorbed in plastics after cleaning.
Immersion zinc plating is an electroless (non-electrolytic) coating process that deposits a thin layer of zinc on a less electronegative metal, by immersion in a solution containing a zinc or zincate ions, Zn(OH)2−
4. A typical use is plating aluminum with zinc prior to electrolytic or electroless nickel plating.
