Comparison of 802.15.4 radio modules

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IEEE 802.15.4 Module RF Module with metric ruler for size reference.jpg
IEEE 802.15.4 Module

An 802.15.4 radio module is a small device used to communicate wirelessly with other devices according to the IEEE 802.15.4 protocol.

Contents

This table lists production ready-to-use certified modules only, not radio chips. A ready-to-use module is a complete system with a transceiver, and optionally an MCU and antenna on a printed circuit board. While most of the modules in this list are Zigbee, Thread, ISA100.11a, or WirelessHART modules, some don't contain enough flash memory to implement a Zigbee stack and instead run plain 802.15.4 protocol, sometimes with a lighter wireless protocol on top.

Transceiver-only modules

These modules only include the RF transceiver and do not include a microprocessor. As a result, the protocol stack will need to be handled by an external IC. They are lower in price than modules which contain a microprocessor and enable the integrator to choose any microprocessor. However, potentially more work is required for integrating the MCU and module.

The following table lists vendor by alphabetical order:

ManufacturerModuleTransceiver ChipAntennaSleepTXRXTX PowerSensitivityPCB SizeReleasedInterfacingProtocol stacks
FlexiPanel LtdEasyBee [1] [2] Texas Instruments CC2420 [3] [4] integral18 mA20 mA0 dBm26 mm × 20 mmMar, 2008 ?Zigbee stack
EmbitEMB-TRX169PA, 169 MHz [5] CC1120 [6] U.FL connector<1 μA400  mA @ +27 dBm27 mA (full sens.)27 dBm-122 dBm16 mm × 26 mm2013 UART, SPI, JTAG Wireless M-Bus stack [7]
Microchip Technology MRF24J40MA [8] MRF24J40 [9] PCB trace2 μA23 mA19 mA0 dBm–94 dBm17.8 mm × 27.9 mmJun, 2008 [10] SPI Microchip Zigbee
MiWi [11]
MiWi P2P [12]

Integrated MCU and transceiver modules

The following table lists vendor by alphabetical order:

ManufacturerModuleSOC/SIP ChipMCU coreRAMFlashAntennaSleepTXRXTX PowerSensitivityPCB SizeReleasedInterfacingFirmware options
Anaren A2530R24A
CC2530 [13] 32 MHz
8-bit 8051		8 kB256 kBPrinted Trace1 μA34 mA25 mA4 dBm-90 dBm11 mm × 19 mmJuly, 2012 UART,
SPI 		AIR-ZNP, based on TI Z-Stack
A2530R24C U.FL connector
A2530E24APrinted Trace130 mA28 mA15 dBm-95 dBm
A2530E24C U.FL connector 106 mA28 mA13 dBm-95 dBm
Atmel ZigBit 2.4 GHz
(ATZB-24-B0)		AT86RF2308-bit
ATmega
1281v		8 kB128 kBRF output< 6 μA18 mA19 mA-17 dBm
to
3 dBm		-101 dBm18.8 mm × 13.5 mm × 2.0 mm2009 UART,
USART,
SPI,
I²C,
JTAG 		BitCloud - Zigbee PRO,
Wireless MCU Software,
BitCloud stack,
SerialNet,
OpenMAC
ZigBit 2.4 GHz
(ATZB-24-A2)		balanced dual chip antenna24 mm × 13.5 mm × 2.0 mm
ZigBit 2.4 GHz Amplified
(ATZB-A24-U0)		RF output50 mA23 mAUp to
20 dBm		-104 dBm38 mm × 13.5 mm × 2.0 mm
ZigBit 2.4 GHz Amplified
(ATZB-A24-UFL)		 U.FL connector
ZigBit 700/800/900 MHz
(ATZB-900-B0)		AT86RF212RF output26 mA11 mAUp to
11 dBm		–110 dBm24 mm × 13.5 mm × 2.8 mm
California Eastern LaboratoriesZICM357SP2EM357 [14] [15] 32 bit,
ARM Cortex
-M3 		12 kB192 kBPCB Trace Antenna or RF Port for External Antenna1 μA58 mA34 mA20 dBm–103 dBm23.9 mm × 16.6 mmApr, 2012 UART,
SPI,
TWI 		Zigbee PRO stack: EmberZNet PRO
ZICM357SP0EM357 [16] [17] 32 bit,
ARM Cortex
-M3 		12 kB192 kBPCB Trace Antenna or RF Port for External Antenna1 μA31 mA30 mA8 dBm–100 dBm23.9 mm × 16.6 mmApr, 2012 UART,
SPI,
TWI 		Zigbee PRO stack: EmberZNet PRO
ZICM3588SP0SiLabs EM3588 [18] 32 bit,
ARM Cortex
-M3 		64 kB512 kBPCB Trace Antenna or U.FL connector 2.4 μA44 mA30 mA8 dBm–100 dBm23.9 mm × 16.6 mmMar, 2014 UART,
SPI,
I²S 		CEL Zigbee Stack
Synapse SNAP Stack
Digi International Series 1 XBee [19] Freescale MC13193 [20] 8-bit 689S08A HCS08 4 kB60 kBintegrated Whip, chip or U.FL connector, RPSMA connector 10 μA, 50 μA45 mA50 mA0 dBm–92 dBm24.38 mm × 27.61 mmDec, 2006 [21] UART Zigbee stack [22]
Series 1 XBee-PRO [23] 250 mA, 340 mA, 180 mA55 mA18 dBm,
10 dBm		–100 dBm24.38 mm × 32.94 mm
Series 2 XBee ZB [24] Ember (now Silicon Labs) EM250 [25] [26] 16-bit
12 MHz
RISC		5 kB128 kB1 μA40 mA, 35 mA40 mA, 38 mA3 dBm,
1 dBm		–96 dBm,
–95 dBm		24.38 mm × 27.61 mmApr, 2008 [27] Ember ZNet [28]
Series 2 XBee-PRO ZB [29] 10 μA295 mA, 170 mA45 mA17 dBm,
10 dBm		–102 dBm24.38 mm × 32.94 mm
Dresden elektronikdeRFmega128-22M00 2.4 GHzATmega128RFA18-bit
ATmega		16 kB128 kBChip ceramic antenna< 1 μA18 mA18 mA+3 dBm-98 dBm23.6 mm × 13.2 mm × 3.0 mm2012 JTAG, UART,
I²C,
ADC,
SPI,
GPIO 		MAC stack
Zigbee (BitCloud)
6LoWPAN
Atmel
deRFmega128-22M10 2.4 GHzRF pads19.0 mm × 13.2 mm × 3.0 mm
deRFmega128-22M12 2.4 GHz198 mA22 mA+22 dBm–105 dBm21.5 mm × 13.2 mm × 3.0 mm
deRFmega256-23M00 2.4 GHzATmega256RFR28-bit
ATmega		32 kB256 kBChip ceramic antenna< 1 μA19 mA11 mA+3.5 dBm-98 dBm23.6 mm × 13.2 mm × 3.0 mm2013 JTAG, UART,
I²C,
ADC,
SPI,
GPIO
deRFmega256-23M10 2.4 GHzRF pads19.0 mm × 13.2 mm × 3.0 mm
deRFmega256-23M12 2.4 GHz233 mA17 mA23 dBm–104 dBm21.5 mm × 13.2 mm × 3.0 mm
deRFsam3-23M10-2 2.4 GHzATSAM3S4A [30]
AT86RF232 [31] 		32-bit
ARM Cortex
-M3 		48 kB256 kBRF pads< 6 μA45 mA41 mA+3 dBm-100 dBm21.5 mm × 13.2 mm × 3.0 mm JTAG, UART,
I²C,
ADC,
SPI,
GPIO,
USB
deRFsam3-13M10 868, 915 MHzATSAM3S4A [32]
AT86RF212 [33] 		50 mA37 mA+5 or +10 dBm–110 dBm21.5 mm × 13.2 mm × 3.0 mm JTAG,
UART,
I²C,
ADC,
SPI,
GPIO,
USB
deRFusb-23E00 2.4 GHz
deRFusb-23E06 2.4 GHz		ATSAM3S4B [34]
AT86RF231 [35] 		32-bit
ARM Cortex
-M3 		48 kB256 kBChip ceramic antenna32 mA51 mA45 mA+3 dBm-97 dBm71.0 mm × 23.0 mm × 8.7 mm2012USB, optional: JTAG, Debug
deRFusb-23E00 JTAG 2.4 GHz
deRFusb-23E06 JTAG 2.4 GHz		63.5 mm × 19.0 mm × 9.5 mmUSB, JTAG, Debug
deRFusb-13E00 868, 915 MHz
deRFusb-13E06 868, 915 MHz		ATSAM3S4B [36] br> AT86RF212 [37] +9 dBm-106 dBm71.0 mm × 23.0 mm × 8.7 mmUSB, optional: JTAG, Debug
deRFusb-13E00 JTAG 868, 915 MHz
deRFusb-13E06 JTAG 868, 915 MHz		63.5 mm × 19.0 mm × 9.5 mmUSB, JTAG, Debug

