In electronics, a wafer is a thin slice of semiconductor, such as a crystalline silicon, used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells.
A saw is a tool consisting of a tough blade, wire, or chain with a hard toothed edge used to cut through material. Various terms are used to describe toothed and abrasive saws.
Machining is a manufacturing process where a desired shape or part is created using the controlled removal of material, most often metal, from a larger piece of raw material by cutting. Machining is a form of subtractive manufacturing, which utilizes machine tools, in contrast to additive manufacturing, which uses controlled addition of material.
Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and hobbyists. Laser cutting works by directing the output of a high-power laser most commonly through optics. The laser optics and CNC are used to direct the laser beam to the material. A commercial laser for cutting materials uses a motion control system to follow a CNC or G-code of the pattern to be cut onto the material. The focused laser beam is directed at the material, which then either melts, burns, vaporizes away, or is blown away by a jet of gas, leaving an edge with a high-quality surface finish.
A file is a tool used to remove fine amounts of material from a workpiece. It is common in woodworking, metalworking, and other similar trade and hobby tasks. Most are hand tools, made of a case hardened steel bar of rectangular, square, triangular, or round cross-section, with one or more surfaces cut with sharp, generally parallel teeth. A narrow, pointed tang is common at one end, to which a handle may be fitted.
Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing.
A miter saw or mitre saw is a saw used to make accurate crosscuts and miters in a workpiece by positioning a mounted blade onto a board. A miter saw in its earliest form was composed of a back saw in a miter box, but in modern implementation consists of a powered circular saw that can be positioned at a variety of angles and lowered onto a board positioned against a backstop called the fence.
A microtome is a cutting tool used to produce extremely thin slices of material known as sections, with the process being termed microsectioning. Important in science, microtomes are used in microscopy for the preparation of samples for observation under transmitted light or electron radiation.
A kitchen knife is any knife that is intended to be used in food preparation. While much of this work can be accomplished with a few general-purpose knives – notably a large chef's knife, a tough cleaver, a small paring knife and some sort of serrated blade – there are also many specialized knives that are designed for specific tasks. Kitchen knives can be made from several different materials.
A concrete saw is a power tool used for cutting concrete, masonry, brick, asphalt, tile, and other solid materials. There are many types ranging from small hand-held saws, chop-saw models, and big walk-behind saws or other styles, and it may be powered by gasoline, hydraulic or pneumatic pressure, or an electric motor. The saw blades used on concrete saws are often diamond saw blades to cut concrete, asphalt, stone, etc. Abrasive cut-off wheels can also be used on cut-off saws to cut stone and steel. The significant friction generated in cutting hard substances like concrete usually requires the blades to be cooled to prolong their life and reduce dust.
A scroll saw is a small electric or pedal-operated saw used to cut intricate curves in wood, metal, or other materials. The fineness of its blade allows it to cut more delicately than a power jigsaw, and more easily than a hand coping saw or fretsaw. Like those tools, it is capable of creating curved cuts with angled edges, by tilting its table along the axis of the cut.
A wire saw is a saw that uses a metal wire or cable for mechanical cutting of bulk solid material such as stone, wood, glass, ferrites, concrete, metals, crystals etc.. Industrial wire saws are usually powered. There are also hand-powered survivalist wire saws suitable for cutting tree branches. Wire saws are classified as continuous or oscillating. Sometimes the wire itself is referred to as a "blade".
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. Die singulation comes after the photolithography process. It can involve scribing and breaking, mechanical sawing or laser cutting. All methods are typically automated to ensure precision and accuracy. Following the dicing process the individual silicon chips may be encapsulated into chip carriers which are then suitable for use in building electronic devices such as computers, etc.
A diamond tool is a cutting tool with diamond grains fixed on the functional parts of the tool via a bonding material or another method. As diamond is a superhard material, diamond tools have many advantages as compared with tools made with common abrasives such as corundum and silicon carbide.
A diamond blade is a saw blade which has diamonds fixed on its edge for cutting hard or abrasive materials. There are many types of diamond blade, and they have many uses, including cutting stone, concrete, asphalt, bricks, coal balls, glass, and ceramics in the construction industry; cutting semiconductor materials in the semiconductor industry; and cutting gemstones, including diamonds, in the gem industry.
Monocrystalline silicon, more often called single-crystal silicon, in short mono c-Si or mono-Si, is the base material for silicon-based discrete components and integrated circuits used in virtually all modern electronic equipment. Mono-Si also serves as a photovoltaic, light-absorbing material in the manufacture of solar cells.
Diamond grinding is a pavement preservation technique that corrects a variety of surface imperfections on both concrete and asphalt concrete pavements. Most often utilized on concrete pavement, diamond grinding is typically performed in conjunction with other concrete pavement preservation (CPP) techniques such as road slab stabilization, full- and partial-depth repair, dowel bar retrofit, cross stitching longitudinal cracks or joints and joint and crack resealing. Diamond grinding restores rideability by removing surface irregularities caused during construction or through repeated traffic loading over time. The immediate effect of diamond grinding is a significant improvement in the smoothness of a pavement. Another important effect of diamond grinding is the considerable increase in surface macrotexture and consequent improvement in skid resistance, noise reduction and safety.
Wafering is the process by which a silicon crystal (boule) is made into wafers. This process is usually carried out by a multi-wire saw which cuts multiple wafers from the same crystal at the same time. These wafers are then polished to the desired degree of flatness and thickness.
A disc cutter is a specialised, often hand-held, power tool used for cutting hard materials, ceramic tile, metal, concrete, and stone for example. This tool is very similar to an angle grinder, chop saw, or even a die grinder, with the main difference being the cutting disc itself. This tool is highly efficient at cutting very hard materials, especially when compared to hand tools.
