Safety engineering is an engineering discipline which assures that engineered systems provide acceptable levels of safety. It is strongly related to industrial engineering/systems engineering, and the subset system safety engineering. Safety engineering assures that a life-critical system behaves as needed, even when components fail.
In computer science, best, worst, and average cases of a given algorithm express what the resource usage is at least, at most and on average, respectively. Usually the resource being considered is running time, i.e. time complexity, but could also be memory or some other resource. Best case is the function which performs the minimum number of steps on input data of n elements. Worst case is the function which performs the maximum number of steps on input data of size n. Average case is the function which performs an average number of steps on input data of n elements.
A product's service life is its period of use in service. Several related terms describe more precisely a product's life, from the point of manufacture, storage, and distribution, and eventual use. Service life has been defined as "a product's total life in use from the point of sale to the point of discard" and distinguished from replacement life, "the period after which the initial purchaser returns to the shop for a replacement". Determining a product's expected service life as part of business policy involves using tools and calculations from maintainability and reliability analysis. Service life represents a commitment made by the item's manufacturer and is usually specified as a median. It is the time that any manufactured item can be expected to be "serviceable" or supported by its manufacturer.
Failure mode and effects analysis is the process of reviewing as many components, assemblies, and subsystems as possible to identify potential failure modes in a system and their causes and effects. For each component, the failure modes and their resulting effects on the rest of the system are recorded in a specific FMEA worksheet. There are numerous variations of such worksheets. An FMEA can be a qualitative analysis, but may be put on a quantitative basis when mathematical failure rate models are combined with a statistical failure mode ratio database. It was one of the first highly structured, systematic techniques for failure analysis. It was developed by reliability engineers in the late 1950s to study problems that might arise from malfunctions of military systems. An FMEA is often the first step of a system reliability study.
Failure rate is the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.
Reliability engineering is a sub-discipline of systems engineering that emphasizes the ability of equipment to function without failure. Reliability describes the ability of a system or component to function under stated conditions for a specified period of time. Reliability is closely related to availability, which is typically described as the ability of a component or system to function at a specified moment or interval of time.
In engineering, redundancy is the intentional duplication of critical components or functions of a system with the goal of increasing reliability of the system, usually in the form of a backup or fail-safe, or to improve actual system performance, such as in the case of GNSS receivers, or multi-threaded computer processing.
Ampacity is a portmanteau for ampere capacity defined by National Electrical Codes, in some North American countries. Ampacity is defined as the maximum current, in amperes, that a conductor can carry continuously under the conditions of use without exceeding its temperature rating. Also described as current-carrying capacity.
Design for manufacturability is the general engineering practice of designing products in such a way that they are easy to manufacture. The concept exists in almost all engineering disciplines, but the implementation differs widely depending on the manufacturing technology. DFM describes the process of designing or engineering a product in order to facilitate the manufacturing process in order to reduce its manufacturing costs. DFM will allow potential problems to be fixed in the design phase which is the least expensive place to address them. Other factors may affect the manufacturability such as the type of raw material, the form of the raw material, dimensional tolerances, and secondary processing such as finishing.
Failure mode effects and criticality analysis (FMECA) is an extension of failure mode and effects analysis (FMEA).
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge. Product safety standards may dictate particular features of a consumer product, for example, external case temperature or grounding of exposed metal parts. Prototypes and industrial equipment made in small quantities may use standardized commercially available enclosures such as card cages or prefabricated boxes. Mass-market consumer devices may have highly specialized packaging to increase consumer appeal. Electronic packaging is a major discipline within the field of mechanical engineering.
AEi Systems is a space and power electronics engineering firm based in the United States that concentrates on circuit, systems and design analysis.
Reliability of semiconductor devices can be summarized as follows:
- Semiconductor devices are very sensitive to impurities and particles. Therefore, to manufacture these devices it is necessary to manage many processes while accurately controlling the level of impurities and particles. The finished product quality depends upon the many layered relationship of each interacting substance in the semiconductor, including metallization, chip material and package.
- The problems of micro-processes, and thin films and must be fully understood as they apply to metallization and wire bonding. It is also necessary to analyze surface phenomena from the aspect of thin films.
- Due to the rapid advances in technology, many new devices are developed using new materials and processes, and design calendar time is limited due to non-recurring engineering constraints, plus time to market concerns. Consequently, it is not possible to base new designs on the reliability of existing devices.
- To achieve economy of scale, semiconductor products are manufactured in high volume. Furthermore, repair of finished semiconductor products is impractical. Therefore, incorporation of reliability at the design stage and reduction of variation in the production stage have become essential.
- Reliability of semiconductor devices may depend on assembly, use, environmental, and cooling conditions. Stress factors affecting device reliability include gas, dust, contamination, voltage, current density, temperature, humidity, mechanical stress, vibration, shock, radiation, pressure, and intensity of magnetic and electrical fields.
Tolerance analysis is the general term for activities related to the study of accumulated variation in mechanical parts and assemblies. Its methods may be used on other types of systems subject to accumulated variation, such as mechanical and electrical systems. Engineers analyze tolerances for the purpose of evaluating geometric dimensioning and tolerancing (GD&T). Methods include 2D tolerance stacks, 3D Monte Carlo simulations, and datum conversions.
A tantalum electrolytic capacitor is an electrolytic capacitor, a passive component of electronic circuits. It consists of a pellet of porous tantalum metal as an anode, covered by an insulating oxide layer that forms the dielectric, surrounded by liquid or solid electrolyte as a cathode. Because of its very thin and relatively high permittivity dielectric layer, the tantalum capacitor distinguishes itself from other conventional and electrolytic capacitors in having high capacitance per volume and lower weight.
An environmental chamber, also called a climatic chamber or climate chamber, is an enclosure used to test the effects of specified environmental conditions on biological items, industrial products, materials, and electronic devices and components.
An operating temperature is the allowable temperature range of the local ambient environment at which an electrical or mechanical device operates. The device will operate effectively within a specified temperature range which varies based on the device function and application context, and ranges from the minimum operating temperature to the maximum operating temperature. Outside this range of safe operating temperatures the device may fail.
Electronic components have a wide range of failure modes. These can be classified in various ways, such as by time or cause. Failures can be caused by excess temperature, excess current or voltage, ionizing radiation, mechanical shock, stress or impact, and many other causes. In semiconductor devices, problems in the device package may cause failures due to contamination, mechanical stress of the device, or open or short circuits.
A prediction of reliability is an important element in the process of selecting equipment for use by telecommunications service providers and other buyers of electronic equipment, and it is essential during the design stage of engineering systems life cycle. Reliability is a measure of the frequency of equipment failures as a function of time. Reliability has a major impact on maintenance and repair costs and on the continuity of service.
High-temperature operating life (HTOL) is a reliability test applied to integrated circuits (ICs) to determine their intrinsic reliability. This test stresses the IC at an elevated temperature, high voltage and dynamic operation for a predefined period of time. The IC is usually monitored under stress and tested at intermediate intervals. This reliability stress test is sometimes referred to as a lifetime test, device life test or extended burn in test and is used to trigger potential failure modes and assess IC lifetime.
