Michael A. Sutton

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Michael A. Sutton is an American Engineering professor. He is Carolina Distinguished Professor and Distinguished Professor Emeritus of Mechanical Engineering at the University of South Carolina-Columbia. He served as Chairperson of Mechanical Engineering and Chair of the University Tenure and Promotion Committee. In 1998, Dr. Sutton co-founded Correlated Solutions, Inc. in Columbia, SC, and he still serves as its CSO.

Contents

Research

Sutton is the author of more than 230 journal articles. He is most known for his contributions to the invention, development and validation of the non-contacting, image-based deformation measurement methods known as digital image correlation methods, or DIC.[ citation needed ]

Career

In the early 1980s, Sutton and his co-workers invented the first DIC method, known as two-dimensional DIC or 2D-DIC. This method is applicable for surface measurements on planar specimens undergoing nominally in-plane deformation.

While working with NASA researchers as part of the US Aging Aircraft Program, Sutton showed that crack tip opening displacement, or the more general mixed mode form using three-dimensional crack tip displacements, is a valid crack growth predictor for the thin aerospace aluminum alloy components such as 2024-T3 and 2424-T3 commonly used in commercial aviation.

Their research led to the establishment of an ASTM Standard test method for determining resistance to stable crack extension under low-constraint conditions. [1] This test is used to demonstrate the fracture resistance of thin aerospace structures when subjected to mechanical loads.

During the mid-1990s, Sutton and his colleagues advanced the quantitative characterization of the crack tip strain fields in highly ductile materials. They studied the theoretical Hutchinson-Rice-Rosengren (HRR) crack tip strain fields. They measured the elastic-plastic strains and showed that the crack tip strain fields were in approximate agreement with theoretical predictions for nominally Mode I loading conditions. The work received the SEM RE Peterson Award [2] in 1996 as the outstanding application research article published in Experimental Mechanics . In the early 1990s, it became clear that limitations inherent to the 2D-DIC method could be removed by modifying the vision system.

Sutton and his co-workers invented and regularly improved the new measurement system. The vision system nominally employs two cameras to view a single region. Since all three components of displacement are measured, the method was initially termed three-dimensional digital image correlation (3D-DIC). With the development of volumetric DIC methods circa 2000, the term StereoDIC was adopted. The ability to make internal (volumetric) measurements in those materials having sufficient internal volumetric image contrast was demonstrated by Brian Bay c. 2000. The method is a direct extension of 2D-DIC and is known as either volumetric digital image correlation[ citation needed ] (V-DIC) or digital volume correlation (DVC). Even though successful StereoDIC experiments were performed in a laboratory setting, [3] [4] the system's complex calibrations limited its usefulness to optical benches and/or well-controlled laboratory conditions.

During an 18-month sabbatical at NASA Langley (1992–93) sponsored by Charles E. Harris, Sutton worked directly with James C. Newman Jr, David Dawicke, Robert Piascik, Edward Phillips and Buddy Poe on issues related to crack extension as part of the US Aging Aircraft Program. During this time, Sutton was exposed to the critical need for a field-capable, three-dimensional deformation measurement system that could be used on full-scale aero-structures undergoing complex loading. With this information and with Harris' support, Sutton and Stephen McNeill worked with their student Jeffrey Helm, to modify the StereoDIC algorithms and define a simpler, field-capable calibration process.

By late 1994, a modified StereoDIC system and calibration process were developed. The field-capable StereoDIC methodology was published in 1996 [5] with more advanced application of StereoDIC to thin aerospace structures published in 2003. [6] Shortly after the modified StereoDIC system was completed, and with continued financial support from Harris, the system was transported to the West Coast and used to complete a week of field experimentation on a full-scale airplane in Seattle, WA. For these experiments, the aircraft was subjected to a combination of internal pressurization and tail loading. Measurements were obtained successfully at three separate locations on the test article. [7] [8] These experiments conclusively demonstrated the versatility, accuracy and effectiveness of StereoDIC systems for non-contacting, full-field deformation and shape measurements in both field and laboratory environments.