Embit		EMB-WMB169PA, 169 MHz [38] [39] [40] MSP430F534x [41] 16 bit MSP43010 kB / 8 kB / 6 kB128 kB / 96 kB / 64 kBRF Pads, U.FL Connector<2 μA57 mA@
+15dBm		27 mA (full sens.)up to
30 dBm		-122 dBm29 mm × 22 mm2012 UART,
SPI,
JTAG 		MSP430F534x [42]
EMB-WMB868, 868 MHz [43] [44] [45] MSP430F534x [46] 16 bit MSP43010 kB / 8 kB / 6 kB128 kB / 96 kB / 64 kBRF Pads, U.FL Connector<2 μA57 mA@ +15dBm27 mA (full sens.)15 dBm-122 dBm29 mm × 22 mm2012 UART,
SPI,
JTAG 		Wireless M-Bus stack [47]
EMB-Z2530PA, 2.4 GHz [48] [49] [50] CC2530 [51] 8 bit 80518 kB256 kBPCB Antenna, U.FL Connector, Wire Antenna opt<1.1 μA135 mA@ +20dBm28 mA20 dBm-100 dBm29 mm × 22 mm2011 UART,
SPI,
JTAG 		TIMAC (IEEE 802.15.4), [52] ZStack (Zigbee) [53]
EMB-ZRF212B, 868 MHz, 915 MHz [54] [55] [56] ATxmega128D3 [57] 8/16 bit AVR XMEGA8 kB128 kBCeramic Antenna, U.FL Connector, RF pads1.3 μA17 mA@ +5dBm10 mA10 dBm–110 dBm29 mm × 22 mm2013 UART,
SPI,
JTAG 		Atmel Lightweight Mesh, [58]
Atmel MAC (IEEE 802.15.4), [59]
Atmel BitCloud (Zigbee PRO)
EMB-ZRF231PA, 2.4 GHz [60] [61] [62] ATxmega256A3U [63] 8/16 bit AVR XMEGA16 kB256 kBPCB Antenna, U.FL Connector, RF pads<1.1 μA132 mA@ +20dBm24 mA20 dBm-105 dBm29 mm x 22 mm2011 UART,
SPI,
JTAG 		Atmel Lightweight Mesh, [64]
[Atmel MAC (IEEE 802.15.4), [65]
Atmel BitCloud (Zigbee PRO)
FlexiPanel LtdPixie [66] [67] Texas Instruments CC2420 [68] [69] PIC18LF46204 kB64 kBintegral2 μA25 mA0 dBmMar, 2008 UART,
SPI 		Microchip Zigbee
Pixie Lite [70] [71] PIC18LF25201.5 kB32 kB
Kirale TechnologiesKTWM102-11Microchip ATSAMR21E19A32-bit
ARM Cortex -M0+ 		32 kB256 kB
+
512 kB		on-board chip5 μA17 mA19 mA4 dBm-104 dBm16.6 mm × 11.4 mm × 2.2 mm2018 UART,
USB,
JTAG 		KiNOS Thread Certified Stack [72]
Atmel
KTWM102-21W.FL connector
MMB NetworksZ357PA40Ember (now Silicon Labs) EM357 [73] 32-bit
ARM Cortex
M3		12 kB192 kB on-chip, 512 kB on-boardU.FL, on-board chip ceramic0.65 μA175 mA at 20 dBm TX power32 mA20 dBm max.,
software programmable		-106 dBm34.2 mm × 15 mm × 2.88 mm2015UART and
SPI		Ember's (now Silicon Labs')
EmberZNetPRO [74] with MMB's
RapidConnect family of firmware
NXP JN5168-001-M00 [75] JN516832 MHz
32-bit
RISC		32 kB256 kBon board0.15 μA15 mA17 mA2.5 dBm-95 dBm16 mm × 30 mm2013 UART,
SPI 		JenNet stack
Zigbee stack
JN5168-001-M03 [76] U.FL connector
JN5168-001-M05 [77] U.FL connector 35 mA22 mA9.5 dBm-96 dBm16 mm x30 mm
JN5168-001-M06 [78] U.FL connector 175 mA22 mA22 dBm-100 dBm
Control Data SystemsVersaNode 210 [79] MC13224V32-bit ARM796 kB128 kB MMCX Connector 15 μA60 mA21 mA10 dBm-98 dBm20 mm × 25 mm2009 UART,
SPI 		Control Data Systems ISA100.11a
Panasonic PAN4555MC1321x8-bit MC9S08GT HC08 4 kB60 kBRF out or ceramic antenna0.25 μA, 1.9 μA, 36 μA, 1.6 mA36.5 mA37 mA–4 dBm,
0 dBm		–92 dBm12.2 mm × 16.4 mm × 2.2 mm2008 UART,
SPI 		Freescale Beestack
[Synapse SNAP Stack
PAN4561MC13213SMD RF out, ceramic antenna or U.FL 1.6 mA, 50 μA, 16 μA, 2 μA202 mA45 mA20 dBm–105 dBm35 mm × 15 mmJan, 2009 UART,
I²C
PAN4570 [80] Ember (now Silicon Labs) EM250 [81] [82] 16-bit 12 MHz
RISC		5 kB128 kB1 μA, 1.5 μA35.5 mA, 41.5 mA, 28 mA35.5 mA, 37.5 mA3 dBm,
5 dBm,
–32 dBm		–97 dBm26.5 mm × 20 mm × 2.8 mm2006 UART,
SPI,
I²C 		Ember (now Silicon Labs) EM250 [83]
RadiocraftsRC2200 [84] Texas Instruments CC2420 [85] [86] 8-bit
ATmega128		4 kB128 kBintegrated, MMCX connector or RF on pin connector23 μA, 1.3 μA27 mA30 mA0 dBm-94 dBm16.5 mm × 29.2 mm × 3.5 mm2008 UART,
SPI,
JTAG,
ISP 		Texas Instruments Z-stack [87]
or any third-party
Zigbee stack
RC2201 [88] 8 kB1.3 μA
RC2202 [89] 2 kB32 kB23 mA26 mA
RC2204 [90] 4 kB64 kB23 μA, 1.3 μA27 mA30 mA
RC2201HP [91] 8-bit
ATmega1281		8 kB128 kBintegrated or RF-on-pin connector40 μA, 2 μA140 mA28 mA17 dBm-92 dBm16.5 mm × 35.6 mm × 3.5 mmJan 2008 [92]
RC2300 [93] Texas Instruments CC2430
(CC2431
for location
engine option)

