Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically the metal–oxide–semiconductor (MOS) devices used in the integrated circuit (IC) chips such as modern computer processors, microcontrollers, and memory chips such as NAND flash and DRAM that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photolithographic and chemical processing steps during which electronic circuits are gradually created on a wafer made of pure semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
In electronics, a wafer is a thin slice of semiconductor, such as a crystalline silicon (c-Si), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping, ion implantation, etching, thin-film deposition of various materials, and photolithographic patterning. Finally, the individual microcircuits are separated by wafer dicing and packaged as an integrated circuit.
A table saw is a woodworking tool, consisting of a circular saw blade, mounted on an arbor, that is driven by an electric motor. The blade protrudes through the top of a table, which provides support for the material, usually wood, being cut.
Laser cutting is a technology that uses a laser to vaporize materials, resulting in a cut edge. While typically used for industrial manufacturing applications, it is now used by schools, small businesses, architecture, and hobbyists. Laser cutting works by directing the output of a high-power laser most commonly through optics. The laser optics and CNC are used to direct the material or the laser beam generated. A commercial laser for cutting materials uses a motion control system to follow a CNC or G-code of the pattern to be cut onto the material. The focused laser beam is directed at the material, which then either melts, burns, vaporizes away, or is blown away by a jet of gas, leaving an edge with a high-quality surface finish.
A file is a tool used to remove fine amounts of material from a workpiece. It is common in woodworking, metalworking, and other similar trade and hobby tasks. Most are hand tools, made of a case hardened steel bar of rectangular, square, triangular, or round cross-section, with one or more surfaces cut with sharp, generally parallel teeth. A narrow, pointed tang is common at one end, to which a handle may be fitted.
Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing.
Depaneling is a process step in high-volume electronics assembly production. In order to increase the throughput of printed circuit board (PCB) manufacturing and surface mount (SMT) lines, PCBs are often designed so that they consist of many smaller individual PCBs that will be used in the final product. This PCB cluster is called a panel or multiblock. The large panel is broken up or "depaneled" as a certain step in the process - depending on the product, it may happen right after SMT process, after in-circuit test (ICT), after soldering of through-hole elements, or even right before the final assembly of the PCBA into the enclosure.
A microtome is a cutting tool used to produce extremely thin slices of material known as sections. Important in science, microtomes are used in microscopy, allowing for the preparation of samples for observation under transmitted light or electron radiation.
Ultramicrotomy is a method for cutting specimens into extremely thin slices, called ultra-thin sections, that can be studied and documented at different magnifications in a transmission electron microscope (TEM). It is used mostly for biological specimens, but sections of plastics and soft metals can also be prepared. Sections must be very thin because the 50 to 125 kV electrons of the standard electron microscope cannot pass through biological material much thicker than 150 nm. For best resolutions, sections should be from 30 to 60 nm. This is roughly the equivalent to splitting a 0.1 mm-thick human hair into 2,000 slices along its diameter, or cutting a single red blood cell into 100 slices.
A wire saw is a saw that uses a metal wire or cable for cutting. Industrial wire saws are usually powered. There are also hand-powered survivalist wire saws suitable for cutting branches. Wire saws are classified as continuous or oscillating. Sometimes the wire itself is referred to as a "blade".
DISCO Corporation is a Japanese precision tools maker, especially for the semiconductor production industry.
In the context of manufacturing integrated circuits, wafer dicing is the process by which die are separated from a wafer of semiconductor following the processing of the wafer. The dicing process can involve scribing and breaking, mechanical sawing or laser cutting. All methods are typically automated to ensure precision and accuracy. Following the dicing process the individual silicon chips are encapsulated into chip carriers which are then suitable for use in building electronic devices such as computers, etc.
A diamond tool is a cutting tool with diamond grains fixed on the functional parts of the tool via a bonding material or another method. As diamond is a superhard material, diamond tools have many advantages as compared with tools made with common abrasives such as corundum and silicon carbide.
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor through processes such as photolithography. The wafer is cut (diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.
An abrasive saw, also known as a cut-off saw or chop saw, is a circular saw which is typically used to cut hard materials, such as metals, tile, and concrete. The cutting action is performed by an abrasive disc, similar to a thin grinding wheel. Technically speaking this is not a saw, as it does not use regularly shaped edges (teeth) for cutting.
Monocrystalline silicon, more often called single-crystal silicon, in short mono c-Si or mono-Si, is the base material for silicon-based discrete components and integrated circuits used in virtually all modern electronic equipment. Mono-Si also serves as a photovoltaic, light-absorbing material in the manufacture of solar cells.
Wafer backgrinding is a semiconductor device fabrication step during which wafer thickness is reduced to allow stacking and high-density packaging of integrated circuits (IC).
Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or other material following wafer or module microfabrication. The tape holds the pieces of the substrate, in case of a wafer called as die, together during the cutting process, mounting them to a thin metal frame. The dies/substrate pieces are removed from the dicing tape later on in the electronics manufacturing process.
Wafering is the process by which a silicon crystal (boule) is made into wafers. This process is usually carried out by a multi-wire saw which cuts multiple wafers from the same crystal at the same time. These wafers are then polished to the desired degree of flatness and thickness.
Carbide saws are machine tools for cutting. The saw teeth are made of cemented carbide, so that hard materials can be cut.
