A transistor is a semiconductor device used to amplify or switch electrical signals and power. It is one of the basic building blocks of modern electronics. It is composed of semiconductor material, usually with at least three terminals for connection to an electronic circuit. A voltage or current applied to one pair of the transistor's terminals controls the current through another pair of terminals. Because the controlled (output) power can be higher than the controlling (input) power, a transistor can amplify a signal. Some transistors are packaged individually, but many more in miniature form are found embedded in integrated circuits.
In microelectronics, a dual in-line package, is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads ; eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages.
A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.
Solid Logic Technology (SLT) was IBM's method for hybrid packaging of electronic circuitry introduced in 1964 with the IBM System/360 series of computers and related machines. IBM chose to design custom hybrid circuits using discrete, flip chip-mounted, glass-encapsulated transistors and diodes, with silk-screened resistors on a ceramic substrate, forming an SLT module. The circuits were either encapsulated in plastic or covered with a metal lid. Several of these SLT modules were then mounted on a small multi-layer printed circuit board to make an SLT card. Each SLT card had a socket on one edge that plugged into pins on the computer's backplane.
Rework is the term for the refinishing operation or repair of an electronic printed circuit board (PCB) assembly, usually involving desoldering and re-soldering of surface-mounted electronic components (SMD). Mass processing techniques are not applicable to single device repair or replacement, and specialized manual techniques by expert personnel using appropriate equipment are required to replace defective components; area array packages such as ball grid array (BGA) devices particularly require expertise and appropriate tools. A hot air gun or hot air station is used to heat devices and melt solder, and specialised tools are used to pick up and position often tiny components.
A DIN rail is a metal rail of a standard type widely used for mounting circuit breakers and industrial control equipment inside equipment racks. These products are typically made from cold rolled carbon steel sheet with a zinc-plated or chromated bright surface finish. Although metallic, they are meant only for mechanical support and are not used as a busbar to conduct electric current, though they may provide a chassis grounding connection.
A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual devices, such as semiconductor devices and passive components, bonded to a substrate or printed circuit board (PCB). A PCB having components on a Printed Wiring Board (PWB) is not considered a true hybrid circuit according to the definition of MIL-PRF-38534.
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge. Product safety standards may dictate particular features of a consumer product, for example, external case temperature or grounding of exposed metal parts. Prototypes and industrial equipment made in small quantities may use standardized commercially available enclosures such as card cages or prefabricated boxes. Mass-market consumer devices may have highly specialized packaging to increase consumer appeal. Electronic packaging is a major discipline within the field of mechanical engineering.
Storage Module Drive (SMD) is a family of storage devices that were first shipped by Control Data Corporation in December 1973 as the CDC 9760 40 MB (unformatted) storage module disk drive. The CDC 9762 80 MB variant was announced in June 1974 and the CDC 9764 150 MB and the CDC 9766 300 MB variants were announced in 1975. A non-removable media variant family of 12, 24 and 48 MB capacity, the MMD, was then announced in 1976. This family's interface, SMD, derived from the earlier Digital RP0x interface, was documented as ANSI Standard X3.91M - 1982, Storage Module Interfaces with Extensions for Enhanced Storage Module Interfaces.
Metal electrode leadless face (MELF) is a type of leadless cylindrical electronic surface mount device that is metallized at its ends. MELF devices are usually diodes and resistors.
High power light-emitting diodes (LEDs) can use 350 milliwatts or more in a single LED. Most of the electricity in an LED becomes heat rather than light. If this heat is not removed, the LEDs run at high temperatures, which not only lowers their efficiency, but also makes the LED less reliable. Thus, thermal management of high power LEDs is a crucial area of research and development. It is necessary to limit both the junction and the phosphor particles temperatures to a value that will guarantee the desired LED lifetime.
GVfs is GNOME's userspace virtual filesystem designed to work with the I/O abstraction of GIO, a library available in GLib since version 2.15.1. It installs several modules that are automatically used by applications using the APIs of libgio. There is also FUSE support that allows applications not using GIO to access the GVfs filesystems.
Integrated passive devices (IPDs), also known as integrated passive components (IPCs) or embedded passive components (EPC), are electronic components where resistors (R), capacitors (C), inductors (L)/coils/chokes, microstriplines, impedance matching elements, baluns or any combinations of them are integrated in the same package or on the same substrate. Sometimes integrated passives can also be called as embedded passives, and still the difference between integrated and embedded passives is technically unclear. In both cases passives are realized in between dielectric layers or on the same substrate.
Thick-film technology is used to produce electronic devices/modules such as surface mount devices modules, hybrid integrated circuits, heating elements, integrated passive devices and sensors. Main manufacturing technique is screen printing (stenciling), which in addition to use in manufacturing electronic devices can also be used for various graphic reproduction targets. It became one of the key manufacturing/miniaturisation techniques of electronic devices/modules during 1950s. Typical film thickness – manufactured with thick film manufacturing processes for electronic devices – is 0.0001 to 0.1 mm.
A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers before being diced into die, tested, and packaged. The package provides a means for connecting it to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader. There are thousands of package types in use. Some are defined by international, national, or industry standards, while others are particular to an individual manufacturer.
An LED strip light is a flexible circuit board populated by surface mounted light-emitting diodes and other components that usually comes with an adhesive backing. Traditionally, strip lights had been used solely in accent lighting, backlighting, task lighting, and decorative lighting applications. Increased luminous efficacy and higher-power SMDs have allowed LED strip lights to be used in applications such as high brightness task lighting, fluorescent and halogen lighting fixture replacements, indirect lighting applications, ultraviolet (UV) inspection during manufacturing processes, set and costume design, and even growing plants.
Chip on board (COB) is a method of circuit board manufacturing in which the integrated circuits (e.g. microprocessors) are attached (wired, bonded directly) to a printed circuit board, and covered by a blob of epoxy. By eliminating the packaging of individual semiconductor devices, the completed product can be more compact, lighter, and less costly. In some cases, COB construction improves the operation of radio frequency systems by reducing the inductance and capacitance of integrated circuit leads.