In the early 2000s, research scientists including Michael Mello at Intel Corporation identified DIC as a critical technology for high magnification measurements for advanced computer chip material systems. Discussions with Intel scientists led to the choice of scanning electron microscope and atomic force microscope imaging systems. High magnification images of chip components used with DIC provided full-field deformation measurements in regions as small as 20μm x 20μm. Between 2002 and 2010, Sutton applied 2D-DIC to quantitative measurements of deformations in small regions on heterogeneous chip cross-sections undergoing thermal loading. After noting high noise levels in AFM systems Sutton, Ning Li and Xiaodong Li focused on scanning electron microscope systems. They obtained spatial resolution of 10 nanometers, while reducing displacement variability to less than one nanometer. [9]

In the late 2000s, Thomas Borg introduced Sutton to Susan Lessner. Lessner had a long-term interest in measuring the response of soft biological tissues, such as arteries, when subjected to mechanical loading. Working with Lessner for over a decade, Sutton developed the use of StereoDIC systems to acquire accurate deformations on curvilinear arterial specimens subjected to combined pressure and axial loading. Of particular interest was the work performed with Ying Wang regarding the separation resistance of arterial tissues that incurred arterial dissection[ citation needed ] during mechanical loading. Focusing on fundamental concepts in fracture mechanics to provide a framework for assessing adhesive resistance in bio-materials, the work demonstrated that energy release rate[ citation needed ] was an excellent parameter to characterize the separation resistance of dissections in arterial tissues. [10] The work demonstrated that energy release rate is an effective metric to assess the effect of local collagen content on separation resistance in arterial specimens. [11]

As the use of DIC methods expanded worldwide, the potential of this non-contact method to provide important process information during manufacturing was recognized. Recognizing manufacturing as an area where limited investigators have been active. Sutton worked with colleagues to improve understanding of advanced manufacturing processes in both civil infrastructure and selected aerospace composite applications.

The US is rapidly expanding its use of relatively rigid, prestressed concrete railroad ties as a precursor to the development of high-speed rail systems. Imaging a concrete beam before and after application of a compressive pre-load confirms that the use of a StereoDIC system is an effective and accurate non-contact approach for measuring small surface strain fields. StereoDIC measurements provide essential data to reliably estimate the transfer length [12] and confirm that the entire concrete portion of the beam has the required compressive stress to maintain compression throughout service life.

The adhesion of uncured, unidirectional composite tows that are adhered to a similar composite tow using automated fiber placement (AFP) processing can be tested using StereoDIC. A temperature and wear-resistant pattern is adhered to composite tows and then the deformations of the tow is measured as it is heated and bonded during AFP processing. A modified double cantilever beam adhesive specimen based on the work of Högberg [13] can be used to obtain the traction-separation law to be used in cohesive zone modeling law[ citation needed ] of the tow-to-tow bond layer.

Recognition

Selected publications

Related Research Articles

<span class="mw-page-title-main">Fracture</span> Split of materials or structures under stress

Fracture is the appearance of a crack or complete separation of an object or material into two or more pieces under the action of stress. The fracture of a solid usually occurs due to the development of certain displacement discontinuity surfaces within the solid. If a displacement develops perpendicular to the surface, it is called a normal tensile crack or simply a crack; if a displacement develops tangentially, it is called a shear crack, slip band, or dislocation.

The field of strength of materials typically refers to various methods of calculating the stresses and strains in structural members, such as beams, columns, and shafts. The methods employed to predict the response of a structure under loading and its susceptibility to various failure modes takes into account the properties of the materials such as its yield strength, ultimate strength, Young's modulus, and Poisson's ratio. In addition, the mechanical element's macroscopic properties such as its length, width, thickness, boundary constraints and abrupt changes in geometry such as holes are considered.

