In thermodynamics, the specific heat capacity of a substance is the amount of heat that must be added to one unit of mass of the substance in order to cause an increase of one unit in temperature. It is also referred to as massic heat capacity or as the specific heat. More formally it is the heat capacity of a sample of the substance divided by the mass of the sample. The SI unit of specific heat capacity is joule per kelvin per kilogram, J⋅kg−1⋅K−1. For example, the heat required to raise the temperature of 1 kg of water by 1 K is 4184 joules, so the specific heat capacity of water is 4184 J⋅kg−1⋅K−1.
In reliability engineering, the term availability has the following meanings:
In physical chemistry, the Arrhenius equation is a formula for the temperature dependence of reaction rates. The equation was proposed by Svante Arrhenius in 1889, based on the work of Dutch chemist Jacobus Henricus van 't Hoff who had noted in 1884 that the van 't Hoff equation for the temperature dependence of equilibrium constants suggests such a formula for the rates of both forward and reverse reactions. This equation has a vast and important application in determining the rate of chemical reactions and for calculation of energy of activation. Arrhenius provided a physical justification and interpretation for the formula. Currently, it is best seen as an empirical relationship. It can be used to model the temperature variation of diffusion coefficients, population of crystal vacancies, creep rates, and many other thermally induced processes and reactions. The Eyring equation, developed in 1935, also expresses the relationship between rate and energy.
The thermal conductivity of a material is a measure of its ability to conduct heat. It is commonly denoted by , , or and is measured in W·m−1·K−1.
In mathematics and physics, the heat equation is a certain partial differential equation. Solutions of the heat equation are sometimes known as caloric functions. The theory of the heat equation was first developed by Joseph Fourier in 1822 for the purpose of modeling how a quantity such as heat diffuses through a given region.
The lumped-element model is a simplified representation of a physical system or circuit that assumes all components are concentrated at a single point and their behavior can be described by idealized mathematical models. The lumped-element model simplifies the system or circuit behavior description into a topology. It is useful in electrical systems, mechanical multibody systems, heat transfer, acoustics, etc. This is in contrast to distributed parameter systems or models in which the behaviour is distributed spatially and cannot be considered as localized into discrete entities.
The Drude model of electrical conduction was proposed in 1900 by Paul Drude to explain the transport properties of electrons in materials. Basically, Ohm's law was well established and stated that the current J and voltage V driving the current are related to the resistance R of the material. The inverse of the resistance is known as the conductance. When we consider a metal of unit length and unit cross sectional area, the conductance is known as the conductivity, which is the inverse of resistivity. The Drude model attempts to explain the resistivity of a conductor in terms of the scattering of electrons by the relatively immobile ions in the metal that act like obstructions to the flow of electrons.
Electromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms. The effect is important in applications where high direct current densities are used, such as in microelectronics and related structures. As the structure size in electronics such as integrated circuits (ICs) decreases, the practical significance of this effect increases.
In materials science, creep is the tendency of a solid material to undergo slow deformation while subject to persistent mechanical stresses. It can occur as a result of long-term exposure to high levels of stress that are still below the yield strength of the material. Creep is more severe in materials that are subjected to heat for long periods and generally increases as they near their melting point.
In materials science and continuum mechanics, viscoelasticity is the property of materials that exhibit both viscous and elastic characteristics when undergoing deformation. Viscous materials, like water, resist both shear flow and strain linearly with time when a stress is applied. Elastic materials strain when stretched and immediately return to their original state once the stress is removed.
Darcy's law is an equation that describes the flow of a fluid through a porous medium. The law was formulated by Henry Darcy based on results of experiments on the flow of water through beds of sand, forming the basis of hydrogeology, a branch of earth sciences. It is analogous to Ohm's law in electrostatics, linearly relating the volume flow rate of the fluid to the hydraulic head difference via the hydraulic conductivity. In fact, the Darcy's law is a special case of the Stokes equation for the momentum flux, in turn deriving from the momentum Navier-Stokes equation.
The equilibrium constant of a chemical reaction is the value of its reaction quotient at chemical equilibrium, a state approached by a dynamic chemical system after sufficient time has elapsed at which its composition has no measurable tendency towards further change. For a given set of reaction conditions, the equilibrium constant is independent of the initial analytical concentrations of the reactant and product species in the mixture. Thus, given the initial composition of a system, known equilibrium constant values can be used to determine the composition of the system at equilibrium. However, reaction parameters like temperature, solvent, and ionic strength may all influence the value of the equilibrium constant.
In electrical engineering, a capacitor is a device that stores electrical energy by accumulating electric charges on two closely spaced surfaces that are insulated from each other. The capacitor was originally known as the condenser, a term still encountered in a few compound names, such as the condenser microphone. It is a passive electronic component with two terminals.
Equilibrium constants are determined in order to quantify chemical equilibria. When an equilibrium constant K is expressed as a concentration quotient,
The Larson–Miller relation, also widely known as the Larson–Miller parameter and often abbreviated LMP, is a parametric relation used to extrapolate experimental data on creep and rupture life of engineering materials.
The viscosity of a fluid is a measure of its resistance to deformation at a given rate. For liquids, it corresponds to the informal concept of "thickness": for example, syrup has a higher viscosity than water. Viscosity is defined scientifically as a force multiplied by a time divided by an area. Thus its SI units are newton-seconds per square meter, or pascal-seconds.
Physics of failure is a technique under the practice of reliability design that leverages the knowledge and understanding of the processes and mechanisms that induce failure to predict reliability and improve product performance.
Software reliability testing is a field of software-testing that relates to testing a software's ability to function, given environmental conditions, for a particular amount of time. Software reliability testing helps discover many problems in the software design and functionality.
High-temperature operating life (HTOL) is a reliability test applied to integrated circuits (ICs) to determine their intrinsic reliability. This test stresses the IC at an elevated temperature, high voltage and dynamic operation for a predefined period of time. The IC is usually monitored under stress and tested at intermediate intervals. This reliability stress test is sometimes referred to as a lifetime test, device life test or extended burn in test and is used to trigger potential failure modes and assess IC lifetime.
Solder fatigue is the mechanical degradation of solder due to deformation under cyclic loading. This can often occur at stress levels below the yield stress of solder as a result of repeated temperature fluctuations, mechanical vibrations, or mechanical loads. Techniques to evaluate solder fatigue behavior include finite element analysis and semi-analytical closed-form equations.
