This is a list of UNISOC (formerly Spreadtrum) processors for use in smartphones, tablets, laptops, smartwatches and other devices.
Model number [1] | Fab | CPU | GPU | Memory technology | Wireless radio technologies | Released | Utilizing devices | ||||
---|---|---|---|---|---|---|---|---|---|---|---|
ISA | μarch | Cores | Freq. (MHz) | Cache | |||||||
SC6500 [2] | 40 nm | ARM9 | ARM9EJ-S | 1 | 208 | ? | — | Integrated 32 Mbit pSRAM | GSM850/EGSM900, DCS1800/PCS1900, GPRS class 12 | 2011 | List
|
SC6531 [3] [4] | ARM926 EJ-S | 312 | ? | Integrated 32/64 Mbit pSRAM up to 104 MHz | List
| ||||||
SC7701B [5] [6] | 460 | 32 KB L1 + 32 KB | LPDDR | GSM, quad-band WCDMA, HSDPA | 2013 | ||||||
SC9820E [7] | 28 nm HPC+ | ARMv8 | ARM Cortex-A53 | 2 | 1300 | ? | Mali-T820 @384 MHz | LPDDR2 up to 533 MHz LPDDR3 up to 667 MHz | GSM, WCDMA, TDD-LTE, FDD-LTE | 2018 | |
SC7731EF [8] | ARMv7 | ARM Cortex-A7 | 4 | 1300 | ? | Mali-T820 @600 MHz | LPDDR2/3 up to 533 MHz | GSM, EDGE, WCDMA, HSPA | ? | ||
UIS8910FF [9] | 28 nm | ARM Cortex-A5 | 1 | 500 | ? | — | up to 104 MHz pSRAM | GSM, GPRS, LTE Cat.1 Bis | ? | ||
T107 [10] | 22 nm | ARM Cortex-A7 | 1000 | ? | LPDDR2 | GSM, EDGE, WCDMA, HSPA, TDD-LTE, FDD-LTE | |||||
T117 [11] | ARM Cortex-A7 | ? | ? |
Model number [1] | Fab | CPU (ARMv7) | GPU | Memory technology | Wireless radio technologies | Released | Utilizing devices | |||
---|---|---|---|---|---|---|---|---|---|---|
μarch | Cores | Freq. (GHz) | Cache | |||||||
SC6815 [12] SC6815A | 40 nm | ARM Cortex-A7 | 1 | 1.2 | L1: 32 KB + 32 KB, L2: 256 KB | Mali-400 MP1 | Single- channel LPDDR2 333 MHz | Wi-Fi 802.11b/g/n, Bluetooth 4.0, GSM850/GSM900, DCS1800/PCS1900, GPRS Class 12, GPS, FM | 2012 | List
|
SC6820 [13] | ARM Cortex-A5 | 1.0 | ? | SDR/DDR SDRAM | ||||||
SC6821 | ? | 2014 | List
| |||||||
SC6825 [14] | 2 | 1.2 | L1: 32 KB + 32 KB, L2: 256 KB | Mali-400 MP2 | Single/dual- channel SDR/ LPDDR1/2 | 2012 | List
|
Model number [1] | Fab | CPU (ARMv7) | GPU | Memory technology | Wireless radio technologies | Released | Utilizing devices | |||
---|---|---|---|---|---|---|---|---|---|---|
μarch | Cores | Freq. (GHz) | Cache | |||||||
SC5735A [15] | ? | ARM Cortex-A7 | 4 | 1.2 | L1: 32 KB + 32 KB L2: 512 KB | Mali-400 MP2 | Dual-channel LPDDR1/2 or DDR3 | Wi-Fi, GPS, BT, FM, GSM, GPRS, EDGE Class 12, WCDMA, HSPA, HSDPA | 2014 | List
|
SC5735 [15] | ? | Mali-400 MP4 | ||||||||
SC7715 [16] | ? | 1 | L1: 32 KB + 32 KB L2: 256 KB | Mali-400 MP1 | Single-channel LPDDR2 333 MHz | GSM, GPRS, EDGE Class 12, WCDMA, HSPA, HSDPA | ? | List
| ||