<span class="mw-page-title-main">Strain gauge</span> Electronic component used to measure strain

A strain gauge is a device used to measure strain on an object. Invented by Edward E. Simmons and Arthur C. Ruge in 1938, the most common type of strain gauge consists of an insulating flexible backing which supports a metallic foil pattern. The gauge is attached to the object by a suitable adhesive, such as cyanoacrylate. As the object is deformed, the foil is deformed, causing its electrical resistance to change. This resistance change, usually measured using a Wheatstone bridge, is related to the strain by the quantity known as the gauge factor.

Stress–strain analysis is an engineering discipline that uses many methods to determine the stresses and strains in materials and structures subjected to forces. In continuum mechanics, stress is a physical quantity that expresses the internal forces that neighboring particles of a continuous material exert on each other, while strain is the measure of the deformation of the material.

<span class="mw-page-title-main">Photogrammetry</span> Taking measurements using photography

Photogrammetry is the science and technology of obtaining reliable information about physical objects and the environment through the process of recording, measuring and interpreting photographic images and patterns of electromagnetic radiant imagery and other phenomena.

<span class="mw-page-title-main">Fracture mechanics</span> Study of propagation of cracks in materials

Fracture mechanics is the field of mechanics concerned with the study of the propagation of cracks in materials. It uses methods of analytical solid mechanics to calculate the driving force on a crack and those of experimental solid mechanics to characterize the material's resistance to fracture.

Particle image velocimetry (PIV) is an optical method of flow visualization used in education and research. It is used to obtain instantaneous velocity measurements and related properties in fluids. The fluid is seeded with tracer particles which, for sufficiently small particles, are assumed to faithfully follow the flow dynamics. The fluid with entrained particles is illuminated so that particles are visible. The motion of the seeding particles is used to calculate speed and direction of the flow being studied.

<span class="mw-page-title-main">Photoelasticity</span> Change in optical properties of a material due to stress

In materials science, photoelasticity describes changes in the optical properties of a material under mechanical deformation. It is a property of all dielectric media and is often used to experimentally determine the stress distribution in a material.

<span class="mw-page-title-main">Electron backscatter diffraction</span> Scanning electron microscopy technique

Electron backscatter diffraction (EBSD) is a scanning electron microscopy (SEM) technique used to study the crystallographic structure of materials. EBSD is carried out in a scanning electron microscope equipped with an EBSD detector comprising at least a phosphorescent screen, a compact lens and a low-light camera. In the microscope an incident beam of electrons hits a tilted sample. As backscattered electrons leave the sample, they interact with the atoms and are both elastically diffracted and lose energy, leaving the sample at various scattering angles before reaching the phosphor screen forming Kikuchi patterns (EBSPs). The EBSD spatial resolution depends on many factors, including the nature of the material under study and the sample preparation. They can be indexed to provide information about the material's grain structure, grain orientation, and phase at the micro-scale. EBSD is used for impurities and defect studies, plastic deformation, and statistical analysis for average misorientation, grain size, and crystallographic texture. EBSD can also be combined with energy-dispersive X-ray spectroscopy (EDS), cathodoluminescence (CL), and wavelength-dispersive X-ray spectroscopy (WDS) for advanced phase identification and materials discovery.

Discontinuous deformation analysis (DDA) is a type of discrete element method (DEM) originally proposed by Shi in 1988. DDA is somewhat similar to the finite element method for solving stress-displacement problems, but accounts for the interaction of independent particles (blocks) along discontinuities in fractured and jointed rock masses. DDA is typically formulated as a work-energy method, and can be derived using the principle of minimum potential energy or by using Hamilton's principle. Once the equations of motion are discretized, a step-wise linear time marching scheme in the Newmark family is used for the solution of the equations of motion. The relation between adjacent blocks is governed by equations of contact interpenetration and accounts for friction. DDA adopts a stepwise approach to solve for the large displacements that accompany discontinuous movements between blocks. The blocks are said to be "simply deformable". Since the method accounts for the inertial forces of the blocks' mass, it can be used to solve the full dynamic problem of block motion.