[94] [95]

8-bit 8051300 μA, 0.9 μA, 0.6 μA27 mA27 mA0 dBm12.7 mm × 25.4 mm × 2.5 mmJul 2008 [96] UART,
SPI,
proprietary serial
debugging interface
RC2301 [97]
RC2302 [98] 32 kB
RC2304 [99] 64 kB
MonolithicsZMN2405Texas Instruments CC2430 [100]
[101] 		8-bit 80518 kB128 kBRFIO pad3 μA28 mA27 mA0 dBm-92 dBm30.5 mm × 21.2 mm2008 UART,
SPI,		Zigbee stack, RFM's CSM standard module application profile
ZMN243025 mm × 20.3 mm
ZMN2430A <built-in–2 dBm–90 dBm25 mm × 26.9 mm
ZMN2405HPRFIO pad130 mA33 mA17 dBm-95 dBm40.6 mm × 21.2 mm
ZMN2405HPAbuilt-in15 dBm47 mm × 21.2 mm
ZMN2430HPRFIO pad17 dBm30.48 mm × 25 mm
ZMN2430HPAbuilt-in15 dBm36.83 mm × 25 mm
Radios, Inc.MXR-EM20 [102] Ember 2420 [103] 8-bit
ATmega128L		4 kB128 kBRF on pin20 μA17.4 mA19.7 mA0 dBm–94 dBm25.4 mm × 18.4 mmOct
2005		 SPI Zigbee stack
SynapseSM220UF1 [104] ATmega128RFA18-bit
ATmega		16 kB128 kBPCB Antenna and U.FL connector0.4 μA20 dBm: 150 mA

