Chip art, also known as silicon art, chip graffiti or silicon doodling, refers to microscopic artwork built into integrated circuits, also called chips or ICs. Since ICs are printed by photolithography, not constructed a component at a time, there is no additional cost to include features in otherwise unused space on the chip. Designers have used this freedom to put all sorts of artwork on the chips themselves, from designers' simple initials to rather complex drawings. Given the small size of chips, these figures cannot be seen without a microscope. Chip graffiti is sometimes called the hardware version of software easter eggs.
Prior to 1984, these doodles also served a practical purpose. If a competitor produced a similar chip, and examination showed it contained the same doodles, then this was strong evidence that the design was copied (a copyright violation) and not independently derived. [1] A 1984 revision of the US copyright law (the Semiconductor Chip Protection Act of 1984) made all chip masks automatically copyrighted, [1] with exclusive rights to the creator, and similar rules apply in most other countries that manufacture ICs. Since an exact copy is now automatically a copyright violation, the doodles serve no useful purpose.
Integrated Circuits are constructed from multiple layers of material, typically silicon, silicon dioxide (glass), and aluminum. The composition and thickness of these layers give them their distinctive color and appearance. These elements created an irresistible palette for IC design and layout engineers.
The creative process involved in the design of these chips, a strong sense of pride in their work, and an artistic temperament combined compels people to want to mark their work as their own. It is very common to find initials, or groups of initials on chips. This is the design engineer's way of "signing" his or her work.
Often this creative artist's instinct extends to the inclusion of small pictures or icons. These may be images of significance to the designers, comments related to the chip's function, inside jokes, or even satirical references. Because of the difficulty in verifying their existence, chip art has also been the subject of online hoaxes (e.g. the never-seen "bill sux" comment on a Pentium chip—the reputed "photo" showing the inscription is a hoax [2] ).
The mass production of these works of art as parasites on the body of a commercial IC goes unnoticed by most observers and is discouraged by semiconductor corporations, primarily from the fear that the presence of the artwork (which is clearly unneeded) will interfere with some necessary function in the chip or design flow. [1]
Some laboratories have started collaborating with artists or directly producing books and exhibits with the micrographs of these chips. Such is the case of Harvard chemist George Whitesides, who collaborated with pioneer photographer Felice Frankel to publish On the Surface of Things, a highly praised photography book on experiments from (mostly) the Whitesides lab. Also, the laboratory of Albert Folch (who, perhaps not coincidentally, works in BioMEMS, the same field as George Whitesides) at the University of Washington's Bioengineering Dept. has a highly popular online gallery with more than 1,700 free BioMEMS-related chip art micrographs and has already produced three art exhibits in the Seattle area, with online sales. [3]
An integrated circuit or monolithic integrated circuit is a set of electronic circuits on one small flat piece of semiconductor material, usually silicon. Large numbers of tiny MOSFETs integrate into a small chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to integrated circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones, and other digital home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs such as modern computer processors and microcontrollers.
Very large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining millions of MOS transistors onto a single chip. VLSI began in the 1970s when MOS integrated circuit chips were widely adopted, enabling complex semiconductor and telecommunication technologies to be developed. The microprocessor and memory chips are VLSI devices. Before the introduction of VLSI technology, most ICs had a limited set of functions they could perform. An electronic circuit might consist of a CPU, ROM, RAM and other glue logic. VLSI enables IC designers to add all of these into one chip.
An application-specific integrated circuit is an integrated circuit (IC) chip customized for a particular use, rather than intended for general-purpose use. For example, a chip designed to run in a digital voice recorder or a high-efficiency video codec is an ASIC. Application-specific standard product (ASSP) chips are intermediate between ASICs and industry standard integrated circuits like the 7400 series or the 4000 series. ASIC chips are typically fabricated using metal-oxide-semiconductor (MOS) technology, as MOS integrated circuit chips.
A gate array is an approach to the design and manufacture of application-specific integrated circuits (ASICs) using a prefabricated chip with components that are later interconnected into logic devices according to a custom order by adding metal interconnect layers in the factory. It was popular during upheaval in semiconductor industry in 80s and its usage declined by end of 90s.
