MEMS is the technology of microscopic devices incorporating both electronic and moving parts. MEMS are made up of components between 1 and 100 micrometres in size, and MEMS devices generally range in size from 20 micrometres to a millimetre, although components arranged in arrays can be more than 1000 mm2. They usually consist of a central unit that processes data and several components that interact with the surroundings.
A digital camera, also called a digicam, is a camera that captures photographs in digital memory. Most cameras produced today are digital, largely replacing those that capture images on photographic film. Digital cameras are now widely incorporated into mobile devices like smartphones with the same or more capabilities and features of dedicated cameras. High-end, high-definition dedicated cameras are still commonly used by professionals and those who desire to take higher-quality photographs.
A smartphone is a mobile device that combines the functionality of a traditional mobile phone with advanced computing capabilities. It typically has a touchscreen interface, allowing users to access a wide range of applications and services, such as web browsing, email, and social media, as well as multimedia playback and streaming. Smartphones have built-in cameras, GPS navigation, and support for various communication methods, including voice calls, text messaging, and internet-based messaging apps.
Secure Digital, officially abbreviated as SD, is a proprietary, non-volatile, flash memory card format the SD Association (SDA) developed for use in portable devices.
A mobile device, also referred to as a digital assistant, is a computer small enough to hold and operate in the hand. Mobile devices typically have a flat LCD or OLED screen, a touchscreen interface, and digital or physical buttons. They may also have a physical keyboard. Many mobile devices can connect to the Internet and connect with other devices, such as car entertainment systems or headsets, via Wi-Fi, Bluetooth, cellular networks, or near-field communication. Integrated cameras, the ability to place and receive voice and video telephone calls, video games, and Global Positioning System (GPS) capabilities are common. Power is typically provided by a lithium-ion battery. Mobile devices may run mobile operating systems that allow third-party applications to be installed and run.
A camera phone is a mobile phone which is able to capture photographs and often record video using one or more built-in digital cameras. It can also send the resulting image wirelessly and conveniently. The first commercial phone with color camera was the Kyocera Visual Phone VP-210, released in Japan in May 1999.
A handheld projector is an image projector in a handheld device. It was developed as a computer display device for compact portable devices such as mobile phones, personal digital assistants, and digital cameras, which have sufficient storage capacity to handle presentation materials but are too small to accommodate a display screen that an audience can see easily. Handheld projectors involve miniaturized hardware, and software that can project digital images onto a nearby viewing surface.
OmniVision Technologies Inc. is an American subsidiary of Chinese semiconductor device and mixed-signal integrated circuit design house Will Semiconductor. The company designs and develops digital imaging products for use in mobile phones, laptops, netbooks and webcams, security and surveillance cameras, entertainment, automotive and medical imaging systems. Headquartered in Santa Clara, California, OmniVision Technologies has offices in the US, Western Europe and Asia.
A three-dimensional integrated circuit is a MOS integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
A microlens is a small lens, generally with a diameter less than a millimetre (mm) and often as small as 10 micrometres (µm). The small sizes of the lenses means that a simple design can give good optical quality but sometimes unwanted effects arise due to optical diffraction at the small features. A typical microlens may be a single element with one plane surface and one spherical convex surface to refract the light. Because micro-lenses are so small, the substrate that supports them is usually thicker than the lens and this has to be taken into account in the design. More sophisticated lenses may use aspherical surfaces and others may use several layers of optical material to achieve their design performance.
Wafer-level packaging (WLP) is a process in integrated circuit manufacturing where packaging components are attached to an integrated circuit (IC) before the wafer – on which the IC is fabricated – is diced. In WLP, the top and bottom layers of the packaging and the solder bumps are attached to the integrated circuits while they are still in the wafer. This process differs from a conventional process, in which the wafer is sliced into individual circuits (dice) before the packaging components are attached.
Himax Technologies, Inc. is a fabless semiconductor manufacturer headquartered in Tainan City, Taiwan founded on 12 June 2001. The company is publicly traded and listed on the Nasdaq Stock Market under the symbol HIMX. Himax Technologies Limited functions as a holding under the Cayman Islands Companies Law.
Suss Microtec is a supplier of equipment and process solutions for the semiconductor, nano and microsystems technology and related markets with headquarters in Garching near Munich.
A back-illuminated sensor, also known as backside illumination (BI) sensor, is a type of digital image sensor that uses a novel arrangement of the imaging elements to increase the amount of light captured and thereby improve low-light performance.
Nokia PureView is the branding of a combination of technologies used in cameras of Nokia-branded smartphones, and previously, in phones by Microsoft Mobile. PureView was first introduced with Nokia 808 PureView.
The Nokia Lumia 620 is an entry-level smartphone designed, developed and marketed by Nokia. It is the successor to the Lumia 610, and is one of the first Nokia phones to implement Windows Phone 8 alongside the Nokia Lumia 920 and Nokia Lumia 820. Although sharing a similar name with the Lumia 610, the Lumia 620 is a major overhaul over its predecessor, employing a 1.0 GHz dual-core processor. It also has exchangeable back covers which come in black, white, magenta, yellow, cyan etc.
Advanced Semiconductor Engineering, Inc., also known as ASE Group, is a provider of independent semiconductor assembling and test manufacturing services, with its headquarters in Kaohsiung, Taiwan.
Fan-out wafer-level packaging is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions. Fan-out packaging is seen as a low cost advanced packaging alternative to packages that use silicon interposers, such as those seen in 2.5D and 3D packages.
The Sony Xperia 1 II is an Android smartphone manufactured by Sony Mobile. Part of Sony's Xperia series, the phone was announced along with the mid-range Xperia 10 II on February 24, 2020. Key upgrades over its predecessor, the Xperia 1, include support for 5G connectivity and Qi wireless charging, and a triple-lens camera which incorporates ZEISS-branded lenses with T✻ (T-Star) anti-reflective coating as well as technology brought over from Sony's Alpha camera lineup.
The Samsung Galaxy A41 is a mid-range Android smartphone developed by Samsung Electronics as part of their 2020 A-series smartphone lineup. It was announced on 18 March 2020, and first released in Europe on 22 May 2020 as the successor to the Galaxy A40. The phone comes preinstalled with Android 10 and Samsung’s custom One UI 2.1 software overlay.
