ColdHeat was an American company founded to develop and market products using the proprietary graphite-like compound Athalite. The composite material is claimed by the manufacturer to have the unusual ability to conduct large amounts of heat and return to room temperature in a short amount of time.
The first two products were soldering irons powered by alkaline batteries. The manufacturer claims this soldering iron is unique in that its Athalite tip undergoes a temperature change from ambient temperature to approximately 800 °F (427 °C) and back to ambient within three seconds when the tip is removed from the work.
The tip of this apparatus is split into two sections that completes an electrical circuit when a low electrical resistance is placed across the tip; e.g. metallic contacts, or solder. [1] With a current flowing, the resistance of both the solder and the tip produces enough heat to increase the temperature beyond the melting point of solder. For the light-duty work it was designed for, the Athalite tip heats just enough and can cool very rapidly; however, if applied to something with large thermal capacity such as a metal chassis, the tip can become extremely hot and can take over a minute to cool in an extreme case.[ citation needed ]
It is thought that the irons cannot be used indiscriminately for all work; the voltage across and current through the tip can damage electronic circuits being soldered. When not in contact with a joint, the split tip has 6 or more volts across it, enough to destroy semiconductor p-n junctions on contact if the iron accidentally touches multiple closely spaced pads. This is not static-electricity damage; any voltage over about 0.7V capable of delivering high current can destroy a semiconductor junction.
The tip is reported to be very easily damaged mechanically. The unit does not have enough power for effective desoldering of many board- and chassis-mounted components. The design of the tip is incompatible with some soldering techniques such as dragging or continuous-flow soldering (a popular technique for hand-soldering high-pin-count SMT packages, based on the principles of wave soldering).
One thorough review of the ColdHeat soldering iron noted:
Athalite is a highly malleable, yet fragile, composite material. The name is derived from "Accelerated THermal Action". It is most likely composed of graphite. It might also be formed by other materials containing semiconductive elements such as germanium or silicon, as stated in the patent application. A nickel-chromium or other resistive alloy is another possibility listed in the application, but is unlikely to have been used. [2]
Prior to the website's closure, ColdHeat featured products other than the soldering tool that use the same technology, including a cordless hot-melt glue gun called Freestyle. It heats up much more quickly than others (but not instantly like the solder tool.) It comes with a built-in stand, a pack of mini glue sticks, rechargeable battery, battery charger with its AC adapter, and an instructional manual and a book with different project ideas. However, much like the soldering tool, the Freestyle also had quality issues, usually related to the battery charge, and the heating element. There is a model that runs on AA batteries, for those who prefer their convenience.
ColdHeat had recently released a cordless heated seat, as well as a selection of heated pet beds.
ColdHeat signed a licensing deal with Weller/Cooper Tools in November 2005. Weller sold the ColdHeat Pro as the Weller CHT100. [3] [4]
A soldering iron is a hand tool used in soldering. It supplies heat to melt solder so that it can flow into the joint between two workpieces.
A printed circuit board (PCB), also called printed wiring board (PWB), is a medium used to connect or "wire" components to one another in a circuit. It takes the form of a laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with a pattern of traces, planes and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds vias, plated-through holes that allow interconnections between layers.
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.
Brazing is a metal-joining process in which two or more metal items are joined by melting and flowing a filler metal into the joint, with the filler metal having a lower melting point than the adjoining metal.
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry, it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconnect the chip pads to external circuitry.
Induction heating is the process of heating electrically conductive materials, namely metals or semi-conductors, by electromagnetic induction, through heat transfer passing through an inductor that creates an electromagnetic field within the coil to heat up and possibly melt steel, copper, brass, graphite, gold, silver, aluminum, or carbide.
Forge welding (FOW), also called fire welding, is a solid-state welding process that joins two pieces of metal by heating them to a high temperature and then hammering them together. It may also consist of heating and forcing the metals together with presses or other means, creating enough pressure to cause plastic deformation at the weld surfaces. The process, although challenging, has been a method of joining metals used since ancient times and is a staple of traditional blacksmithing. Forge welding is versatile, being able to join a host of similar and dissimilar metals. With the invention of electrical welding and gas welding methods during the Industrial Revolution, manual forge-welding has been largely replaced, although automated forge-welding is a common manufacturing process.
In electronics, desoldering is the removal of solder and components from a circuit board for troubleshooting, repair, replacement, and salvage.