SC7727S [17] | 28 nm HPm | 2 | Single/dual- channel LPDDR2/3 | Wi-Fi 802.11b/g/n, Bluetooth 2.1, GPS, FM, GSM, GPRS, EDGE Class 12, WCDMA, HSPA+, HSDPA | ? | List
| ||||
SC7730A [18] | ? | 4 | L1: 32 KB + 32 KB L2: 512 KB | Mali-400 MP2 | Single/dual- channel LPDDR1/2/3 | Wi-Fi 802.11b/g/n, Bluetooth 4.0, GPS, GSM, GPRS, EDGE Class 12, WCDMA, HSPA+, HSDPA | ? | List
| ||
SC7730S [19] | 28 nm HPm | 1.3 | Wi-Fi 802.11b/g/n, Bluetooth 4.0, GPS, FM, GSM, GPRS, EDGE Class 12, WCDMA, HSPA+, HSDPA, HSUPA | ? | List
| |||||
SC7731C | 1.2 | Mali-400 MP1 | Wi-Fi 802.11b/g/n, Bluetooth 4.0, GPS, FM, GSM, GPRS, EDGE Class 12, WCDMA, HSDPA, HSUPA | 2014 | List
| |||||
SC7731G [20] | 1.3 | Mali-400 MP2 | List
| |||||||
SC7731E [21] | Mali-T820 MP1 @600 MHz | LPDDR2/3 @ 533 MHz | Wi-Fi 802.11b/g/n, Bluetooth 4.2, GPS, FM, GSM, GPRS, EDGE Class 12, TD-SCDMA, HSPA+, WCDMA, HSPA(+) | 2018 | List
| |||||
SC7735S [22] | 40 nm | 1.2 | Mali-400 MP4 | Single/dual- channel LPDDR1/2/3 | Wi-Fi 802.11b/g/n, Bluetooth 4.0, GPS, GSM, GPRS, EDGE Class 12, WCDMA, HSPA+, HSDPA | ? | List
| |||
SC8735S [23] | ? | Wi-Fi 802.11b/g/n, Bluetooth 4.0, GPS, FM, GSM, GPRS, EDGE, TD-SCDMA, HSPA+, WCDMA, HSPA(+) | ? | |||||||
SC8810 [24] | 40 nm | ARM Cortex-A5 | 1 | 1.0 | ? | Mali-400 | Single/dual-channel DDR1 | Wi-Fi 802.11b/g/n, Bluetooth 4.0, GPS, FM, GSM, GPRS Class 12, EDGE, TD-SCDMA, TD-HSPA | ? | List
|
SC8825 [25] | ? | 2 | 1.2 | L1: 32 KB + 32 KB | Mali-400 MP2 | Single/dual- channel LPDDR1/2 | GSM, GPRS, EDGE, TD-SCDMA, HSDPA, HSUPA, HSPA+ | ? | List
| |
SC8830 SC8830A [26] | 28 nm HPm | ARM Cortex-A7 | 4 | L1: 32 KB + 32 KB L2: 512 KB | Single/dual- channel LPDDR1/2/3 | Wi-Fi 802.11b/g/n, Bluetooth 4.0, GPS, FM, GSM, GPRS, EDGE, TD-SCDMA, HSPA+ | ? | List
| ||
SC8831G [27] | 1.4 | ? | ||||||||
SC8835S [28] | 1.2 | Mali-400 MP4 | ? |
Model Number | Fab | CPU | GPU | Memory technology | Wireless radio technologies | Released | Utilizing devices | |||
---|---|---|---|---|---|---|---|---|---|---|
ISA | μarch | Cores | Freq. (GHz) | |||||||
SC9830A | 28 nm HPm | ARMv7-A | ARM Cortex-A7 | 4 | 1.5 | Mali-400 MP2 @ 512 MHz | Single/dual-channel LPDDR1/2/3 | GSM Multi-Mode, WCDMA/TD-SCDMA/LTE, Bluetooth 4.0, WiFi 802.11b/g/n, GPS, FM | ? | List
|
SC9830 | 1.2 | Mali-400 MP2 | Q4 2015 | |||||||
SC9832A | 1.3 | Mali-400 MP2 @ 512 MHz | 2016 | List
| ||||||
SC9850 | Mali-T820 MP1 | Single/dual-channel LPDDR3/4 | 2018 | List
| ||||||
SC9850K [29] | 2018 | |||||||||
SC9832E [30] | ARMv8-A | ARM Cortex-A53 | 1.4 | Mali-T820 MP1 @680 MHz | LPDDR2 @ 533 MHz, LPDDR3 @ 666 MHz | 2018 | List
| |||
SC9860 | 16 nm FFC | 8 | 2.0 | Mali-T880 MP4 | ? | |||||
