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Solder is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.
A solvent is a substance that dissolves a solute, resulting in a solution. A solvent is usually a liquid but can also be a solid, a gas, or a supercritical fluid. Water is a solvent for polar molecules and the most common solvent used by living things; all the ions and proteins in a cell are dissolved in water within the cell.
Solvation describes the interaction of a solvent with dissolved molecules. Both ionized and uncharged molecules interact strongly with a solvent, and the strength and nature of this interaction influence many properties of the solute, including solubility, reactivity, and color, as well as influencing the properties of the solvent such as its viscosity and density. If the attractive forces between the solvent and solute particles are greater than the attractive forces holding the solute particles together, the solvent particles pull the solute particles apart and surround them. The surrounded solute particles then move away from the solid solute and out into the solution. Ions are surrounded by a concentric shell of solvent. Solvation is the process of reorganizing solvent and solute molecules into solvation complexes and involves bond formation, hydrogen bonding, and van der Waals forces. Solvation of a solute by water is called hydration.
An electrolyte is a medium containing ions that is electrically conducting through the movement of those ions, but not conducting electrons. This includes most soluble salts, acids, and bases dissolved in a polar solvent, such as water. Upon dissolving, the substance separates into cations and anions, which disperse uniformly throughout the solvent. Solid-state electrolytes also exist. In medicine and sometimes in chemistry, the term electrolyte refers to the substance that is dissolved.
In chemistry, solubility is the ability of a substance, the solute, to form a solution with another substance, the solvent. Insolubility is the opposite property, the inability of the solute to form such a solution.
Extractive metallurgy is a branch of metallurgical engineering wherein process and methods of extraction of metals from their natural mineral deposits are studied. The field is a materials science, covering all aspects of the types of ore, washing, concentration, separation, chemical processes and extraction of pure metal and their alloying to suit various applications, sometimes for direct use as a finished product, but more often in a form that requires further working to achieve the given properties to suit the applications.
A lithium polymer battery, or more correctly lithium-ion polymer battery, is a rechargeable battery of lithium-ion technology using a polymer electrolyte instead of a liquid electrolyte. High conductivity semisolid (gel) polymers form this electrolyte. These batteries provide higher specific energy than other lithium battery types and are used in applications where weight is a critical feature, such as mobile devices, radio-controlled aircraft and some electric vehicles.
Surface-mount technology (SMT), originally called planar mounting, is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation which reduces cost and improves quality. It also allows for more components to fit on a given area of substrate. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors.
In metallurgy, a flux is a chemical cleaning agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time. They are used in both extractive metallurgy and metal joining.
Electromigration is the transport of material caused by the gradual movement of the ions in a conductor due to the momentum transfer between conducting electrons and diffusing metal atoms. The effect is important in applications where high direct current densities are used, such as in microelectronics and related structures. As the structure size in electronics such as integrated circuits (ICs) decreases, the practical significance of this effect increases.
Wave soldering is a bulk soldering process used for the manufacturing of printed circuit boards. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. As the circuit board makes contact with this wave, the components become soldered to the board. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount. In the latter case, the components are glued onto the surface of a printed circuit board (PCB) by placement equipment, before being run through the molten solder wave. Wave soldering is mainly used in soldering of through hole components.
An ionic liquid (IL) is a salt in the liquid state. In some contexts, the term has been restricted to salts whose melting point is below a specific temperature, such as 100 °C (212 °F). While ordinary liquids such as water and gasoline are predominantly made of electrically neutral molecules, ionic liquids are largely made of ions. These substances are variously called liquid electrolytes, ionic melts, ionic fluids, fused salts, liquid salts, or ionic glasses.
Ultrasonic cleaning is a process that uses ultrasound to agitate a fluid, with a cleaning effect. Ultrasonic cleaners come in a variety of sizes, from small desktop units with an internal volume of less than 0.5 litres (0.13 US gal), to large industrial units with volumes approaching 1,000 litres.
Solder paste is used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in and over the holes. The sticky paste temporarily holds components in place; the board is then heated, melting the paste and forming a mechanical bond as well as an electrical connection. The paste is applied to the board by jet printing, stencil printing or syringe; then the components are put in place by a pick-and-place machine or by hand.
Conformal coating is a protective coating of thin polymeric film applied to printed circuit boards (PCB), so named because it conforms to the contours of the PCB. Conformal coatings are typically applied at 25–250 μm to the electronic circuitry and provide protection against moisture, dust, chemicals, and temperature extremities.
