Teardrop (electronics)

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Teardrops and trace necking as seen in a PCB layout design tool Topor teardrops.gif
Teardrops and trace necking as seen in a PCB layout design tool
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Teardrop vias on printed circuit boards

A teardrop is typically drop-shaped feature on a printed circuit board and can be found on the junction of vias or contact pads.

Contents

Purpose

The main purpose of teardrops is to enhance structural integrity in presence of thermal or mechanical stresses, [1] [2] [3] for example due to vibration or flexing. [4] Structural integrity may be compromised, e.g., by misalignment during drilling, so that too much copper may be removed by the drill hole in the area where a trace connects to the pad or via. [2] [3] [5] An extra advantage is the enlarging of manufacturing tolerances, making manufacturing easier and cheaper. [3]

Shape

While a typical shape of a teardrop is straight-line tapering, they may be concave. [2] This type of teardrop is also called filleting or straight. [3] To produce a snowman -shaped teardrop, a secondary pad of smaller size is added at the junction overlapping with the primary pad (hence the nickname). [3] [6]

Necking

For similar reasons, a technique called trace necking reduces (or necks down [7] [8] [9] ) the width of a trace that approaches a narrower pad of a surface-mounted device or a through-hole with a diameter that is less than the width of the trace, or when the trace passes through bottlenecks (for example, between the pads of a component). [8] [9] [10] [11]

Related Research Articles

<span class="mw-page-title-main">Printed circuit board</span> Board to support and connect electronic components

A printed circuit board (PCB), also called printed wiring board (PWB), is a medium used to connect or "wire" components to one another in a circuit. It takes the form of a laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with an artwork pattern of traces, planes and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds vias, plated-through holes that allow interconnections between layers.

<span class="mw-page-title-main">Surface-mount technology</span> Method for producing electronic circuits

Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.

<span class="mw-page-title-main">Gerber format</span> Standard file format used for designing printed circuit boards

The Gerber format is an open, ASCII, vector format for printed circuit board (PCB) designs. It is the de facto standard used by PCB industry software to describe the printed circuit board images: copper layers, solder mask, legend, drill data, etc. The standard file extension is .GBR or .gbr though other extensions like .GB, .geb or .gerber are also used.

<span class="mw-page-title-main">Through-hole technology</span> Circuit board manufacturing technique

In electronics, through-hole technology is a manufacturing scheme in which leads on the components are inserted through holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side, either by manual assembly or by the use of automated insertion mount machines.

A via is an electrical connection between two or more metal layers, and are commonly used in printed circuit boards (PCB). Essentially a via is a small drilled hole that goes through two or more adjacent layers; the hole is plated with metal that forms an electrical connection through the insulating layers.

In electronic design, wire routing, commonly called simply routing, is a step in the design of printed circuit boards (PCBs) and integrated circuits (ICs). It builds on a preceding step, called placement, which determines the location of each active element of an IC or component on a PCB. After placement, the routing step adds wires needed to properly connect the placed components while obeying all design rules for the IC. Together, the placement and routing steps of IC design are known as place and route.

Altium Limited is an American - Australian multinational software company that provides electronic design automation software to engineers who design printed circuit boards. Founded as Protel Systems Pty Ltd in Australia in 1985, the company has regional headquarters in the United States, Australia, China, Europe, and Japan. Its products are designed for use in a Microsoft Windows environment and used in industries such as automotive, aerospace, defense, and telecommunications. Its flagship product, Altium Designer, is a software for unified electronics design.

<span class="mw-page-title-main">IPC (electronics)</span> Trade association for electronics

IPC is a trade association whose aim is to standardize the assembly and production requirements of electronic equipment and assemblies. IPC is headquartered in Bannockburn, Illinois, United States with additional offices in Washington, D.C. Atlanta, Ga., and Miami, Fla. in the United States, and overseas offices in China, Japan, Thailand, India, Germany, and Belgium.

Microvias are used as the interconnects between layers in high density interconnect (HDI) substrates and printed circuit boards (PCBs) to accommodate the high input/output (I/O) density of advanced packages. Driven by portability and wireless communications, the electronics industry strives to produce affordable, light, and reliable products with increased functionality. At the electronic component level, this translates to components with increased I/Os with smaller footprint areas, and on the printed circuit board and package substrate level, to the use of high density interconnects (HDIs).

TopoR is an EDA program developed and maintained by the Russian company Eremex. It is dedicated to laying out a printed circuit board (PCB). The current version is 6.3.17875 as of 2017-09-20.

This page is a comparison of electronic design automation (EDA) software which is used today to design the near totality of electronic devices. Modern electronic devices are too complex to be designed without the help of a computer. Electronic devices may consist of integrated circuits (ICs), printed circuit boards (PCBs), field-programmable gate arrays (FPGAs) or a combination of them. Integrated circuits may consist of a combination of digital and analog circuits. These circuits can contain a combination of transistors, resistors, capacitors or specialized components such as analog neural networks, antennas or fuses.

