Electrostatic discharge (ESD) is a sudden and momentary flow of electric current between two electrically charged objects caused by contact, an electrical short or dielectric breakdown. A buildup of static electricity can be caused by tribocharging or by electrostatic induction. The ESD occurs when differently-charged objects are brought close together or when the dielectric between them breaks down, often creating a visible spark.
Hygroscopy is the phenomenon of attracting and holding water molecules via either absorption or adsorption from the surrounding environment, which is usually at normal or room temperature. If water molecules become suspended among the substance's molecules, adsorbing substances can become physically changed, e.g., changing in volume, boiling point, viscosity or some other physical characteristic or property of the substance. For example, a finely dispersed hygroscopic powder, such as a salt, may become clumpy over time due to collection of moisture from the surrounding environment.
Silica gel is an amorphous and porous form of silicon dioxide (silica), consisting of an irregular tridimensional framework of alternating silicon and oxygen atoms with nanometer-scale voids and pores. The voids may contain water or some other liquids, or may be filled by gas or vacuum. In the last case, the material is properly called silica xerogel.
A hygrometer is an instrument which measures the humidity of air or some other gas: that is, how much water vapor it contains. Humidity measurement instruments usually rely on measurements of some other quantities such as temperature, pressure, mass and mechanical or electrical changes in a substance as moisture is absorbed. By calibration and calculation, these measured quantities can lead to a measurement of humidity. Modern electronic devices use the temperature of condensation, or they sense changes in electrical capacitance or resistance to measure humidity differences. A crude hygrometer was invented by Leonardo da Vinci in 1480. Major leaps came forward during the 1600s; Francesco Folli invented a more practical version of the device, while Robert Hooke improved a number of meteorological devices including the hygrometer. A more modern version was created by Swiss polymath Johann Heinrich Lambert in 1755. Later, in the year 1783, Swiss physicist and Geologist Horace Bénédict de Saussure invented the first hygrometer using human hair to measure humidity.
A desiccant is a hygroscopic substance that is used to induce or sustain a state of dryness (desiccation) in its vicinity; it is the opposite of a humectant. Commonly encountered pre-packaged desiccants are solids that absorb water. Desiccants for specialized purposes may be in forms other than solid, and may work through other principles, such as chemical bonding of water molecules. They are commonly encountered in foods to retain crispness. Industrially, desiccants are widely used to control the level of water in gas streams.
The MultiMediaCard, officially abbreviated as MMC, is a memory card standard used for solid-state storage. Unveiled in 1997 by SanDisk and Siemens, MMC is based on a surface-contact low pin-count serial interface using a single memory stack substrate assembly, and is therefore much smaller than earlier systems based on high pin-count parallel interfaces using traditional surface-mount assembly such as CompactFlash. Both products were initially introduced using SanDisk NOR-based flash technology.
Desiccation is the state of extreme dryness, or the process of extreme drying. A desiccant is a hygroscopic substance that induces or sustains such a state in its local vicinity in a moderately sealed container.
Desiccators are sealable enclosures containing desiccants used for preserving moisture-sensitive items such as cobalt chloride paper for another use. A common use for desiccators is to protect chemicals which are hygroscopic or which react with water from humidity.
A dry box is a storage container in which the interior is kept at a low level of humidity. It may be as simple as an airtight and watertight enclosure, or it may use active means to remove water vapor from the air trapped inside.
Copper(II) chloride, also known as cupric chloride, is an inorganic compound with the chemical formula CuCl2. The monoclinic yellowish-brown anhydrous form slowly absorbs moisture to form the orthorhombic blue-green dihydrate CuCl2·2H2O, with two water molecules of hydration. It is industrially produced for use as a co-catalyst in the Wacker process.
Moisture sensitivity level (MSL) is a rating that shows a device's susceptibility to damage due to absorbed moisture when subjected to reflow soldering as defined in J-STD-020. It relates to the packaging and handling precautions for some semiconductors. The MSL is an electronic standard for the time period in which a moisture sensitive device can be exposed to ambient room conditions.
The human-body model (HBM) is the most commonly used model for characterizing the susceptibility of an electronic device to damage from electrostatic discharge (ESD). The model is a simulation of the discharge which might occur when a human touches an electronic device.
