Mercury probe

Last updated

The mercury probe is an electrical probing device to make rapid, non-destructive contact to a sample for electrical characterization. Its primary application is semiconductor measurements where otherwise time-consuming metallizations or photolithographic processing are required to make contact to a sample. These processing steps usually take hours and have to be avoided where possible to reduce device processing times.

The mercury probe applies mercury contacts of well-defined areas to a flat sample. The nature of the mercury-sample contacts and the instrumentation connected to the mercury probe define the application. If the mercury-sample contact is ohmic (non-rectifying) then current-voltage instrumentation can be used to measure resistance, leakage currents, or current-voltage characteristics. Resistance can be measured on bulk samples or on thin films. The thin films can be composed of any material that does not react with mercury. Metals, semiconductors, oxides, and chemical coatings have all been measured successfully. [1]

Applications

The mercury probe is a versatile tool for investigation of parameters of conducting, insulating and semiconductor materials.

One of the first successful mercury probe applications was the characterization of epitaxial layers grown on silicon. [2] It is critical to device performance to monitor the doping level and thickness of an epitaxial layer. Prior to the mercury probe, a sample had to undergo a metallization process, which could take hours. A mercury probe connected to capacitance-voltage doping profile instrumentation could measure an epitaxial layer as soon as it came out of the epitaxial reactor. The mercury probe formed a Schottky barrier of well-defined area that could be measured as easily as a conventional metallized contact.

Another mercury probe application popular for it speed is oxide characterization. [3] The mercury probe forms a gate contact and enables measurement of the capacitance-voltage or current-voltage parameters of the mercury-oxide-semiconductor structure. Using this device, material parameters such as permittivity, doping, oxide charge, and dielectric strength may be evaluated. The contact area of a mercury droplet resting on a semiconductor can be modified by electrowetting, [4] meaning that accurate parameter extraction may need to take this effect into account.

A mercury probe with concentric dot and ring contacts as well as a back contact extends mercury probe applications to silicon on insulator (SOI) structures, where a pseudo-MOSFET device is formed. [5] This Hg-FET can be used to study mobility, interface trap density, and transconductance.

The same mercury-sample structures can be measured with capacitance-voltage instrumentation to monitor permittivity and thickness of dielectric materials. These measurements are a convenient gauge for development of novel dielectrics of both low-k and high-k types.

If the mercury-sample contact is rectifying then a diode has formed and offers other measurement possibilities. Current-voltage measurements of the diode can reveal properties of the semiconductor such as breakdown voltage and lifetime. Capacitance-voltage measurements allow computation of the semiconductor doping level and uniformity. These measurements are successfully made on many materials including SiC, GaAs, GaN, InP, CdS, and InSb.

Related Research Articles

Diode Electronic component that only allows current to flow in one direction

A diode is a two-terminal electronic component that conducts current primarily in one direction ; it has low resistance in one direction, and high resistance in the other. A diode vacuum tube or thermionic diode is a vacuum tube with two electrodes, a heated cathode and a plate, in which electrons can flow in only one direction, from cathode to plate. A semiconductor diode, the most commonly used type today, is a crystalline piece of semiconductor material with a p–n junction connected to two electrical terminals. Semiconductor diodes were the first semiconductor electronic devices. The discovery of asymmetric electrical conduction across the contact between a crystalline mineral and a metal was made by German physicist Ferdinand Braun in 1874. Today, most diodes are made of silicon, but other semiconducting materials such as gallium arsenide and germanium are also used.

Thermistor Type of resistor whose resistance varies with temperature

A thermistor is a type of resistor whose resistance is strongly dependent on temperature, more so than in standard resistors. The word is a combination of thermal and resistor. Thermistors are widely used as inrush current limiters, temperature sensors, self-resetting overcurrent protectors, and self-regulating heating elements. An operational temperature range of a thermistor is dependent on the probe type and is typically between −100 ⁰C and 300 ⁰C

MOSFET Transistor used for amplifying or switching electronic signals

The metal–oxide–semiconductor field-effect transistor, also known as the metal–oxide–silicon transistor, is a type of insulated-gate field-effect transistor that is fabricated by the controlled oxidation of a semiconductor, typically silicon. The voltage of the covered gate determines the electrical conductivity of the device; this ability to change conductivity with the amount of applied voltage can be used for amplifying or switching electronic signals.

In solid-state physics, the work function is the minimum thermodynamic work needed to remove an electron from a solid to a point in the vacuum immediately outside the solid surface. Here "immediately" means that the final electron position is far from the surface on the atomic scale, but still too close to the solid to be influenced by ambient electric fields in the vacuum. The work function is not a characteristic of a bulk material, but rather a property of the surface of the material.

Schottky diode

The Schottky diode, also known as Schottky barrier diode or hot-carrier diode, is a semiconductor diode formed by the junction of a semiconductor with a metal. It has a low forward voltage drop and a very fast switching action. The cat's-whisker detectors used in the early days of wireless and metal rectifiers used in early power applications can be considered primitive Schottky diodes.

Electrowetting is the modification of the wetting properties of a surface with an applied electric field.

Schottky barrier Potential energy barrier in metal–semiconductor junctions

A Schottky barrier, named after Walter H. Schottky, is a potential energy barrier for electrons formed at a metal–semiconductor junction. Schottky barriers have rectifying characteristics, suitable for use as a diode. One of the primary characteristics of a Schottky barrier is the Schottky barrier height, denoted by ΦB. The value of ΦB depends on the combination of metal and semiconductor.

