Power module

Last updated
High power IGBTs (here a 3300V, 1200A switch) are obtained by connecting tens of dies in parallel in a power module. IGBT 3300V 1200A Mitsubishi.jpg
High power IGBTs (here a 3300V, 1200A switch) are obtained by connecting tens of dies in parallel in a power module.
Opened IGBT module; different semiconductor dies are connected via wire bonds while external connectors are connected to lead-frame structures IGBT 2441.JPG
Opened IGBT module; different semiconductor dies are connected via wire bonds while external connectors are connected to lead-frame structures

A power module or power electronic module provides the physical containment for several power components, usually power semiconductor devices. These power semiconductors (so-called dies) are typically soldered or sintered on a power electronic substrate that carries the power semiconductors, provides electrical and thermal contact and electrical insulation where needed. Compared to discrete power semiconductors in plastic housings as TO-247 or TO-220, power packages provide a higher power density and are in many cases more reliable.

Contents

Module Topologies

Besides modules that contain a single power electronic switch (as MOSFET, IGBT, BJT, Thyristor, GTO or JFET) or diode, classical power modules contain multiple semiconductor dies that are connected to form an electrical circuit of a certain structure, called topology. Modules also contain other components such as ceramic capacitors to minimize switching voltage overshoots and NTC thermistors to monitor the module's substrate temperature. Examples of broadly available topologies implemented in modules are:

Electrical Interconnection Technologies

Additional to the traditional screw contacts the electrical connection between the module and other parts of the power electronic system can also be achieved by pin contacts (soldered onto a PCB), press-fit contacts pressed into PCB vias, spring contacts that inherently press on contact areas of a PCB or by pure pressure contact where corrosion-proof surface areas are directly pressed together. [4] Press-fit pins achieve a very high reliability and ease the mounting process without the need for soldering. [5] Compared to press-fit connections, spring contacts have the benefit of allowing easy and non-destructive removal of the connection several times, as for inspection or replacement of a module, for instance. [6] Both contact types have rather limited current-carrying capability due to their comparatively low cross-sectional area and small contact surface. Therefore, modules often contain multiple pins or springs for each of the electrical power connections.

Current Research and Development

The current focus in R&D is on cost reduction, increase of power density, increase of reliability and reduction of parasitic lumped elements. These parasitics are unwanted capacitances between circuit parts and inductances of circuit traces. Both can have negative effects on the electromagnetic radiation (EMR) of the module if it is operated as an inverter, for instance. Another problem connected to parasitics is their negative impact on the switching behavior and the switching loss  [ de ] of the power semiconductors. Therefore, manufacturers work on minimizing the parasitic elements of their modules while keeping cost low and maintain a high degree of interchangeability of their modules with those of a second source (other manufacturer). A further aspect for optimization is the so-called thermal path between the heat source (the dies) and the heat-sink. The heat has to pass through different physical layers such as solder, DCB, baseplate, thermal interface material (TIM) and the bulk of the heat-sink, until it is transferred to a gaseous medium such as air or a fluid medium such as water or oil. Since modern silicon-carbide power semiconductors show a larger power density, the requirements for heat transfer are increasing.

Applications

Power modules are used for power conversion equipment such as industrial motor drives, embedded motor drives, uninterruptible power supplies, AC-DC power supplies and in welder power supplies.

Power modules are also widely found in inverters for renewable energies as wind turbines, solar power panels, tidal power plants and electric vehicles (EVs).

History

The first potential-free power module was introduced into the market by Semikron in 1975. [7] It is still in production, which gives an idea about the lifecycles of power modules.

Manufacturers

See also

Related Research Articles

<span class="mw-page-title-main">Diode</span> Two-terminal electronic component

A diode is a two-terminal electronic component that conducts current primarily in one direction. It has low resistance in one direction and high resistance in the other.

<span class="mw-page-title-main">Transistor</span> Solid-state electrically operated switch also used as an amplifier

A transistor is a semiconductor device used to amplify or switch electrical signals and power. It is one of the basic building blocks of modern electronics. It is composed of semiconductor material, usually with at least three terminals for connection to an electronic circuit. A voltage or current applied to one pair of the transistor's terminals controls the current through another pair of terminals. Because the controlled (output) power can be higher than the controlling (input) power, a transistor can amplify a signal. Some transistors are packaged individually, but many more in miniature form are found embedded in integrated circuits. Because transistors are the key active components in practically all modern electronics, many people consider them one of the 20th century's greatest inventions.

<span class="mw-page-title-main">Rectifier</span> Electrical device that converts AC to DC

A rectifier is an electrical device that converts alternating current (AC), which periodically reverses direction, to direct current (DC), which flows in only one direction. The reverse operation is performed by an inverter.

<span class="mw-page-title-main">Insulated-gate bipolar transistor</span> Type of solid state switch

An insulated-gate bipolar transistor (IGBT) is a three-terminal power semiconductor device primarily forming an electronic switch. It was developed to combine high efficiency with fast switching. It consists of four alternating layers (P–N–P–N) that are controlled by a metal–oxide–semiconductor (MOS) gate structure.

<span class="mw-page-title-main">Thyristor</span> Type of solid state switch

A thyristor is a solid-state semiconductor device with four layers of alternating P- and N-type materials used for high-power applications. It acts as a bistable switch. There are two designs, differing in what triggers the conducting state. In a three-lead thyristor, a small current on its gate lead controls the larger current of the anode-to-cathode path. In a two-lead thyristor, conduction begins when the potential difference between the anode and cathode themselves is sufficiently large. The thyristor continues conducting until the voltage across the device is reverse-biased or the voltage is removed, or through the control gate signal on newer types.