<span class="mw-page-title-main">Altium Designer</span> Electronic Design Automation Software

Altium Designer (AD) is a PCB and electronic design automation software package for printed circuit boards. It is developed by Australian software company Altium Limited. Altium Designer was previously named under the "Protel" brand.

<span class="mw-page-title-main">PCB (software)</span>

PCB is a free and open-source software suite for electronic design automation (EDA) - for printed circuit boards (PCB) layout. It uses GTK+ for its GUI widgets.

<span class="mw-page-title-main">DesignSpark PCB</span>

DesignSpark PCB is a free electronic design automation software package for printed circuit boards. Although there is no charge for the software, the user must register with DesignSpark.com to unlock the program and it displays advertisements which must be acknowledged before the user can begin working.

<span class="mw-page-title-main">DipTrace</span>

DipTrace is a proprietary software suite for electronic design automation (EDA) used for electronic schematic capture and printed circuit board layouts. DipTrace has four applications: schematic capture editor, PCB layout editor with built-in shape-based autorouter and 3D preview, component editor, and pattern editor.

<span class="mw-page-title-main">Autotrax</span>

Autotrax was a free software application that ran on DOS on an IBM or compatible PC. It was designed by Protel Systems, and was one of the first professional printed circuit board CAD applications available for personal computers. It is a freeware download and also available in a stripped-down version marketed as Easytrax.

CircuitMaker is electronic design automation software for printed circuit board designs targeted at the hobby, hacker, and maker community. CircuitMaker is available as freeware, and the hardware designed with it may be used for commercial and non-commercial purposes without limitations. It is currently available publicly as version 2.0 by Altium Limited, with the first non-beta release on January 17, 2016.

EasyEDA is a web-based EDA tool suite that enables hardware engineers to design, simulate, share - publicly and privately - and discuss schematics, simulations and printed circuit boards. Other features include the creation of a bill of materials, Gerber files and pick and place files and documentary outputs in PDF, PNG and SVG formats.

Specctra is a commercial PCB auto-router originally developed by John F. Cooper and David Chyan of Cooper & Chyan Technology, Inc. (CCT) in 1989. The company and product were taken over by Cadence Design Systems in May 1997. Since its integration into Cadence's Allegro PCB Editor, the name of the router is Allegro PCB Router. The latest version is 17.4 – 22.1.

References

  1. Wahby, Mahmoud (2014-02-21). "Component placement tips and strategies". EDN Network. Archived from the original on 2017-09-24. Retrieved 2017-09-24.
  2. 1 2 3 Loughhead, Phil (2017-05-30). "Removing Unused Pads and Adding Teardrops". Altium Designer technical documentation. Altium. Archived from the original on 2017-09-24. Retrieved 2017-09-24.
  3. 1 2 3 4 5 Kolath, Amos (2010). "Why Where When and how teardrops should be added to PCB?". KaiZen Technologies. Archived from the original on 2017-09-24. Retrieved 2017-09-24.
  4. Ruth (2023-04-28). "Introduction to high speed PCB and is it same as high frequency PCB". IBE Electronics. Retrieved 2023-05-01.
  5. Lobner, Wilhelm (October 2002). "Empfehlung zu Tear-drops" [Recommendations for tear-drops](PDF) (in German). AT&S AG. Archived (PDF) from the original on 2017-09-24. Retrieved 2017-09-24.
  6. Gutierrez, Keith G.; Coates, Keven (June 2010). "PCB Design Guidelines for 0.5mm Package-on-Package Applications Processor, Part I" (PDF). Texas Instruments. Application Report SPRABB3. Archived (PDF) from the original on 2017-09-24. Retrieved 2015-07-27.
  7. Loughhead, Phil (2017-04-25). "Interactive Routing". Altium Designer technical documentation. Altium. Archived from the original on 2017-09-24. Retrieved 2017-09-24.
  8. 1 2 Byers, T. J. (1991-08-01). Printed Circuit Board Design with Microcomputers (1 ed.). McGraw-Hill Book Company. p. 102. ISBN   0070095582. LCCN   91-72187.
  9. 1 2 Kollipara, Ravindranath; Tripathi, Vijai K.; Sergent, Jerry E.; Blackwell, Glenn R.; White, Donald; Staszak, Zbigniew J. (2005). "11.1.3 Packaging Electronic Systems - Design of Printed Wiring Boards" (PDF). In Whitaker, Jerry C.; Dorf, Richard C. (eds.). The Electronics Handbook (2 ed.). CRC Press. p. 1266. ISBN   978-0-8493-1889-4. LCCN   2004057106. Archived (PDF) from the original on 2017-09-25. Retrieved 2017-09-25.
  10. US 3560256,Abrams, Halle,"Packaging Electronic Systems",published 1971-02-02, assigned to Western Electric Co.
  11. Thierauf, Stephen C. (2004). High-Speed Circuit Board Signal Integrity (1 ed.). Artech House, Inc. pp. 104–105. ISBN   1580531318.