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge. Product safety standards may dictate particular features of a consumer product, for example, external case temperature or grounding of exposed metal parts. Prototypes and industrial equipment made in small quantities may use standardized commercially available enclosures such as card cages or prefabricated boxes. Mass-market consumer devices may have highly specialized packaging to increase consumer appeal. Electronic packaging is a major discipline within the field of mechanical engineering.
Moisture analysis covers a variety of methods for measuring the moisture content in solids, liquids, or gases. For example, moisture is a common specification in commercial food production. There are many applications where trace moisture measurements are necessary for manufacturing and process quality assurance. Trace moisture in solids must be known in processes involving plastics, pharmaceuticals and heat treatment. Fields that require moisture measurement in gasses or liquids include hydrocarbon processing, pure semiconductor gases, bulk pure or mixed gases, dielectric gases such as those in transformers and power plants, and natural gas pipeline transport. Moisture content measurements can be reported in multiple units, such as: parts per million, pounds of water per million standard cubic feet of gas, mass of water vapor per unit volume or mass of water vapor per unit mass of dry gas.
Universal Flash Storage (UFS) is a flash storage specification for digital cameras, mobile phones and consumer electronic devices. It was designed to bring higher data transfer speed and increased reliability to flash memory storage, while reducing market confusion and removing the need for different adapters for different types of cards. The standard encompasses both packages permanently attached (embedded) within a device (eUFS), and removable UFS memory cards.
Reliability of semiconductor devices can be summarized as follows:
- Semiconductor devices are very sensitive to impurities and particles. Therefore, to manufacture these devices it is necessary to manage many processes while accurately controlling the level of impurities and particles. The finished product quality depends upon the many layered relationship of each interacting substance in the semiconductor, including metallization, chip material and package.
- The problems of micro-processes, and thin films and must be fully understood as they apply to metallization and wire bonding. It is also necessary to analyze surface phenomena from the aspect of thin films.
- Due to the rapid advances in technology, many new devices are developed using new materials and processes, and design calendar time is limited due to non-recurring engineering constraints, plus time to market concerns. Consequently, it is not possible to base new designs on the reliability of existing devices.
- To achieve economy of scale, semiconductor products are manufactured in high volume. Furthermore, repair of finished semiconductor products is impractical. Therefore, incorporation of reliability at the design stage and reduction of variation in the production stage have become essential.
- Reliability of semiconductor devices may depend on assembly, use, environmental, and cooling conditions. Stress factors affecting device reliability include gas, dust, contamination, voltage, current density, temperature, humidity, mechanical stress, vibration, shock, radiation, pressure, and intensity of magnetic and electrical fields.
A semiconductor package is a metal, plastic, glass, or ceramic casing containing one or more discrete semiconductor devices or integrated circuits. Individual components are fabricated on semiconductor wafers before being diced into die, tested, and packaged. The package provides a means for connecting it to the external environment, such as printed circuit board, via leads such as lands, balls, or pins; and protection against threats such as mechanical impact, chemical contamination, and light exposure. Additionally, it helps dissipate heat produced by the device, with or without the aid of a heat spreader. There are thousands of package types in use. Some are defined by international, national, or industry standards, while others are particular to an individual manufacturer.
In electronics, TO-18 is a designation for a style of transistor metal case. The case is more expensive than the similarly sized plastic TO-92 package. The name is from JEDEC, signifying Transistor Outline Package, Case Style 18.
Electronic components have a wide range of failure modes. These can be classified in various ways, such as by time or cause. Failures can be caused by excess temperature, excess current or voltage, ionizing radiation, mechanical shock, stress or impact, and many other causes. In semiconductor devices, problems in the device package may cause failures due to contamination, mechanical stress of the device, or open or short circuits.
In electronics, TO-8 is a designation for a standardized metal semiconductor package. TO in TO-8 stands for "transistor outline" and refers to a series of technical drawings produced by JEDEC. The TO-8 package is noticeably larger than the more common TO-5 package. While originally designed for medium power transistors such as the 2N1483 series or the AD136, it is more commonly used for integrated circuits and sensors.