<span class="mw-page-title-main">Power inverter</span> Device that changes direct current (DC) to alternating current (AC)

A power inverter, inverter, or invertor is a power electronic device or circuitry that changes direct current (DC) to alternating current (AC). The resulting AC frequency obtained depends on the particular device employed. Inverters do the opposite of rectifiers which were originally large electromechanical devices converting AC to DC.

<span class="mw-page-title-main">Switched-mode power supply</span> Power supply with switching regulator

A switched-mode power supply (SMPS), also called switching-mode power supply, switch-mode power supply, switched power supply, or simply switcher, is an electronic power supply that incorporates a switching regulator to convert electrical power efficiently.

<span class="mw-page-title-main">Schottky diode</span> Semiconductor diode

The Schottky diode, also known as Schottky barrier diode or hot-carrier diode, is a semiconductor diode formed by the junction of a semiconductor with a metal. It has a low forward voltage drop and a very fast switching action. The cat's-whisker detectors used in the early days of wireless and metal rectifiers used in early power applications can be considered primitive Schottky diodes.

A power semiconductor device is a semiconductor device used as a switch or rectifier in power electronics. Such a device is also called a power device or, when used in an integrated circuit, a power IC.

<span class="mw-page-title-main">Power electronics</span> Technology of power electronics

Power electronics is the application of electronics to the control and conversion of electric power.

<span class="mw-page-title-main">Electronic component</span> Discrete device in an electronic system

An electronic component is any basic discrete electronic device or physical entity part of an electronic system used to affect electrons or their associated fields. Electronic components are mostly industrial products, available in a singular form and are not to be confused with electrical elements, which are conceptual abstractions representing idealized electronic components and elements. A datasheet for an electronic component is a technical document that provides detailed information about the component's specifications, characteristics, and performance.

<span class="mw-page-title-main">Power MOSFET</span> MOSFET that can handle significant power levels

A power MOSFET is a specific type of metal–oxide–semiconductor field-effect transistor (MOSFET) designed to handle significant power levels. Compared to the other power semiconductor devices, such as an insulated-gate bipolar transistor (IGBT) or a thyristor, its main advantages are high switching speed and good efficiency at low voltages. It shares with the IGBT an isolated gate that makes it easy to drive. They can be subject to low gain, sometimes to a degree that the gate voltage needs to be higher than the voltage under control.

An induction heater is a key piece of equipment used in all forms of induction heating. Typically an induction heater operates at either medium frequency (MF) or radio frequency (RF) ranges.

<span class="mw-page-title-main">Active rectification</span>

Active rectification, or synchronous rectification, is a technique for improving the efficiency of rectification by replacing diodes with actively controlled switches, usually power MOSFETs or power bipolar junction transistors (BJT). Whereas normal semiconductor diodes have a roughly fixed voltage drop of around 0.5 to 1 volts, active rectifiers behave as resistances, and can have arbitrarily low voltage drop.

<span class="mw-page-title-main">Semikron</span>

Semikron is a German-based independent manufacturer of power semiconductor components. The company was founded in 1951 by Dr. Friedrich Josef Martin in Nuremberg. In 2019, the company had a staff of more than 3,000 people in 24 subsidiaries (world-wide) with production sites in Germany, Brazil, China, France, India, Italy, Slovakia, and the USA.

A gate driver is a power amplifier that accepts a low-power input from a controller IC and produces a high-current drive input for the gate of a high-power transistor such as an IGBT or power MOSFET. Gate drivers can be provided either on-chip or as a discrete module. In essence, a gate driver consists of a level shifter in combination with an amplifier. A gate driver IC serves as the interface between control signals and power switches. An integrated gate-driver solution reduces design complexity, development time, bill of materials (BOM), and board space while improving reliability over discretely-implemented gate-drive solutions.

The following outline is provided as an overview of and topical guide to electronics:

Josef Lutz is a German physicist and electrical engineer.

<span class="mw-page-title-main">Chip on board</span> Method of circuit board manufacture

Chip on board (COB) is a method of circuit board manufacturing in which the integrated circuits (e.g. microprocessors) are attached (wired, bonded directly) to a printed circuit board, and covered by a blob of epoxy. Chip on board eliminates the packaging of individual semiconductor devices, which allows a completed product to be less costly, lighter, and more compact. In some cases, COB construction improves the operation of radio frequency systems by reducing the inductance and capacitance of integrated circuit leads.

References

  1. "Power Modules Products | Vincotech".
  2. http://www.power-mag.com/pdf/feature_pdf/1418228828_Vincotech_Feature_0714_Layout_1.pdf [ bare URL PDF ]
  3. "Power Modules Products | Vincotech".
  4. M. Meisser, D. Hamilton and P. Mawby (2014). DCB-based low-inductive SiC modules for high frequency operation. pp. 1–10. ISBN   9783800735785 via ResearchGate.{{cite book}}: |work= ignored (help)
  5. http://www.infineon.com/pressfit-product-information [ dead link ]
  6. http://www.semikron.com/dl/service-support/downloads/download/semikron-flyer-skim-2014-04-08.html%5B%5D
  7. https://www.semikron-danfoss.com/dl/service-support/downloads/download/semikron-application-manual-power-semiconductors-english-en-2015.pdf
  8. "Home". vincotech.com.
  9. "Power Semiconductors | Fuji Electric".