Electronic packaging is the design and production of enclosures for electronic devices ranging from individual semiconductor devices up to complete systems such as a mainframe computer. Packaging of an electronic system must consider protection from mechanical damage, cooling, radio frequency noise emission and electrostatic discharge. Product safety standards may dictate particular features of a consumer product, for example, external case temperature or grounding of exposed metal parts. Prototypes and industrial equipment made in small quantities may use standardized commercially available enclosures such as card cages or prefabricated boxes. Mass-market consumer devices may have highly specialized packaging to increase consumer appeal. Electronic packaging is a major discipline within the field of mechanical engineering.
Reliability of semiconductor devices can be summarized as follows:
- Semiconductor devices are very sensitive to impurities and particles. Therefore, to manufacture these devices it is necessary to manage many processes while accurately controlling the level of impurities and particles. The finished product quality depends upon the many layered relationship of each interacting substance in the semiconductor, including metallization, chip material and package.
- The problems of micro-processes, and thin films and must be fully understood as they apply to metallization and wire bonding. It is also necessary to analyze surface phenomena from the aspect of thin films.
- Due to the rapid advances in technology, many new devices are developed using new materials and processes, and design calendar time is limited due to non-recurring engineering constraints, plus time to market concerns. Consequently, it is not possible to base new designs on the reliability of existing devices.
- To achieve economy of scale, semiconductor products are manufactured in high volume. Furthermore, repair of finished semiconductor products is impractical. Therefore, incorporation of reliability at the design stage and reduction of variation in the production stage have become essential.
- Reliability of semiconductor devices may depend on assembly, use, environmental, and cooling conditions. Stress factors affecting device reliability include gas, dust, contamination, voltage, current density, temperature, humidity, mechanical stress, vibration, shock, radiation, pressure, and intensity of magnetic and electrical fields.
Electronic components have a wide range of failure modes. These can be classified in various ways, such as by time or cause. Failures can be caused by excess temperature, excess current or voltage, ionizing radiation, mechanical shock, stress or impact, and many other causes. In semiconductor devices, problems in the device package may cause failures due to contamination, mechanical stress of the device, or open or short circuits.
Flowers of sulfur is a very fine, bright yellow sulfur powder that is produced by sublimation and deposition. It can contain up to 30% of the amorphous allotrope of sulfur, which is the noncrystalline structure of sulfur. It is known as flores sulphuris by apothecaries and in older scientific works. Natural sulfur was also known as brimstone, hence the alternative name flowers of brimstone.
The use of ionic liquids in carbon capture is a potential application of ionic liquids as absorbents for use in carbon capture and sequestration. Ionic liquids, which are salts that exist as liquids near room temperature, are polar, nonvolatile materials that have been considered for many applications. The urgency of climate change has spurred research into their use in energy-related applications such as carbon capture and storage.
References
- ↑ Licari, James J.; Swanson, Dale W. (2011). Adhesives Technology for Electronic Applications: Materials, Processing, Reliability. William Andrew. p. 171. ISBN 978-1437778908.
- ↑ Phil Isaacs; Jennifer Porto; Dave Braun; Terry Munson (23 February 2017). "Comparison of ionic contamination test methods to determine their ability to reliably predict performance risks". 2017 Pan Pacific Microelectronics Symposium (Pan Pacific). IEEE Xplore Digital Library: 1–7. Retrieved 2 March 2019.
- 1 2 P. Eckold; M. Routley; L. Henneken; G. Naisbitt; R. Fritsch; U. Welzel. "Process Control of Ionic Contamination Achieving 6-Sigma Criteria in The Assembly of Electronic Circuits" (PDF). Circuitinsight. Retrieved 2 March 2019.
- ↑ Hersey, R.J. Jr.; Meltzer, M.; Hofstad.H.W.; Lawrence, M.; Sanborn, R.; Arauco, H. (1 March 1995). "LLNL and TRW extend benchmark environmental stress testing for two alternative printed board cleaners". U.S. Department of Energy Office of Scientific and Technical Information. OSTI 70806.
{{cite journal}}: Cite journal requires|journal=(help) - ↑ "Relation Between PCBA Cleanliness and Climatic Reliability" (PDF). European Corrosion Commission. 2011. Retrieved 2 March 2019.
- ↑ Todd Rountree; Steve Stach (1 February 2018). Problems with rose testing using today's fluxes. pp. 1–5. doi:10.23919/PanPacific.2018.8319003. ISBN 978-1-944543-04-4. S2CID 3953657 . Retrieved 2 March 2019.
{{cite book}}:|work=ignored (help) - ↑ Todd Rountree; Steve Stach. "Addressing the problems with ionic cleanliness testing on modern circuits" (PDF). Austin American Technology. Retrieved 2 March 2019.
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