6 dBm: 55 mA

22 mA20 dBm–103 dBm29.8mm × 19mm2013 UART,
SPI,
I²C 		Synapse SNAP Stack
[Talon CommunicationsOasis [105] [106] NXP
(formerly Freescale) KW22D512V		Cortex-M464 kB512 kBU.FL, MMCX or edge connect to external trace PIFA4uA111 mA24 mA20 dBm-108 dBm25mm × 20mm × 2.7mmFeb
2015		 JTAG,
UART,
I²C,
ADC,
SPI,
GPIO,
PWM,
USB		SMAC
Sierra mangOH IoT [107] RP-SMA, Chip45mm × 22.3mm × 2.7mmMay 2016 JTAG,
UART,
SPI,
GPIO,
USB
Telegesis LtdETRX2Ember
(now Silicon Labs)
EM250 [108] [109] 		16-bit 12 MHz
RISC		5 kB128 kBintegrated, U.FL connector or 50Ω pad1 μA, 1.5 μA35.5 mA, 41.5 mA, 28 mA35.5 mA, 37.5 mA3 dBm,
5 dBm		−94 dBm,
−95 dBm,
−98 dBm,
−99 dBm		37.75 mm × 20.45 mm2008SIF,
UART,
I²C,
SPI 		Ember ZNet Stack [110]
ETRX2-PA0.8 μA, 1.5 μA, 3 μA, 3.5 μA56 mA, 63 mA, 106 mA, 120 mA, 121 mA37 mA0 dBm,
10 dBm, 18.5 dBm,
17.5 dBm		−92 dBm,
−93 dBm,
−96 dBm,
−97 dBm		37.75 mm × 20.5 mm2009
ETRX2USBintegrated32 mA, 27 mA, 26 mA55 mA, 62 mA62 mA3 dBm,
18 dBm		2008SIF
ETRX351Silicon Labs
(former Ember)
EM351		32-bit
ARM Cortex
-M3
Processor		12 kB128 kBIntegrated chip antenna or U.FL coaxial connector<1 μA31 mA22 mA8 dBm−102 dBm25 mm × 19 mm2011
ETRX357[ [111] Silicon Labs
(former Ember)
EM357		192 kB
Sena TechnologiesProBee-ZE10 [112] [113] Ember
(now Silicon Labs)
EM250 [114] [115] 		16-bit 12 MHz
RISC		5 kB128 kBIntegrated chip, U.FL connector, RPSMA Connector≤ 2 μA190 mA45 mA20 dBm–102 dBm51.7 mm × 23.0 mm × 11.15 mm2010
Oct		 UART
ProBee-ZE20S DIP/SMD [116] Ember
(now Silicon Labs)
EM357		32-bit
ARM Cortex
-M3
Processor		12 kB192 kBIntegrated chip,
U.FL connector,
RPSMA Connector		< 1 μA33 mA28 mA8 dBm-100 dBm/Max.
-102 dBm		SMD Size: 31.6 mm × 18.6 mm, DIP Size: 32.8 mm × 21.0 mm2011
Oct

List of Zigbee company acquisitions

Other companies manufacturing 802.15.4 ready-to-use modules

The following is a list of companies producing modules yet to be added to the table.

Related Research Articles

Zigbee is an IEEE 802.15.4-based specification for a suite of high-level communication protocols used to create personal area networks with small, low-power digital radios, such as for home automation, medical device data collection, and other low-power low-bandwidth needs, designed for small scale projects which need wireless connection. Hence, Zigbee is a low-power, low data rate, and close proximity wireless ad hoc network.

<span class="mw-page-title-main">Ralink</span> Wi-Fi chipset manufacturer

Ralink Technology, Corp. is a Wi-Fi chipset manufacturer mainly known for their IEEE 802.11 chipsets. Ralink was founded in 2001 in Cupertino, California, then moved its headquarters to Hsinchu, Taiwan. On 5 May 2011, Ralink was acquired by MediaTek.

<span class="mw-page-title-main">EnOcean</span> Energy harvesting wireless technology

The EnOcean technology is an energy harvesting wireless technology used primarily in building automation systems, but also in other application fields such as industry, transportation, logistics or smart homes solutions. The energy harvesting wireless modules are manufactured and marketed by the company EnOcean, headquartered in Oberhaching near Munich. The modules combine micro energy converters with ultra low power electronics and wireless communications and enable batteryless, wireless sensors, switches, and controls.

Qualcomm Atheros is a developer of semiconductor chips for network communications, particularly wireless chipsets. The company was founded under the name T-Span Systems in 1998 by experts in signal processing and VLSI design from Stanford University, the University of California, Berkeley, and private industry. The company was renamed Atheros Communications in 2000 and it completed an initial public offering in February 2004, trading on the NASDAQ under the symbol ATHR.

<span class="mw-page-title-main">WaveLAN</span>

WaveLAN was a brand name for a family of wireless networking technology sold by NCR, AT&T, Lucent Technologies, and Agere Systems as well as being sold by other companies under OEM agreements. The WaveLAN name debuted on the market in 1990 and was in use until 2000, when Agere Systems renamed their products to ORiNOCO. WaveLAN laid the important foundation for the formation of IEEE 802.11 working group and the resultant creation of Wi-Fi.