SC9860GV | 4 + 4 | 2.0 + 1.25 | TD-LTE / FDD LTE / TD-SCDMA / WCDMA / EGG LTE Category 7 (DL:300 Mbit/s., UL:100 Mbit/s) | ? | ||||||
SC9863 [31] | 28 nm HPC+ | ARM Cortex-A55 | 8 | 1.6 + 1.2 | PowerVR GE 8322 @550 MHz | LTE Cat 7 (TDD-LTE / FDD-LTE / TD-SCDMA / WCDMA / EGG) | Q1 2019 | List
| ||
SC9863A [32] | LPDDR3/4/4X @ 933 MHz | Q4 2019 | List
| |||||||
SC9853I | 14 nm FF | x86-64 | Intel Airmont | 8 | 1.8 | Mali-T820 MP2 | LTE Cat 7 (TDD-LTE / FDD-LTE / TD-SCDMA / WCDMA / EGG) | Q2 2017 | List
| |
SC9861G-IA [33] | 8 | 2.0 | PowerVR GT7200 | LTE Cat 7 (TDD-LTE / FDD-LTE / TD-SCDMA / WCDMA / EGG) | Q2 2017 | |||||
Tiger T310 | 12 nm FF | ARMv8.2-A | ARM Cortex-A75 | 1 | 2.0 | PowerVR GE8300 @800 MHz | LPDDR3 @ 933 MHz, LPDDR4, LPDDR4X @ 1333 MHz | (TDD-LTE / FDD-LTE / TD-SCDMA / WCDMA / CDMA / GSM) | Q2 2019 | List
|
ARM Cortex-A55 | 3 | 1.8 | ||||||||
Tiger T603 | 28 nm | 8 | 1.8 | - | LPDDR4, LPDDR4X | (TDD-LTE / FDD-LTE / WCDMA / CDMA / GSM) | - | |||
Tiger T606 | 12 nm FF | ARM Cortex-A75 | 2 | 1.6 | Mali-G57 MC1 @650 MHz | LPDDR4X @ 1600 MHz | (TDD-LTE / FDD-LTE / TD-SCDMA / WCDMA / CDMA / GSM) | Q3 2021 | List
| |
ARM Cortex-A55 | 6 | |||||||||
Tiger T610 | ARM Cortex-A75 | 2 | 1.8 | Mali-G52 MC2 @614.4 MHz | LPDDR3 @ 933 MHz, LPDDR4, LPDDR4X @ 1600 MHz | Q4 2019 | List
| |||
ARM Cortex-A55 | 6 | |||||||||
Tiger T612 | ARM Cortex-A75 | 2 | Mali-G57 MC1 | LPDDR3 @ 933 MHz, LPDDR4, LPDDR4X @ 1866 MHz | Q1 2022 | List
| ||||
ARM Cortex-A55 | 6 | |||||||||
Tiger T616 | ARM Cortex-A75 | 2 | 2.0 | Mali-G57 MC1 @750 MHz | LPDDR4X @ 1866 MHz | Q3 2021 | List
| |||
ARM Cortex-A55 | 6 | 1.8 | ||||||||
Tiger T618 | ARM Cortex-A75 | 2 | 2.0 | Mali-G52 MC2 @850 MHz | Dual-channel LPDDR3 @ 933 MHz, LPDDR4, LPDDR4X @ 1866 MHz | Q3 2019 | ||||
ARM Cortex-A55 | 6 | |||||||||
Tiger T619 [34] | ARM Cortex-A75 | 2 | 2.2 | Mali-G57 MC1 @850 MHz | LPDDR4X @ 1866 MHz | Q3 2023 | List
| |||
ARM Cortex-A55 | 6 | 1.8 | ||||||||
Tiger T700 | ARM Cortex-A75 | 2 | 1.8 | Mali-G52 MP2 @850 MHz | Q1 2021 | List
| ||||
ARM Cortex-A55 | 6 | |||||||||
Tiger T710 | ARM Cortex-A75 | 4 | PowerVR GM 9446 @800 MHz | LPDDR4/4X/4Y @ 1866 MHz | Q3 2019 | |||||
ARM Cortex-A55 | 4 |
Model number | Fab | CPU (ARMv8) | GPU | Memory technology | Wireless radio technologies | Released | Utilizing devices |
---|---|---|---|---|---|---|---|
Tanggula T740 (Tiger T7510) [36] [37] [38] | 12 nm FF TSMC | 4 + 4 cores (1.8 GHz Cortex-A75 + 1.8 GHz Cortex-A55) | PowerVR GM 9446 @800 MHz | LPDDR4/4X/4Y up to 1866 MHz | Wi-Fi 802.11b/g/n/ac, Bluetooth 5.0, FM, GPS, NSA, SA, GSM, WCDMA, LTE, TDD-LTE, FDD-LTE, Glonass, Beidou, Galileo | Q1 2020 | List