Digital image correlation and tracking is an optical method that employs tracking and image registration techniques for accurate 2D and 3D measurements of changes in images. This method is often used to measure full-field displacement and strains, and it is widely applied in many areas of science and engineering. Compared to strain gauges and extensometers, digital image correlation methods provide finer details about deformation, due to the ability to provide both local and average data.

MEMS for in situ mechanical characterization refers to microelectromechanical systems (MEMS) used to measure the mechanical properties of nanoscale specimens such as nanowires, nanorods, whiskers, nanotubes and thin films. They distinguish themselves from other methods of nanomechanical testing because the sensing and actuation mechanisms are embedded and/or co-fabricated in the microsystem, providing—in the majority of cases—greater sensitivity and precision.

<span class="mw-page-title-main">Ares J. Rosakis</span> Professor of Aeronautics (born 1956)

Ares J. Rosakis, Theodore von Kármán Professor of Aeronautics and Professor of Mechanical Engineering at the California Institute of Technology. He was also the fifth Director of the Graduate Aerospace Laboratories, known as (GALCIT), and formerly known as Guggenheim Aeronautical Laboratory, and was the Otis Booth Leadership Chair, of the Division of Engineering and Applied Science.

<span class="mw-page-title-main">Crack tip opening displacement</span>

Crack tip opening displacement (CTOD) or is the distance between the opposite faces of a crack tip at the 90° intercept position. The position behind the crack tip at which the distance is measured is arbitrary but commonly used is the point where two 45° lines, starting at the crack tip, intersect the crack faces. The parameter is used in fracture mechanics to characterize the loading on a crack and can be related to other crack tip loading parameters such as the stress intensity factor and the elastic-plastic J-integral.

Cesar Augusto Sciammarella is an Argentine civil engineer who made significant contributions to the field of experimental mechanics. In the last decade, he has extended his pioneering developments in moiré, holography, and speckle interferometry methodologies down to the nanometer level. These efforts have enabled optics to be applied beyond the classical Rayleigh limit, reaching the nanometer range.

Traction force microscopy (TFM) is an experimental method for determining the tractions on the surface of a biological cell by obtaining measurements of the surrounding displacement field within an in vitro extracellular matrix (ECM).

YaDICs is a program written to perform digital image correlation on 2D and 3D tomographic images. The program was designed to be both modular, by its plugin strategy and efficient, by it multithreading strategy. It incorporates different transformations, optimizing strategy, Global and/or local shape functions ...

Digital image correlation analyses have applications in material property characterization, displacement measurement, and strain mapping. As such, DIC is becoming an increasingly popular tool when evaluating the thermo-mechanical behavior of electronic components and systems.

<span class="mw-page-title-main">Biaxial tensile testing</span> Testing a materials tensile strength along two perpendicular axes

In materials science and solid mechanics, biaxial tensile testing is a versatile technique to address the mechanical characterization of planar materials. It is a generalized form of tensile testing in which the material sample is simultaneously stressed along two perpendicular axes. Typical materials tested in biaxial configuration include metal sheets, silicone elastomers, composites, thin films, textiles and biological soft tissues.

<span class="mw-page-title-main">Slip bands in metals</span> Deformation mechanism in crystallines

Slip bands or stretcher-strain marks are localized bands of plastic deformation in metals experiencing stresses. Formation of slip bands indicates a concentrated unidirectional slip on certain planes causing a stress concentration. Typically, slip bands induce surface steps and a stress concentration which can be a crack nucleation site. Slip bands extend until impinged by a boundary, and the generated stress from dislocations pile-up against that boundary will either stop or transmit the operating slip depending on its (mis)orientation.