<span class="mw-page-title-main">Daintree Networks</span> Building automation company

Daintree Networks, Inc. was a building automation company that provided wireless control systems for commercial and industrial buildings. Founded in 2003, Daintree was headquartered in Los Altos, California, with an R&D lab in Melbourne, Australia.

IEEE 802.15.4a was an amendment to IEEE 802.15.4-2006 specifying that additional physical layers (PHYs) be added to the original standard. It has been merged into and is superseded by IEEE 802.15.4-2011.

MiWi is a proprietary wireless protocol supporting peer-to-peer, star network connectivity. It was designed by Microchip Technology. MiWi uses small, low-power digital radios based on the IEEE 802.15.4 standard, and is designed for low-power, cost-constrained networks, such as industrial monitoring and control, home and building automation, remote control, wireless sensors, lighting control, and automated meter reading.

Ember was an American company based in Boston, Massachusetts, USA, which is now owned by Silicon Labs. Ember had a radio development centre in Cambridge, England, and distributors worldwide. It developed Zigbee wireless networking technology that enabled companies involved in energy technologies to help make buildings and homes smarter, consume less energy, and operate more efficiently. The low-power wireless technology can be embedded into a wide variety of devices to be part of a self-organizing mesh network. All Ember products conform to IEEE 802.15.4-2003 standards.

Jennic Limited was a privately held UK-based fabless semiconductor company founded in 1996. The company developed microcontrollers that integrated radios with low-power wireless standards support; particularly 802.15.4, 6LoWPAN and Zigbee. It also supplied wired communications products, e.g. ATM and RapidIO cores.

<span class="mw-page-title-main">Silicon Labs</span> Global technology company

Silicon Laboratories, Inc. is a fabless global technology company that designs and manufactures semiconductors, other silicon devices and software, which it sells to electronics design engineers and manufacturers in Internet of Things (IoT) infrastructure worldwide.

<span class="mw-page-title-main">XBee</span> Motherboard

Digi XBee is the brand name of a popular family of form factor compatible wireless connectivity modules from Digi International. The first XBee modules were introduced under the MaxStream brand in 2005 and were based on the IEEE 802.15.4-2003 standard designed for point-to-point and star communications. Since the initial introduction, the XBee family has grown and a complete ecosystem of wireless modules, gateways, adapters and software has evolved.

Sony Semiconductor Israel Ltd., formerly known as Altair Semiconductor, is an Israeli developer of high performance single-mode Long Term Evolution (LTE) chipsets. The company's product portfolio includes baseband processors, RF transceivers and a range of reference hardware products. Founded in 2005, Altair employs 190 employees in its Hod Hasharon, Israel headquarters and R&D center, and has regional offices in the United States, Japan, China, India, Finland, and France. Altair Semiconductor was the first chipset vendor to receive certification from Verizon Wireless to run on its 4G LTE network. Altair has also powered several devices launched on Verizon's network including the Ellipsis 7 tablet and HP Chromebook 11.6"LTE. In January 2016, it was announced that Sony was acquiring Altair for $212 Million. Altair was renamed Sony Semiconductor Israel on March 29, 2020.

<span class="mw-page-title-main">RF module</span> Electronic device to transmit and receive RF signals

An RF module is a (usually) small electronic device used to transmit and/or receive radio signals between two devices. In an embedded system it is often desirable to communicate with another device wirelessly. This wireless communication may be accomplished through optical communication or through radio-frequency (RF) communication. For many applications, the medium of choice is RF since it does not require line of sight. RF communications incorporate a transmitter and a receiver. They are of various types and ranges. Some can transmit up to 500 feet. RF modules are typically fabricated using RF CMOS technology.

IQRF is a technology for wireless packet-oriented communication via radio frequency (RF) in sub-GHz ISM bands. It is intended for general use where wireless connectivity is needed, either point-to-point or in complex networks, e.g. for telemetry, industrial control, automation of buildings and cities and Internet of Things. Fully open functionality depends solely on a user-specific application.

<span class="mw-page-title-main">Redpine Signals</span>

Redpine Signals is a fabless semiconductor company that started its operation in 2001. The company makes chipsets and system-level products for wireless networks. It serves the Internet of Things and wireless embedded systems market, enabling all volume levels of chipsets and modules.

<span class="mw-page-title-main">GreenPeak Technologies</span>

GreenPeak Technologies was an Utrecht, Netherlands-based fabless company developing semiconductor products and software for the IEEE 802.15.4 and Zigbee wireless market segment. Zigbee technology is used for Smart Home data communications and to facilitate the Internet of Things, the term used to refer to devices designed to be operated and managed by internet-enabled controllers and management systems.