|
Tanggula T750 [39] | 6 nm EUV TSMC | 2 + 6 cores (2.0 GHz Cortex-A76 + 1.8 GHz Cortex-A55) | Mali-G57 MP2 @680MHz | LPDDR4X, eMMC5.1, UFS3.1 | Q2 2023 | ||
Tanggula T760 [40] [41] | 4 + 4 cores (2.2 GHz Cortex-A76 + 2.0 GHz Cortex-A55) | Mali-G57 MP4 @650 MHz | Dual-channel LPDDR4/4X up to 2133 MHz | Q2 2021 | List
| ||
Tanggula T770 (Tiger T7520) [42] [43] [44] [45] [46] | 1 + 3 + 4 cores (2.5 GHz Cortex-A76 + 2.2 GHz Cortex-A76 + 2.0 GHz Cortex-A55) | Mali-G57 MP4 @780 MHz | Q1 2020 | List
| |||
Tanggula T820 [47] | 1 + 3 + 4 cores (2.7 GHz Cortex-A76 + 2.3 GHz Cortex-A76 + 2.1 GHz Cortex-A55) | Q4 2022 | ZTE Nubia Neo 5G | ||||
Model number | Fab | ISA | CPU | CPU cache | GPU | Memory technology | Wireless radio technologies | Released | Utilizing devices |
---|---|---|---|---|---|---|---|---|---|
SC8803G [1] | 40 nm LP | ARM9 | Up to 256 MHz single-core ARM926EJ-S | ? | — | DDR1 | GSM, GPRS, EDGE Class 12, TD-SCDMA, LTE 400 2300MHZ | ? |
Model number | Fab | ISA | CPU | CPU cache | GPU | Memory technology | Wireless radio technologies | Released | Utilizing devices |
---|---|---|---|---|---|---|---|---|---|
SC9610 [48] | 40 nm LP | ? | ? | ? | No GPU | ? | Multiband TD-LTE and TD-SCDMA and quad-band EDGE/GPRS/GSM Downlink speeds of 100 Mbit/s Uplink speeds of 50 Mbit/s |
Model number | Fab | ISA | CPU | CPU cache | GPU | Memory technology | Wireless radio technologies | Released | Utilizing devices |
---|---|---|---|---|---|---|---|---|---|
Makalu IVY510 | 12 nm FF TSMC | ? | ? | ? | ? | ? | 2G/3G/4G/5G 3GPP Release 15 compliant and support both SA and NSA network configurations | TBC |
Model Number | Fab | Cores | Memory |
---|---|---|---|
8521E | 28 nm HPC+ | 2 | LPDDR2, LPDDR3 |
8541E | 28 nm HPC+ | 4 | LPDDR2, LPDDR3 |
W307 | 28nn HPC+ TSMC | 1 | LPDDR2 |
W517 | 12 nm | 4 | LPDDR4X |
Model Number | Fab | Cores | Memory | Additional |
---|---|---|---|---|
8541E | 28 nm HPC+ | 4 | LPDDR2, LPDDR3 | Supports maximum HD+ resolution Supports USB HUB function (2HOST or 1HOST+4 Device) |
8581E | 28 nm HPC+ | 8 | LPDDR3, LPDDR4/4X | |
A7862E | 12 nm | 8 | LPDDR3, LPDDR4/4X | Bluetooth 5 BLE GPS + Beidou + Glonass / GPS + Galileo + Glonass 3× SDIO 3.0 / USB 2.0 Type-C, USB 1.1 and OTG 2.0 / 4× SPI / 4× I2S / 8× I2C / 7× UART 150 GPIO |
V8811 | 22 nm | 1 | Integrated 16 Mb/32M Flash | Supports 3GPP NB-IoT R13/R14/R15/R16 |
8910DM | 28 nm | 2 | Integrated 64 Mb SPI Nor and 128 Mb PSRAM | VoLTE, 0.3M camera, AUDIO (with ADC/DAC), 2x USB (Host/Slave, HUB), 3x SDIO, 3x I2C, 3x UART, 2x PWM |
