Elmos Semiconductor

Last updated
Elmos Semiconductor SE
Type Public company
Industry Electrical engineering
Founded1984
Headquarters,
Area served
automotive
Products Semiconductors, microstructures
Subsidiaries Silicon Microstructures
Website http://www.elmos.de/
Footnotes /references
Garnter ranked #2 Automotive ASIC Supplier

Elmos Semiconductor SE is a German manufacturer of semiconductor products headquartered in Dortmund, North Rhine-Westphalia, Germany.[ clarification needed ] Elmos supplies automotive application-specific integrated circuits (ASICs).

Contents

History

Silicon Microstructures

Silicon Microstructures, Inc.(SMI) was founded in 1991 as a commercial source of high-performance silicon pressure sensors, including Microelectromechanical systems sensors, and accelerometers. Its first product was a silicon sensor for very low-pressure usage. SMI was acquired in March 2001 from OSI Systems. [4] SMI began production on higher performance, system level sensors and microstructures, wireless, RF and bus addressable microstructures. In August 2002, SMI acquired the IC Sensors' wafer fabrication operations and wafer R&D group and relocated to Milpitas, California. The following year, Silicon Microstructures undertook a significant and complete wafer fabrication upgrade to expand the facility for full 6" wafer handling.

This facility processed primarily 6 inch wafers and has advanced technical capabilities including deep reactive ion etching (DRIE) and plasma enhanced fusion bonding.[ clarification needed ]

Related Research Articles

<span class="mw-page-title-main">Semiconductor device fabrication</span> Manufacturing process used to create integrated circuits

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physico-chemical process during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.

<span class="mw-page-title-main">Wafer (electronics)</span> Thin slice of semiconductor used for the fabrication of integrated circuits

In electronics, a wafer is a thin slice of semiconductor, such as a crystalline silicon (c-Si), used for the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping, ion implantation, etching, thin-film deposition of various materials, and photolithographic patterning. Finally, the individual microcircuits are separated by wafer dicing and packaged as an integrated circuit.

<span class="mw-page-title-main">STMicroelectronics</span> Semiconductor device manufacturer

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<span class="mw-page-title-main">TSMC</span> Taiwanese semiconductor foundry company

Taiwan Semiconductor Manufacturing Company Limited is a Taiwanese multinational semiconductor contract manufacturing and design company. It is the world's most valuable semiconductor company, the world's largest dedicated independent ("pure-play") semiconductor foundry, and one of Taiwan's largest companies, with its headquarters and main operations located in the Hsinchu Science Park in Hsinchu. It is majority owned by foreign investors.

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Fabless manufacturing is the design and sale of hardware devices and semiconductor chips while outsourcing their fabrication to a specialized manufacturer called a semiconductor foundry. These foundries are typically, but not exclusively, located in the United States, China, and Taiwan. Fabless companies can benefit from lower capital costs while concentrating their research and development resources on the end market. Some fabless companies and pure play foundries may offer integrated-circuit design services to third parties.

Wafer fabrication is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and microprocessors for computers. Wafer fabrication is used to build components with the necessary electrical structures.

Silicon Glen is a nickname for the high tech sector of Scotland, the name inspired by Silicon Valley in California. It is applied to the Central Belt triangle between Dundee, Inverclyde and Edinburgh, which includes Fife, Glasgow and Stirling; although electronics facilities outside this area may also be included in the term. The term has been in use since the 1980s. It does not technically represent a glen as it covers a much wider area than just one valley.

<span class="mw-page-title-main">United Microelectronics Corporation</span> Taiwanese semiconductor foundry

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Maxim Integrated, a subsidiary of Analog Devices, designs, manufactures, and sells analog and mixed-signal integrated circuits for the automotive, industrial, communications, consumer, and computing markets. Maxim's product portfolio includes power and battery management ICs, sensors, analog ICs, interface ICs, communications solutions, digital ICs, embedded security, and microcontrollers. The company is headquartered in San Jose, California, and has design centers, manufacturing facilities, and sales offices worldwide.

<span class="mw-page-title-main">X-Fab</span> German semiconductor foundry

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<span class="mw-page-title-main">Multi-project wafer service</span>

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Systems on Silicon Manufacturing Company Pte. Ltd. is a Singaporean semiconductor fabrication company located in Pasir Ris Wafer Fab Park. It was incorporated in 1999 and is a joint venture between NXP Semiconductors and TSMC. Founded by Philips and EDB Investments, the plant was completed in 2000.

<span class="mw-page-title-main">Ferdinand-Braun-Institut</span>

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GlobalFoundries Inc. is a multinational semiconductor contract manufacturing and design company incorporated in the Cayman Islands and headquartered in Malta, New York. Created by the divestiture of the manufacturing arm of AMD, the company was privately owned by Mubadala Investment Company, the sovereign wealth fund of the United Arab Emirates, until an initial public offering (IPO) in October 2021.

<span class="mw-page-title-main">Tower Semiconductor</span> Integrated circuit manufacturer

Tower Semiconductor Ltd. is an Israeli company that manufactures integrated circuits using specialty process technologies, including SiGe, BiCMOS, Silicon Photonics, SOI, mixed-signal and RFCMOS, CMOS image sensors, non-imaging sensors, power management (BCD), and non-volatile memory (NVM) as well as MEMS capabilities. Tower Semiconductor also owns 51% of TPSCo, an enterprise with Nuvoton Technology Corporation Japan (NTCJ).

ChangXin Memory Technologies is a Chinese semiconductor integrated device manufacturer headquartered in Hefei, Anhui, specializing in the production of DRAM memory.

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The Chinese semiconductor industry, including integrated circuit design and manufacturing, forms a major part of mainland China's information technology industry.

References

  1. "Öffentliche Bekanntmachung RegisSTAR".
  2. "Germany likely to block Chinese takeover of Elmos' chip production". Reuters. 2022-11-07. Retrieved 2023-05-09.
  3. Rinke, Andreas; Murray, Miranda (10 November 2022). "Germany blocks Chinese stake in two chipmakers over security concerns". Reuters.
  4. "OSI Systems sells subsidiary SMI to Elmos Semiconductor" (Press release). March 13, 2001. Retrieved 2 September 2016.