References

  1. ↑ "ASTM E2472 - 12(2018) Standard Test Method for Determination of Resistance to Stable Crack Extension under Low-Constraint Conditions". www.astm.org.
  2. ↑ "Past Recipients". RE Peterson Award.
  3. ↑ Luo, PF.; et al. (June 1993). "Accurate measurement of three-dimensional deformations in deformable and rigid bodies using computer vision". Experimental Mechanics . 33 (2): 123–132. doi:10.1007/BF02322488. S2CID   136427692.
  4. ↑ Luo, PF.; et al. (1 March 1994). "Application of stereo vision to three-dimensional deformation analyses in fracture experiments". Optical Engineering. 33 (3): 981–990. Bibcode:1994OptEn..33..981L. doi:10.1117/12.160877.
  5. ↑ Helm, JD.; et al. (July 1996). "Improved three-dimensional image correlation for surface displacement measurement". Optical Engineering. 35 (7): 1911–1920. Bibcode:1996OptEn..35.1911H. doi:10.1117/1.600624.
  6. ↑ Helm, JD.; et al. (May 2003). "Deformations in wide, center-notched, thin panels, part I: three-dimensional shape and deformation measurements by computer vision". Optical Engineering. 42 (5): 1293–1320. Bibcode:2003OptEn..42.1293H. doi:10.1117/1.1566001.
  7. ↑ McNeil, SR.; et al. Experimental evaluation of surface deformations in three areas of a Boeing 727 aircraft due to internal pressure and tail loading, Report USC ME-1-1997 (Report).
  8. ↑ Sutton, MA.; et al. (January 2017). "Recent Progress in Digital Image Correlation: Background and Developments since the 2013 W M Murray Lecture". Experimental Mechanics . 57 (1): 1–30. doi:10.1007/s11340-016-0233-3. S2CID   255168149.
  9. ↑ Guo, SM.; et al. (January 2017). "Measurement of Local Thermal Deformations in Heterogeneous Microstructures via SEM Imaging with Digital Image Correlation". Experimental Mechanics . 57 (1): 41–56. doi:10.1007/s11340-016-0206-6. S2CID   255163320.
  10. ↑ Wang, Y.; et al. (14 July 2011). "Development of a quantitative mechanical test of atherosclerotic plaque stability". Journal of Biomechanics. 44 (13): 2439–45. doi:10.1016/j.jbiomech.2011.06.026. PMC   3156298 . PMID   21757197.
  11. ↑ Wang, Y.; et al. (22 Feb 2013). "Adhesive strength of atherosclerotic plaque in a mouse model depends on local collagen content and elastin fragmentation". Journal of Biomechanics. 46 (14): 716–22. doi:10.1016/j.jbiomech.2012.11.041. PMC   3568211 . PMID   23261250.
  12. ↑ Rajan, S.; et al. (13 Dec 2017). "A Stereovision Deformation Measurement System for Transfer Length Estimates in Prestressed Concrete". Experimental Mechanics. 58 (7): 1035–48. doi:10.1007/s11340-017-0357-0. S2CID   255162882.
  13. ↑ Högberg, JL.; et al. (15 December 2007). "Constitutive behaviour of mixed mode loaded adhesive layer". International Journal of Solids and Structures. 44 (25–26): 8335–54. doi: 10.1016/j.ijsolstr.2007.06.014 .
  14. ↑ "Society for Experimental Mechanics". sem.org.
  15. ↑ "Society for Experimental Mechanics". sem.org.
  16. ↑ "Society for Experimental Mechanics". sem.org.
  17. ↑ "ASME Fellow" (PDF).
  18. ↑ "Society for Experimental Mechanics". sem.org.
  19. ↑ "Society for Experimental Mechanics". sem.org.
  20. ↑ "Society for Experimental Mechanics". sem.org.
  21. ↑ William M. Murray Medalist acceptance lecture
  22. ↑ "Society for Experimental Mechanics". sem.org.
  23. ↑ "National Academy of Engineering Elects 86 Members and 18 International Members". NAE Website. Retrieved 2023-07-17.
  24. ↑ "Timoshenko Medal". www.asme.org. Retrieved 2023-07-17.
  25. ↑ Timoshenko Medal acceptance lecture
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