A soldering iron is a hand tool used in soldering. It supplies heat to melt solder so that it can flow into the joint between two workpieces.
Solder is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.
Welding is a fabrication process that joins materials, usually metals or thermoplastics, by using high heat to melt the parts together and allowing them to cool, causing fusion. Welding is distinct from lower temperature techniques such as brazing and soldering, which do not melt the base metal.
A printed circuit board (PCB), also called printed wiring board (PWB), is a medium used to connect or "wire" components to one another in a circuit. It takes the form of a laminated sandwich structure of conductive and insulating layers: each of the conductive layers is designed with a pattern of traces, planes and other features etched from one or more sheet layers of copper laminated onto and/or between sheet layers of a non-conductive substrate. Electrical components may be fixed to conductive pads on the outer layers in the shape designed to accept the component's terminals, generally by means of soldering, to both electrically connect and mechanically fasten them to it. Another manufacturing process adds vias, plated-through holes that allow interconnections between layers.
Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding can be used at frequencies above 100 GHz.
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.
Brazing is a metal-joining process in which two or more metal items are joined by melting and flowing a filler metal into the joint, with the filler metal having a lower melting point than the adjoining metal.
Plastic welding is welding for semi-finished plastic materials, and is described in ISO 472 as a process of uniting softened surfaces of materials, generally with the aid of heat. Welding of thermoplastics is accomplished in three sequential stages, namely surface preparation, application of heat and pressure, and cooling. Numerous welding methods have been developed for the joining of semi-finished plastic materials. Based on the mechanism of heat generation at the welding interface, welding methods for thermoplastics can be classified as external and internal heating methods, as shown in Fig 1.
In electronics, desoldering is the removal of solder and components from a circuit board for troubleshooting, repair, replacement, and salvage.
Electric resistance welding (ERW) is a welding process in which metal parts in contact are permanently joined by heating them with an electric current, melting the metal at the joint. Electric resistance welding is widely used, for example, in manufacture of steel pipe and in assembly of bodies for automobiles. The electric current can be supplied to electrodes that also apply clamping pressure, or may be induced by an external magnetic field. The electric resistance welding process can be further classified by the geometry of the weld and the method of applying pressure to the joint: spot welding, seam welding, flash welding, projection welding, for example. Some factors influencing heat or welding temperatures are the proportions of the workpieces, the metal coating or the lack of coating, the electrode materials, electrode geometry, electrode pressing force, electric current and length of welding time. Small pools of molten metal are formed at the point of most electrical resistance as an electric current is passed through the metal. In general, resistance welding methods are efficient and cause little pollution, but their applications are limited to relatively thin materials.
A fusible alloy is a metal alloy capable of being easily fused, i.e. easily meltable, at relatively low temperatures. Fusible alloys are commonly, but not necessarily, eutectic alloys.
A heat sealer is a machine used to seal products, packaging, and other thermoplastic materials using heat. This can be with uniform thermoplastic monolayers or with materials having several layers, at least one being thermoplastic. Heat sealing can join two similar materials together or can join dissimilar materials, one of which has a thermoplastic layer.
Heat-shrink tubing is a shrinkable plastic tube used to insulate wires, providing abrasion resistance and environmental protection for stranded and solid wire conductors, connections, joints and terminals in electrical wiring. It can also be used to repair the insulation on wires or to bundle them together, to protect wires or small parts from minor abrasion, and to create cable entry seals, offering environmental sealing protection. Heat-shrink tubing is ordinarily made of polyolefin, which shrinks radially when heated, to between one-half and one-sixth of its diameter.
Coal analysis techniques are specific analytical methods designed to measure the particular physical and chemical properties of coals. These methods are used primarily to determine the suitability of coal for coking, power generation or for iron ore smelting in the manufacture of steel.
Pressure-sensitive adhesive is a type of nonreactive adhesive which forms a bond when pressure is applied to bond the adhesive with a surface. No solvent, water, or heat is needed to activate the adhesive. It is used in pressure-sensitive tapes, labels, glue dots, stickers, sticky note pads, automobile trim, and a wide variety of other products.
White Portland cement or white ordinary Portland cement (WOPC) is similar to ordinary, gray Portland cement in all aspects except for its high degree of whiteness. Obtaining this color requires substantial modifications to the method of manufacturing. It requires a much lower content in colored impurities in the raw materials used to produce clinker: low levels of Cr2O3, Mn2O3, and Fe2O3), but above all, a higher temperature is needed for the final sintering step in the cement kiln because of the higher melting point of the mix depleted in iron oxides. Because of this, the process is more energy demanding and the white cement is somewhat more expensive than the gray product.
Soldering is a process of joining two metal surfaces together using a filler metal called solder. The soldering process involves heating the surfaces to be joined and melting the solder, which is then allowed to cool and solidify, creating a strong and durable joint.
Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for surface micro-machined structures, e.g., accelerometers or gyroscopes. This technique utilizes low melting-point glass and therefore provides various advantages including that viscosity of glass decreases with an increase of temperature. The viscous flow of glass has effects to compensate and planarize surface irregularities, convenient for bonding wafers with a high roughness due to plasma etching or deposition. A low viscosity promotes hermetically sealed encapsulation of structures based on a better adaption of the structured shapes. Further, the coefficient of thermal expansion (CTE) of the glass material is adapted to silicon. This results in low stress in the bonded wafer pair. The glass has to flow and wet the soldered surfaces well below the temperature where deformation or degradation of either of the joined materials or nearby structures occurs. The usual temperature of achieving flowing and wetting is between 450 and 550 °C.
Granulation is a jewellery manufacturing technique whereby a surface is covered in spherules or granules of precious metal. The technique is thought to have its origins in Sumer about 5,000 years ago. This technique then spread to southern Europe during the orientalizing period, also through the role of Phoenicians, who had founded colonies in Sardinia, Sicily and Spain, or Near Eastern craftsmen.
Aluminium alloys are often used due to their high strength-to-weight ratio, corrosion resistance, low cost, high thermal and electrical conductivity. There are a variety of techniques to join aluminium including mechanical fasteners, welding, adhesive bonding, brazing, soldering and friction stir welding (FSW), etc. Various techniques are used based on the cost and strength required for the joint. In addition, process combinations can be performed to provide means for difficult-to-join assemblies and to reduce certain process limitations.