<span class="mw-page-title-main">ESP32</span> Low-cost, low-power SoC microcontrollers with Bluetooth and Wi-Fi

ESP32 is a series of low-cost, low-power system on a chip microcontrollers with integrated Wi-Fi and dual-mode Bluetooth. The ESP32 series employs either a Tensilica Xtensa LX6 microprocessor in both dual-core and single-core variations, Xtensa LX7 dual-core microprocessor or a single-core RISC-V microprocessor and includes built-in antenna switches, RF balun, power amplifier, low-noise receive amplifier, filters, and power-management modules. ESP32 is created and developed by Espressif Systems, a Chinese company based in Shanghai, and is manufactured by TSMC using their 40 nm process. It is a successor to the ESP8266 microcontroller.

<span class="mw-page-title-main">Connectivity Standards Alliance</span> Group that maintains and publishes the Zigbee and Matter standard

The Connectivity Standards Alliance (CSA), formerly the Zigbee Alliance, is a group of companies that maintain and publish the Zigbee and Matter standard, along with several others.

References

  1. ↑ EasyBee summary
  2. ↑ LinkMatik-232 datasheet
  3. ↑ 2.4 GHz IEEE 802.15.4 / ZigBee-ready RF Transceiver datasheet
  4. ↑ CC2420 Errata Note 001, rev. 1.0
  5. ↑ "169 MHz Wireless M-Bus ready transceiver module". Archived from the original on December 24, 2016.
  6. ↑ CC1120High performance Sub-1 GHz wireless transceiver for narrowband systems datasheet
  7. ↑ M-Bus stack
  8. ↑ MRF24J40MA Data Sheet
  9. ↑ MRF24J40 Data Sheet
  10. ↑ "Microchip Technology Introduces 2.4 GHz IEEE 802.15.4™ FCC-Certified Radio Frequency Transceiver Module". Sensors & Transducers e-Digest. 93 (6). June 2008.
  11. ↑ MiWi
  12. ↑ MiWi P2P
  13. ↑ data sheet
  14. ↑ EM357 datasheet
  15. ↑ EM357 brochure
  16. ↑ EM357 datasheet
  17. ↑ EM357 brochure
  18. ↑ EM3588 brochure
  19. ↑ Series 1 XBee manual
  20. ↑ "XBee/XBee-PRO Code Development" (PDF). Digi. Retrieved 15 November 2011.
  21. ↑ MaxStream First to Offer ZigBee Certified Wireless Modules
  22. ↑ Zigbee stack
  23. ↑ Series 1 XBee-PRO manual
  24. ↑ Series 2 XBee ZB manual
  25. ↑ EM250 factsheet
  26. ↑ EM250 datasheet
  27. ↑ Apr, 2008 Digi to Release ZigBee® PRO Feature Set on Popular XBee® Product Line
  28. ↑ Ember ZNet
  29. ↑ Series 2 XBee-PRO ZB manual
  30. ↑ "Archived copy" (PDF). Archived from the original on 2013-04-18. Retrieved 2013-06-14.{{cite web}}: CS1 maint: archived copy as title (link) CS1 maint: bot: original URL status unknown (link)
  31. ↑ AT86RF232 datasheet
  32. ↑ "Archived copy" (PDF). Archived from the original on 2013-04-18. Retrieved 2013-06-14.{{cite web}}: CS1 maint: archived copy as title (link) CS1 maint: bot: original URL status unknown (link)
  33. ↑ AT86RF212 datasheet
  34. ↑ "Archived copy" (PDF). Archived from the original on 2013-04-18. Retrieved 2013-06-14.{{cite web}}: CS1 maint: archived copy as title (link) CS1 maint: bot: original URL status unknown (link)
  35. ↑ AT86RF231 datasheet
  36. ↑ "Archived copy" (PDF). Archived from the original on 2013-04-18. Retrieved 2013-06-14.{{cite web}}: CS1 maint: archived copy as title (link) CS1 maint: bot: original URL status unknown (link)
  37. ↑ AT86RF212 datasheet
  38. ↑ MHz Wireless M-Bus ready module