Fabless manufacturing is the design and sale of hardware devices and semiconductor chips while outsourcing their fabrication to a specialized manufacturer called a semiconductor foundry. These foundries are typically, but not exclusively, located in the United States, China, and Taiwan. Fabless companies can benefit from lower capital costs while concentrating their research and development resources on the end market. Some fabless companies and pure play foundries may offer integrated-circuit design services to third parties.
Signetics was an American electronics manufacturer specifically established to make integrated circuits. Founded in 1961, they went on to develop a number of early microprocessors and support chips, as well as the widely used 555 timer chip. They were bought by Philips in 1975 and incorporated in Philips Semiconductors.
A mixed-signal integrated circuit is any integrated circuit that has both analog circuits and digital circuits on a single semiconductor die.
In electronics engineering, a design rule is a geometric constraint imposed on circuit board, semiconductor device, and integrated circuit (IC) designers to ensure their designs function properly, reliably, and can be produced with acceptable yield. Design rules for production are developed by process engineers based on the capability of their processes to realize design intent. Electronic design automation is used extensively to ensure that designers do not violate design rules; a process called design rule checking (DRC). DRC is a major step during physical verification signoff on the design, which also involves LVS checks, XOR checks, ERC, and antenna checks. The importance of design rules and DRC is greatest for ICs, which have micro- or nano-scale geometries; for advanced processes, some fabs also insist upon the use of more restricted rules to improve yield.
A multi-chip module (MCM) is generically an electronic assembly where multiple integrated circuits, semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "Heterogeneous integration" or "Hybrid Integrated Circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach.
Integrated circuit design, or IC design, is a sub-field of electronics engineering, encompassing the particular logic and circuit design techniques required to design integrated circuits, or ICs. ICs consist of miniaturized electronic components built into an electrical network on a monolithic semiconductor substrate by photolithography.
In electronics, a self-aligned gate is a transistor manufacturing feature whereby a refractory gate electrode region of a MOSFET is used as a mask for the doping of the source and drain regions. This technique ensures that the gate will slightly overlap the edges of the source and drain.
In electronic engineering, a through-silicon via (TSV) or through-chip via is a vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits. Compared to alternatives such as package-on-package, the interconnect and device density is substantially higher, and the length of the connections becomes shorter.
A three-dimensional integrated circuit is a MOS integrated circuit (IC) manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
Read-only memory (ROM) is a type of non-volatile memory used in computers and other electronic devices. Data stored in ROM cannot be electronically modified after the manufacture of the memory device. Read-only memory is useful for storing software that is rarely changed during the life of the system, also known as firmware. Software applications for programmable devices can be distributed as plug-in cartridges containing ROM.
Layout designs (topographies) of integrated circuits are a field in the protection of intellectual property.
Tessolve Semiconductor pvt Ltd, is an Indian multinational semiconductor manufacturer company, based in Bangalore, India. The company offers Semiconductor IC Design, Test & Product Engineering, PCB design, Failure Analysis and Systems design. It was started in the year 2004.
Albert Folch Folch is a Spanish/Catalan scientist, writer, and artist. He is currently a professor in the Department of Bioengineering at the University of Washington who is known for his research into Microfluidics and BioMEMS as well as his works of scientific art.
The first planar monolithic integrated circuit (IC) chip was demonstrated in 1960. The idea of integrating electronic circuits into a single device was born when the German physicist and engineer Werner Jacobi developed and patented the first known integrated transistor amplifier in 1949 and the British radio engineer Geoffrey Dummer proposed to integrate a variety of standard electronic components in a monolithic semiconductor crystal in 1952. A year later, Harwick Johnson filed a patent for a prototype IC. Between 1953 and 1957, Sidney Darlington and Yasuo Tarui proposed similar chip designs where several transistors could share a common active area, but there was no electrical isolation to separate them from each other.
In integrated circuits (ICs), interconnects are structures that connect two or more circuit elements together electrically. The design and layout of interconnects on an IC is vital to its proper function, performance, power efficiency, reliability, and fabrication yield. The material interconnects are made from depends on many factors. Chemical and mechanical compatibility with the semiconductor substrate, and the dielectric in between the levels of interconnect is necessary, otherwise barrier layers are needed. Suitability for fabrication is also required; some chemistries and processes prevent integration of materials and unit processes into a larger technology (recipe) for IC fabrication. In fabrication, interconnects are formed during the back-end-of-line after the fabrication of the transistors on the substrate.
Glossary of microelectronics manufacturing terms