8563 | 28 nm | 4 | LPDDR2, LPDDR3 | 4× SDIO 3.0 / USB 2.0 High speed, OTG/UART/SPI/I2S/I2C/GPIO 4-core 1.3 GHz Arm Cortex-A7 processor |
V510 | 12 nm | 2 | LPDDR4/X | Supports TDD NR/FDD NR/FDD-LTE/TDD-LTE/TD-SCDMA/WCDMA/GSM Supports Sub-6 GHz, n78/n41/n79/n1/n28 and n77/n3/n8/n20 and other global mainstream frequency bands Supports VoNR technology and VoLTE in 5G SA mode |
Model Number | Fab | Cores | Memory | Additional |
---|---|---|---|---|
5981 | 40 nm | 1 | PSRAM | ARM Cortex-M4, integrated MPU 802.11b/g/n, support for AP/STA USB2.0/SDIO 192K SRAM available to users, Support for plug-in PSRAM |
V5663 | 22 nm | 2 | PSRAM | Wi-Fi 2.4/5G dual-frequency, MU-MIMO Supports Bluetooth AOA AOD+Wi-Fi RTT fusion positioning Bluetooth 5.0: Dual mode, long distance, Mesh, AoD |
Model Number | Fab | Cores | Memory | Additional |
---|---|---|---|---|
6710W | 22 nm | 2 | DDR2 64Mb*16 | Supports maximum 10bit FULL HD LVDS screen Built-in FHD TCON 2x USB 2.0, support for USB HUB |
7605 | 40 nm | 2 | DDR3 64Mb*16 | MPEG1/2/4, H.264/H.265 video decode WAVE/WMA/AAC/AC3/MPEG/FLAC audio decode Up to FHD image output |
NTT Docomo, Inc., also known as Docomo, is a Japanese mobile phone operator owned by the Nippon Telegraph and Telephone (NTT). The name is officially an abbreviation of the phrase, "do communications over the mobile network", and is also from a compound word dokomo, meaning "everywhere" in Japanese. The company is headquartered in Sanno Park Tower, Nagatachō, Chiyoda, Tokyo. Docomo provides phone, video phone, i-mode (internet), and mail services. It is the largest wireless carrier in Japan, with 82.632 million subscribers as of March 2021.
Xilinx, Inc. was an American technology and semiconductor company that primarily supplied programmable logic devices. The company is known for inventing the first commercially viable field-programmable gate array (FPGA). It also created the first fabless manufacturing model.
Saskatchewan Telecommunications Holding Corporation, operating as SaskTel, is a Canadian crown-owned telecommunications firm based in the province of Saskatchewan. Owned by the provincial government, it provides wireline and wireless communications services, including landline telephone, mobile networks, broadband internet, IPTV, and security services. Through a subsidiary, SaskTel International, the company has also worked on telecom infrastructure projects in countries such as Argentina and the Bahamas, as well as being the lead implementation company for the communication and control systems of the Channel Tunnel between England and France.