  39. ↑ EMB-WMB169PA datasheet
  40. ↑ EMB-WMB169PA brochure
  41. ↑ MSP430F534x datasheet
  42. ↑ Wireless M-Bus stack
  43. ↑ 868 MHz Wireless M-Bus ready module
  44. ↑ EMB-WMB868 datasheet
  45. ↑ EMB-WMB868 brochure
  46. ↑ MSP430F534x datasheet
  47. ↑ Wireless M-Bus stack
  48. ↑ GHz ZigBee-ready and 802.15.4-ready module
  49. ↑ EMB-Z2530PA datasheet
  50. ↑ EMB-Z2530PA brochure
  51. ↑ CC2530 datasheet
  52. ↑ TIMAC (IEEE 802.15.4)
  53. ↑ ZStack (Zigbee)
  54. ↑ EMB-ZRF212B
  55. ↑ EMB-ZRF212B datasheet
  56. ↑ EMB-ZRF212B brochure
  57. ↑ ATxmega128D3 datasheet
  58. ↑ "Archived copy". Archived from the original on 2013-10-15. Retrieved 2013-10-15.{{cite web}}: CS1 maint: archived copy as title (link) CS1 maint: bot: original URL status unknown (link)
  59. ↑ "Archived copy". Archived from the original on 2013-10-15. Retrieved 2013-10-15.{{cite web}}: CS1 maint: archived copy as title (link) CS1 maint: bot: original URL status unknown (link)
  60. ↑ EMB-ZRF231PA
  61. ↑ EMB-ZRF231PA datasheet
  62. ↑ EMB-ZRF231PA brochure
  63. ↑ ATxmega256A3U datasheet
  64. ↑ "Archived copy". Archived from the original on 2013-10-15. Retrieved 2013-10-15.{{cite web}}: CS1 maint: archived copy as title (link) CS1 maint: bot: original URL status unknown (link)
  65. ↑ "Archived copy". Archived from the original on 2013-10-15. Retrieved 2013-10-15.{{cite web}}: CS1 maint: archived copy as title (link) CS1 maint: bot: original URL status unknown (link)
  66. ↑ Pixie summary
  67. ↑ Pixie datasheet
  68. ↑ Texas Instruments CC2420 datasheet
  69. ↑ Texas Instruments CC2420 errata
  70. ↑ Pixie Lite summary
  71. ↑ Pixie Lite datasheet
  72. ↑ KiNOS Thread Certified Stack
  73. ↑ EM357 datasheet
  74. ↑ EmberZNetPRO
  75. ↑ JN5168-001-M00 data sheet
  76. ↑ JN5168-001-M03 data sheet
  77. ↑ JN5168-001-M05 data sheet
  78. ↑ JN5168-001-M06 data sheet
  79. ↑ VersaNode 210 datasheet
  80. ↑ PAN4570 datasheet
  81. ↑ Ember (now Silicon Labs) EM250 factsheet
  82. ↑ Ember (now Silicon Labs) EM250 datasheet
  83. ↑ Ember ZNet Stack
  84. ↑ RC2200 RC2200 datasheet
  85. ↑ Texas Instruments CC2420 datasheet
  86. ↑ Texas Instruments CC2420 errata
  87. ↑ Texas Instruments Z-stack
  88. ↑ RC2201 datasheet
  89. ↑ RC2202 datasheet
  90. ↑ RC2204 datasheet
  91. ↑ RC2201HP datasheet
  92. ↑ Press Release Radiocrafts launches high power 2.45 GHz RF module designed for ZigBee™
  93. ↑ RC2300 datasheet
  94. ↑ Texas Instruments CC2430 datasheet
  95. ↑ Texas Instruments CC2430 errata
  96. ↑ Radiocrafts launches ZigBee® Network Module
  97. ↑ RC2301 datasheet
  98. ↑ RC2302 datasheet
  99. ↑ RC2304 datasheet
  100. ↑ Texas Instruments CC2430 datasheet
  101. ↑ exas Instruments CC2430 errata
  102. ↑ MXR-EM20 datasheet
  103. ↑ Ember 2420 datasheet
  104. ↑ SM220UF1 datasheet
  105. ↑ Oasis summary
  106. ↑ Oasis datasheet
  107. ↑ Sierra mangOH IoT datasheet
  108. ↑ EM250 factsheet
  109. ↑ EM250 datasheet
  110. ↑ Ember ZNet Stack
  111. ↑ http://www.telegesis.com/product_range_overview/etrx3_zigbee_module.htm ETRX357 brochure]
  112. ↑ ProBee-ZE10 Product Brief
  113. ↑ ProBee-ZE10 datasheet
  114. ↑ EM250 factsheet
  115. ↑ EM250 datasheet
  116. ↑ ProBee-ZE20S DIP/SMD datasheet
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