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Dicing tape is a backing tape used during wafer dicing or some other microelectronic substrate separation, the cutting apart of pieces of semiconductor or other material following wafer or module microfabrication. The tape holds the pieces of the substrate, in case of a wafer called as die, together during the cutting process, mounting them to a thin metal frame. The dies/substrate pieces are removed from the dicing tape later on in the electronics manufacturing process.
Dicing tape can be made of PVC, polyolefin, or polyethylene backing material with an adhesive to hold the wafer or substrate in place. In some cases dicing tape will have a release liner that will be removed prior to mounting the tape to the backside of the wafers, with a variety of adhesive strengths, designed for various wafer/substrate sizes and materials.
Adhesive, also known as glue, cement, mucilage, or paste, is any non-metallic substance applied to one or both surfaces of two separate items that binds them together and resists their separation.
Photolithography is a process used in the manufacturing of integrated circuits. It involves using light to transfer a pattern onto a substrate, typically a silicon wafer.
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as microprocessors, microcontrollers, and memories. It is a multiple-step photolithographic and physico-chemical process during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.
In electronics, a wafer is a thin slice of semiconductor, such as a crystalline silicon, used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells.
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry, it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconnect the chip pads to external circuitry.
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a "package", supports the electrical contacts which connect the device to a circuit board.
Lamination is the technique/process of manufacturing a material in multiple layers, so that the composite material achieves improved strength, stability, sound insulation, appearance, or other properties from the use of the differing materials, such as plastic. A laminate is a layered object or material assembled using heat, pressure, welding, or adhesives. Various coating machines, machine presses and calendering equipment are used.
Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. The process of die preparation typically consists of two steps: wafer mounting and wafer dicing.
Synthetic setae emulate the setae found on the toes of a gecko and scientific research in this area is driven towards the development of dry adhesives. Geckos have no difficulty mastering vertical walls and are apparently capable of adhering themselves to just about any surface. The five-toed feet of a gecko are covered with elastic hairs called setae and the ends of these hairs are split into nanoscale structures called spatulae. The sheer abundance and proximity to the surface of these spatulae make it sufficient for van der Waals forces alone to provide the required adhesive strength. Following the discovery of the gecko's adhesion mechanism in 2002, which is based on van der Waals forces, biomimetic adhesives have become the topic of a major research effort. These developments are poised to yield families of novel adhesive materials with superior properties which are likely to find uses in industries ranging from defense and nanotechnology to healthcare and sport.
Hot-melt adhesive (HMA), also known as hot glue, is a form of thermoplastic adhesive that is commonly sold as solid cylindrical sticks of various diameters designed to be applied using a hot glue gun. The gun uses a continuous-duty heating element to melt the plastic glue, which the user pushes through the gun either with a mechanical trigger mechanism on the gun, or with direct finger pressure. The glue squeezed out of the heated nozzle is initially hot enough to burn and even blister skin. The glue is sticky when hot, and solidifies in a few seconds to one minute. Hot-melt adhesives can also be applied by dipping or spraying, and are popular with hobbyists and crafters both for affixing and as an inexpensive alternative to resin casting.
Pressure-sensitive adhesive is a type of nonreactive adhesive which forms a bond when pressure is applied to bond the adhesive with a surface. No solvent, water, or heat is needed to activate the adhesive. It is used in pressure-sensitive tapes, labels, glue dots, stickers, sticky note pads, automobile trim, and a wide variety of other products.
Die singulation, also called wafer dicing, is the process in semiconductor device fabrication by which dies are separated from a finished wafer of semiconductor. It can involve scribing and breaking, mechanical sawing or laser cutting. All methods are typically automated to ensure precision and accuracy. Following the dicing process the individual silicon chips may be encapsulated into chip carriers which are then suitable for use in building electronic devices such as computers, etc.
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor through processes such as photolithography. The wafer is cut (diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.
Adhesive bonding describes a wafer bonding technique with applying an intermediate layer to connect substrates of different types of materials. Those connections produced can be soluble or insoluble. The commercially available adhesive can be organic or inorganic and is deposited on one or both substrate surfaces. Adhesives, especially the well-established SU-8, and benzocyclobutene (BCB), are specialized for MEMS or electronic component production.
Pressure-sensitive tape or pressure-sensitive adhesive tape is an adhesive tape that sticks when pressure is applied without the need for a solvent or heat for activation. It is also known in various countries as self-stick tape, sticky tape, or just adhesive tape and tape, as well as genericized trademarks, such as Sellotape, Durex (tape), Scotch tape, etc.
The chemistry of pressure-sensitive adhesives describes the chemical science associated with pressure-sensitive adhesives (PSA). PSA tapes and labels have become an important part of everyday life. These rely on adhesive material affixed to a backing such as paper or plastic film.
Chip on board (COB) is a method of circuit board manufacturing in which the integrated circuits (e.g. microprocessors) are attached (wired, bonded directly) to a printed circuit board, and covered by a blob of epoxy. Chip on board eliminates the packaging of individual semiconductor devices, which allows a completed product to be less costly, lighter, and more compact. In some cases, COB construction improves the operation of radio frequency systems by reducing the inductance and capacitance of integrated circuit leads.
Adhesive bonding is a joining technique used in the manufacture and repair of a wide range of products. Along with welding and soldering, adhesive bonding is one of the basic joining processes. In this technique, components are bonded together using adhesives. The broad range of types of adhesives available allows numerous materials to be bonded together in products as diverse as vehicles, mobile phones, personal care products, buildings, computers and medical devices.
Glossary of microelectronics manufacturing terms
Nano tape, also called gecko tape is a synthetic adhesive tape consisting of arrays of carbon nanotubes transferred onto a backing material of flexible polymer tape. These arrays are called synthetic setae and mimic the nanostructures found on the toes of a gecko; this is an example of biomimicry. The adhesion is achieved not with chemical adhesives, but via van der Waals forces, which are weak electric forces generated between two atoms or molecules that are very close to each other.
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