Red plague (corrosion)

Last updated

Red plague is an accelerated corrosion of copper when plated with silver. After storage, damage or use in high-humidity environment, cuprous oxide forms on the surface of the parts. The corrosion is identifiable by presence of patches of brown-red powder deposit on the exposed copper. [1]

Red plague is caused by normally occurring electrode potential difference between the copper and silver, leading to galvanic corrosion occurring in pits or breaks in the silver plating. It develops in the presence of moisture and oxygen when the porosity of the silver layer allows them to come in contact with the copper-silver interface. It is an electrochemical corrosion—a copper-silver galvanic cell forms and the copper acts as sacrificial anode. In suitable conditions, the corrosion can proceed rather quickly and lead to total circuit failure.

More details can be seen in ESA document PSS-01-720, [2] with details on determining the susceptibility of silver-plated copper wire to red plague corrosion found in ECSS-Q-ST-70-20C. [3]

It is not to be confused with purple plague, a type of galvanic corrosion that occurs between gold and aluminum. [4]

Related Research Articles

<span class="mw-page-title-main">Rust</span> Type of iron oxide

Rust is an iron oxide, a usually reddish-brown oxide formed by the reaction of iron and oxygen in the catalytic presence of water or air moisture. Rust consists of hydrous iron(III) oxides (Fe2O3·nH2O) and iron(III) oxide-hydroxide (FeO(OH), Fe(OH)3), and is typically associated with the corrosion of refined iron.

<span class="mw-page-title-main">Stainless steel</span> Steel alloy resistant to corrosion

Stainless steel, also known as inox, corrosion-resistant steel (CRES), or Rustless steel, is an alloy of iron that is resistant to rusting and corrosion. It contains at least 10.5% chromium and usually nickel, and may also contain other elements, such as carbon, to obtain the desired properties. Stainless steel's resistance to corrosion results from the chromium, which forms a passive film that can protect the material and self-heal in the presence of oxygen.

<span class="mw-page-title-main">Solder</span> Alloy used to join metal pieces

Solder is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.

The Kirkendall effect is the motion of the interface between two metals that occurs as a consequence of the difference in diffusion rates of the metal atoms. The effect can be observed for example by placing insoluble markers at the interface between a pure metal and an alloy containing that metal, and heating to a temperature where atomic diffusion is reasonable for the given timescale; the boundary will move relative to the markers.

<span class="mw-page-title-main">Corrosion</span> Gradual destruction of materials by chemical reaction with its environment

Corrosion is a natural process that converts a refined metal into a more chemically stable oxide. It is the gradual deterioration of materials by chemical or electrochemical reaction with their environment. Corrosion engineering is the field dedicated to controlling and preventing corrosion.

Cupronickel or copper-nickel (CuNi) is an alloy of copper that contains nickel and strengthening elements, such as iron and manganese. The copper content typically varies from 60 to 90 percent.

<span class="mw-page-title-main">Lemon battery</span> Simple battery made with a lemon for educational purposes

A lemon battery is a simple battery often made for the purpose of education. Typically, a piece of zinc metal and a piece of copper are inserted into a lemon and connected by wires. Power generated by reaction of the metals is used to power a small device such as a light-emitting diode (LED).

<span class="mw-page-title-main">Wire bonding</span> Technique used to connect a microchip to its package

Wire bonding is the method of making interconnections between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. Wire bonding can be used at frequencies above 100 GHz.

<span class="mw-page-title-main">Galvanic cell</span> Electrochemical device

A galvanic cell or voltaic cell, named after the scientists Luigi Galvani and Alessandro Volta, respectively, is an electrochemical cell in which an electric current is generated from spontaneous Oxidation-Reduction reactions. A common apparatus generally consists of two different metals, each immersed in separate beakers containing their respective metal ions in solution that are connected by a salt bridge or separated by a porous membrane.

<span class="mw-page-title-main">Cathodic protection</span> Corrosion prevention technique

Cathodic protection is a technique used to control the corrosion of a metal surface by making it the cathode of an electrochemical cell. A simple method of protection connects the metal to be protected to a more easily corroded "sacrificial metal" to act as the anode. The sacrificial metal then corrodes instead of the protected metal. For structures such as long pipelines, where passive galvanic cathodic protection is not adequate, an external DC electrical power source is used to provide sufficient current.

<span class="mw-page-title-main">Brazing</span> Metal-joining technique

Brazing is a metal-joining process in which two or more metal items are joined together by melting and flowing a filler metal into the joint, with the filler metal having a lower melting point than the adjoining metal.