Deep-level transient spectroscopy (DLTS) is an experimental tool for studying electrically active defects in semiconductors. DLTS establishes fundamental defect parameters and measures their concentration in the material. Some of the parameters are considered as defect "finger prints" used for their identifications and analysis.

The term high-κ dielectric refers to a material with a high dielectric constant, as compared to silicon dioxide. High-κ dielectrics are used in semiconductor manufacturing processes where they are usually used to replace a silicon dioxide gate dielectric or another dielectric layer of a device. The implementation of high-κ gate dielectrics is one of several strategies developed to allow further miniaturization of microelectronic components, colloquially referred to as extending Moore's Law. Sometimes these materials are called "high-k", instead of "high-κ".

Power MOSFET MOSFET that can handle significant power levels

A power MOSFET is a specific type of metal–oxide–semiconductor field-effect transistor (MOSFET) designed to handle significant power levels. Compared to the other power semiconductor devices, such as an insulated-gate bipolar transistor (IGBT) or a thyristor, its main advantages are high switching speed and good efficiency at low voltages. It shares with the IGBT an isolated gate that makes it easy to drive. They can be subject to low gain, sometimes to a degree that the gate voltage needs to be higher than the voltage under control.

Capacitors are manufactured in many forms, styles, lengths, girths, and from many materials. They all contain at least two electrical conductors separated by an insulating layer. Capacitors are widely used as parts of electrical circuits in many common electrical devices.

An ohmic contact is a non-rectifying electrical junction: a junction between two conductors that has a linear current–voltage (I-V) curve as with Ohm's law. Low resistance ohmic contacts are used to allow charge to flow easily in both directions between the two conductors, without blocking due to rectification or excess power dissipation due to voltage thresholds.

Capacitance–voltage profiling is a technique for characterizing semiconductor materials and devices. The applied voltage is varied, and the capacitance is measured and plotted as a function of voltage. The technique uses a metal–semiconductor junction or a p–n junction or a MOSFET to create a depletion region, a region which is empty of conducting electrons and holes, but may contain ionized donors and electrically active defects or traps. The depletion region with its ionized charges inside behaves like a capacitor. By varying the voltage applied to the junction it is possible to vary the depletion width. The dependence of the depletion width upon the applied voltage provides information on the semiconductor's internal characteristics, such as its doping profile and electrically active defect densities., Measurements may be done at DC, or using both DC and a small-signal AC signal, or using a large-signal transient voltage.

Scanning capacitance microscopy (SCM) is a variety of scanning probe microscopy in which a narrow probe electrode is positioned in contact or close proximity of a sample's surface and scanned. SCM characterizes the surface of the sample using information obtained from the change in electrostatic capacitance between the surface and the probe.

Lau Wai Shing, also known as Wai Shing Lau or Michael Lau, is a Hong Kong electrical engineer and materials scientist. He worked on both Si-based and III-V based microelectronics.

In solid-state physics, a metal–semiconductor (M–S) junction is a type of electrical junction in which a metal comes in close contact with a semiconductor material. It is the oldest practical semiconductor device. M–S junctions can either be rectifying or non-rectifying. The rectifying metal–semiconductor junction forms a Schottky barrier, making a device known as a Schottky diode, while the non-rectifying junction is called an ohmic contact.

Conductive atomic force microscopy

Conductive atomic force microscopy (C-AFM) or current sensing atomic force microscopy (CS-AFM) is a mode in atomic force microscopy (AFM) that simultaneously measures the topography of a material and the electric current flow at the contact point of the tip with the surface of the sample. The topography is measured by detecting the deflection of the cantilever using an optical system, while the current is detected using a current-to-voltage preamplifier. The fact that the CAFM uses two different detection systems is a strong advantage compared to scanning tunneling microscopy (STM). Basically, in STM the topography picture is constructed based on the current flowing between the tip and the sample. Therefore, when a portion of a sample is scanned with an STM, it is not possible to discern if the current fluctuations are related to a change in the topography or to a change in the sample conductivity.

Semiconductor characterization techniques are used to characterize a semiconductor material or device. Some examples of semiconductor properties that could be characterized include the depletion width, carrier concentration, carrier generation and recombination rates, carrier lifetimes, defect concentration, and trap states.

Failure of electronic components Ways electronic components fail and prevention measures

Electronic components have a wide range of failure modes. These can be classified in various ways, such as by time or cause. Failures can be caused by excess temperature, excess current or voltage, ionizing radiation, mechanical shock, stress or impact, and many other causes. In semiconductor devices, problems in the device package may cause failures due to contamination, mechanical stress of the device, or open or short circuits.

Mott–Schottky plot

In semiconductor electrochemistry, a Mott–Schottky plot describes the reciprocal of the square of capacitance versus the potential difference between bulk semiconductor and bulk electrolyte. In many theories, and in many experimental measurements, the plot is linear. The use of Mott–Schottky plots to determine system properties is termed Mott–Schottky analysis.

References

  1. J. Moore, I. Lorkovic, and B. Gordon, “Rapid Methods of Characterizing Triazole Inhibitors for Copper and Cobalt Processes,” CMP Users Group Presentation, AVS Society, October 2005.
  2. D.K. Donald, "Experiments on Mercury-Silicon Schottky Barriers," JAP, 34, 1758 (1963)
  3. G. Abowitz and E. Arnold, "Simple Mercury Drop Electrode for MOS Measurements," Rev. Sci. Instrum., 38, 564 (1967)
  4. S. Arscott, “Electrowetting and semiconductors”, RSC Adv. 4, 29223-29238 (2014).”
  5. H.J. Hovel, "Si film electrical characterization in SOI substrates by the HgFET technique," Solid State Electronics, 47, 1311 (2003)