KT Corporation, formerly Korea Telecom, is a South Korean telecommunications company. KT is the second-largest wireless carrier in South Korea, with 16.493 million subscribers as of Q4 2017.
UNISOC, formerly Spreadtrum Communications, Inc., is a Chinese fabless semiconductor company headquartered in Shanghai which produces chipsets for mobile phones. UNISOC develops its business in two major fields - consumer electronics and industrial electronics, including smartphones, feature phones, smart audio systems, smart wear and other application fields; Industrial electronics cover the fields such as LAN IoT, WAN IoT and smart display.
Snapdragon is a suite of system-on-a-chip (SoC) semiconductor products for mobile devices designed and marketed by Qualcomm Technologies Inc. The Snapdragon's central processing unit (CPU) uses the ARM architecture. As such, Qualcomm often refers to the Snapdragon as a "mobile platform". Snapdragon semiconductors are embedded in devices of various systems, including vehicles, Android, Windows Phone and netbooks. In addition to the processors, the Snapdragon line includes modems, Wi-Fi chips and mobile charging products.
Verizon Communications Inc., commonly known as Verizon, is an American multinational telecommunications conglomerate. The company is incorporated in Delaware, and headquartered at 1095 Avenue of the Americas in Midtown Manhattan, New York City. Verizon's capital stock is a component of the Dow Jones Industrial Average. It is the world's second-largest telecommunications company by revenue.
In telecommunications, 5G is the fifth-generation technology standard for cellular networks, which cellular phone companies began deploying worldwide in 2019, and is the successor to 4G technology that provides connectivity to most current mobile phones.
The Samsung Exynos, formerly Hummingbird (Korean: 엑시노스), is a series of ARM-based system-on-chips developed by Samsung Electronics' System LSI division and manufactured by Samsung Foundry. It is a continuation of Samsung's earlier S3C, S5L and S5P line of SoCs.
The Mali and Immortalis series of graphics processing units (GPUs) and multimedia processors are semiconductor intellectual property cores produced by Arm Holdings for licensing in various ASIC designs by Arm partners.
Redmi is a subsidiary company owned by the Chinese electronics company Xiaomi. It was first announced in July 2013 as a budget smartphone line, and became a separate sub-brand of Xiaomi in 2019 with entry-level and mid-range devices, while Xiaomi itself produces upper-range and flagship Xiaomi phones.
Nokia Series 30+ is a software platform and application user interface used for Nokia-branded mobile devices. The platform was introduced by Nokia in September 2013, first appearing on the Nokia 108, and has been the main Nokia feature phone operating system after the end of the Series 30 and Series 40 platforms in 2014. Despite the similar name and user interface, S30+ is technically completely different and unrelated to S30.
Android Go products were first showcased at MWC 2018 with six products: Nokia 1, ZTE Tempo Go, Alcatel 1X, General Mobile GM8 Go, Lava Z50, and Micromax Bharat Go. The Blu Vivo Go became the first Android Go device with Android Pie Go edition.
Tsinghua Unigroup Co., Ltd. is a state-owned Chinese technology and semiconductor manufacturer that also supplies digital infrastructure and services to domestic and global markets. Based in Beijing, it is among the country's largest technology conglomerates; subsidiaries include UNISOC, China's largest mobile phone chip designer. Other core subsidies design and manufacture network equipment and server and storage products, and produce system integration, network security and software applications.
iQOO Communication Technology Co.Ltd is a Chinese consumer electronics manufacturer headquartered in Dongguan, Guangdong. The company was founded on 30 January 2019 as a subsidiary of the consumer electronics manufacturer Vivo based in the same city.
Ting Mobile is an American mobile virtual network operator owned by Dish Wireless. Originally established in February 2012 by Tucows, Ting provides cellular service in the United States using the T-Mobile and Verizon networks. The service is sold off-contract with billing that adjusts the cost of service based on actual customer usage.