<span class="mw-page-title-main">Hydrogen embrittlement</span> Reduction in ductility of a metal exposed to hydrogen

Hydrogen embrittlement (HE), also known as hydrogen-assisted cracking or hydrogen-induced cracking (HIC), is a reduction in the ductility of a metal due to absorbed hydrogen. Hydrogen atoms are small and can permeate solid metals. Once absorbed, hydrogen lowers the stress required for cracks in the metal to initiate and propagate, resulting in embrittlement. Hydrogen embrittlement occurs most notably in steels, as well as in iron, nickel, titanium, cobalt, and their alloys. Copper, aluminium, and stainless steels are less susceptible to hydrogen embrittlement.

Plating is a finishing process in which a metal is deposited on a surface. Plating has been done for hundreds of years; it is also critical for modern technology. Plating is used to decorate objects, for corrosion inhibition, to improve solderability, to harden, to improve wearability, to reduce friction, to improve paint adhesion, to alter conductivity, to improve IR reflectivity, for radiation shielding, and for other purposes. Jewelry typically uses plating to give a silver or gold finish.

<span class="mw-page-title-main">Gold plating</span> Coating an object with a thin layer of gold

Gold plating is a method of depositing a thin layer of gold onto the surface of another metal, most often copper or silver, by chemical or electrochemical plating. This article covers plating methods used in the modern electronics industry; for more traditional methods, often used for much larger objects, see gilding.

The galvanic series determines the nobility of metals and semi-metals. When two metals are submerged in an electrolyte, while also electrically connected by some external conductor, the less noble (base) will experience galvanic corrosion. The rate of corrosion is determined by the electrolyte, the difference in nobility, and the relative areas of the anode and cathode exposed to the electrolyte. The difference can be measured as a difference in voltage potential: the less noble metal is the one with a lower electrode potential than the nobler one, and will function as the anode within the electrolyte device functioning as described above. Galvanic reaction is the principle upon which batteries are based.

<span class="mw-page-title-main">Intergranular corrosion</span> When crystallite boundaries are more corrosive than their interiors

In materials science, intergranular corrosion (IGC), also known as intergranular attack (IGA), is a form of corrosion where the boundaries of crystallites of the material are more susceptible to corrosion than their insides.

Crevice corrosion refers to corrosion occurring in occluded spaces such as interstices in which a stagnant solution is trapped and not renewed. These spaces are generally called crevices. Examples of crevices are gaps and contact areas between parts, under gaskets or seals, inside cracks and seams, spaces filled with deposits and under sludge piles.

<span class="mw-page-title-main">European Cooperation for Space Standardization</span> Standardization organization for European space activities

The European Cooperation for Space Standardization (ECSS) is a collaboration between the European Space Agency (ESA), the European space industry represented by Eurospace, and several space agencies, to develop and maintain a coherent, single set of user-friendly standards for use in all European space activities. Established in 1993 following a call by Eurospace to unify space products assurance standardization on a European level, it was officially adopted by the ESA on 23 June 1994 through the resolution ESA/C/CXIII/Res.1, to replace its own Procedures, Specifications and Standards (PSS) system. The ECSS currently has 139 active standards, forming the ECSS system. These standards cover management, engineering, product assurance, and space sustainability disciplines. The ECSS is managed by the ESA Requirement and Standard Division, based in the European Space Research and Technology Centre (ESTEC) in Noordwijk, the Netherlands. The ECSS maintains connections with multiple European and international standardization organizations, to contribute to standardization and to adopt relevant standards as part of the ECSS system.

<span class="mw-page-title-main">Copper conductor</span> Electrical wire or other conductor made of copper

Copper has been used in electrical wiring since the invention of the electromagnet and the telegraph in the 1820s. The invention of the telephone in 1876 created further demand for copper wire as an electrical conductor.

<span class="mw-page-title-main">Galvanic corrosion</span> Electrochemical process

Galvanic corrosion is an electrochemical process in which one metal corrodes preferentially when it is in electrical contact with another, in the presence of an electrolyte. A similar galvanic reaction is exploited in primary cells to generate a useful electrical voltage to power portable devices. This phenomenon is named after Italian physician Luigi Galvani (1737-1798).

References

  1. "RED PLAGUE CONTROL PLAN (RPCP)" (PDF). nasa.gov.
  2. PSS-01-720 Corrosion of Silver-Plated Copper Conductors
  3. ECSS-Q-ST-70-20C – Determination of the susceptibility of silver-plated copper wire and cable to “red-plague” corrosion (31 July 2008)
  4. "INSECTION, PREVENTION, CONTROL, AND REPAIR OF CORROSION ON AVIONICS EQUIPMENT" (PDF). faa.gov.