Reflow soldering is a process in which a solder paste is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in a molten state, creating permanent solder joints. Heating may be accomplished by passing the assembly through a reflow oven, under an infrared lamp, or by soldering individual joints with a hot air pencil.
In electronics, rework is the repair or refinish of a printed circuit board (PCB) assembly, usually involving desoldering and re-soldering of surface-mounted electronic components (SMD). Mass processing techniques are not applicable to single device repair or replacement, and specialized manual techniques by expert personnel using appropriate equipment are required to replace defective components; area array packages such as ball grid array (BGA) devices particularly require expertise and appropriate tools. A hot air gun or hot air station is used to heat devices and melt solder, and specialised tools are used to pick up and position often tiny components. A rework station is a place to do this work—the tools and supplies for this work, typically on a workbench. Other kinds of rework require other tools.
A soldering gun is an approximately pistol-shaped, electrically powered tool for soldering metals using tin-based solder to achieve a strong mechanical bond with good electrical contact. The tool has a trigger-style switch so it can be easily operated with one hand. The body of the tool contains a transformer with a primary winding connected to mains electricity when the trigger is pressed, and a single-turn secondary winding of thick copper with very low resistance. A soldering tip, made of a loop of thinner copper wire, is secured to the end of the transformer secondary by screws, completing the secondary circuit. When the primary of the transformer is energized, several hundred amperes of current flow through the secondary and very rapidly heat the copper tip. Since the tip has a much higher resistance than the rest of the tubular copper winding, the tip gets very hot while the remainder of the secondary warms at a much slower rate. An additional secondary winding is often used to power a pilot lamp which illuminates the workpiece.
Heat-shrink tubing is a shrinkable plastic tube used to insulate wires, providing abrasion resistance and environmental protection for stranded and solid wire conductors, connections, joints and terminals in electrical wiring. It can also be used to repair the insulation on wires or to bundle them together, to protect wires or small parts from minor abrasion, and to create cable entry seals, offering environmental sealing protection. Heat-shrink tubing is ordinarily made of polyolefin, which shrinks radially when heated, to between one-half and one-sixth of its diameter.
Selective soldering is the process of selectively soldering components to printed circuit boards and molded modules that could be damaged by the heat of a reflow oven or wave soldering in a traditional surface-mount technology (SMT) or through-hole technology assembly processes. This usually follows an SMT oven reflow process; parts to be selectively soldered are usually surrounded by parts that have been previously soldered in a surface-mount reflow process, and the selective-solder process must be sufficiently precise to avoid damaging them.
An electric blanket is a blanket that contains integrated electrical heating wires. Types include underblankets, overblankets, throws, and duvets. An electric underblanket is placed above the mattress and below the bottom bed sheet. This is the most common type in the UK and Commonwealth countries, where it is known by default as an "electric blanket"; in the U.S. and Canada, where it is less common, it is called an electric heated mattress pad. An electric overblanket is placed above the top bed sheet, and is the most common type in the U.S. and Canada, where it is called an "electric blanket".
An induction heater is a key piece of equipment used in all forms of induction heating. Typically an induction heater operates at either medium frequency (MF) or radio frequency (RF) ranges.
The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. The diameter of a thermal bump is 238 μm and 60 μm high.
A soldering station is a multipurpose power soldering device designed for electronic components soldering. This type of equipment is mostly used in electronics and electrical engineering. Soldering station consists of one or more soldering tools connected to the main unit, which includes the controls, means of indication, and may be equipped with an electric transformer. Soldering stations may include some accessories – holders and stands, soldering tip cleaners, etc.
Soldering is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint.
Electronic components have a wide range of failure modes. These can be classified in various ways, such as by time or cause. Failures can be caused by excess temperature, excess current or voltage, ionizing radiation, mechanical shock, stress or impact, and many other causes. In semiconductor devices, problems in the device package may cause failures due to contamination, mechanical stress of the device, or open or short circuits.
The "Scope" soldering iron is a tool for soldering with lead-tin alloys, made in Australia since 1950, and intended for occasional or intermittent use. It has the virtue of quickly coming up to soldering temperature (~300C) and delivering considerable heat to a small area, but requires care to avoid overheating. It operates on low voltage and high current from a battery or suitable transformer, so is by design electrically safe, and as it cools down rapidly when it leaves the operator's hand, should not constitute a fire risk.