Process
Ultrasonic soldering is a distinctly different process than ultrasonic welding. Ultrasonic welding uses ultrasonic energy to join parts without adding any kind of filler material while ultrasonic soldering uses external heating to melt filler metal materials, namely solders, to form a joint.
Ultrasonic soldering can be done with either a specialized soldering iron or a specialized solder pot. In either case the process can be automated for large-scale production or can be done by hand for prototyping or repair work. Initially, U/S soldering was aimed at joining aluminum and other metals; however, with the emergence of active solders, a much wider range of metals, ceramics and glass can now be soldered.
Ultrasonic soldering uses either ultrasonically coupled heated solder iron tips (0.5—10 mm) or ultrasonically coupled solder baths. In these devices, piezoelectric crystals are used to generate high frequency (20—60 kHz) acoustic waves in molten solder layers or batch, to mechanically disrupt oxides that form on the molten solder surfaces. The tips for ultrasonic soldering irons are also coupled to a heating element while the piezoelectric crystal is thermally isolated, in order to prevent degradation of the piezoelectric element. Ultrasonic soldering iron tips can heat (up to 450 °C) while mechanically oscillating at 20—60 kHz. This soldering tip can melt solder filler metals as acoustic vibrations are induced in the molten solder pool. The vibration and cavitation in the molten solder then permits solders to wet and adhere to many metal surfaces.
The acoustic energy created by the solder tip or ultrasonic solder pot works via cavitation of the molten solder which mechanically disrupts oxide layers on the solder layers themselves and on metal surfaces being joined.
Cavitation in the molten solder pool can be very effective in disrupting the oxides on many metals, however, it is not effective when soldering to ceramics and glass since they themselves are oxides or other non-metal compound that cannot be disrupted since they are the base materials. In the cases of soldering direct to glasses and ceramics, ultrasonic soldering filler metals need to be modified with active elements such as In, Ti, Hf, Zr and rare earth elements (Ce, La, and Lu). Solders when alloyed with these elements are called active solders since they directly act on the glass/ceramic surfaces to create a bond.
A soldering iron is a hand tool used in soldering. It supplies heat to melt solder so that it can flow into the joint between two workpieces.
Solder is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to adhere to and connect the pieces after cooling, which requires that an alloy suitable for use as solder have a lower melting point than the pieces being joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.
Welding is a fabrication process that joins materials, usually metals or thermoplastics, by using high heat to melt the parts together and allowing them to cool, causing fusion. Welding is distinct from lower temperature techniques such as brazing and soldering, which do not melt the base metal.
Ball bonding is a type of wire bonding, and is the most common way to make the electrical interconnections between a bare silicon die and the lead frame of the package it is placed in during semiconductor device fabrication.
Submerged arc welding (SAW) is a common arc welding process. The first SAW patent was taken out in 1935. The process requires a continuously fed consumable solid or tubular electrode. The molten weld and the arc zone are protected from atmospheric contamination by being "submerged" under a blanket of granular fusible flux consisting of lime, silica, manganese oxide, calcium fluoride, and other compounds. When molten, the flux becomes conductive, and provides a current path between the electrode and the work. This thick layer of flux completely covers the molten metal thus preventing spatter and sparks as well as suppressing the intense ultraviolet radiation and fumes that are a part of the shielded metal arc welding (SMAW) process.
Metalworking is the process of shaping and reshaping metals to create useful objects, parts, assemblies, and large scale structures. As a term it covers a wide and diverse range of processes, skills, and tools for producing objects on every scale: from huge ships, buildings, and bridges down to precise engine parts and delicate jewelry.
Brazing is a metal-joining process in which two or more metal items are joined together by melting and flowing a filler metal into the joint, with the filler metal having a lower melting point than the adjoining metal.
In metallurgy, a flux is a chemical cleaning agent, flowing agent, or purifying agent. Fluxes may have more than one function at a time. They are used in both extractive metallurgy and metal joining.
Ultrasonic welding is an industrial process whereby high-frequency ultrasonic acoustic vibrations are locally applied to workpieces being held together under pressure to create a solid-state weld. It is commonly used for plastics and metals, and especially for joining dissimilar materials. In ultrasonic welding, there are no connective bolts, nails, soldering materials, or adhesives necessary to bind the materials together. When applied to metals, a notable characteristic of this method is that the temperature stays well below the melting point of the involved materials thus preventing any unwanted properties which may arise from high temperature exposure of the materials.
Ultra-high vacuum (UHV) is the vacuum regime characterised by pressures lower than about 100 nanopascals. UHV conditions are created by pumping the gas out of a UHV chamber. At these low pressures the mean free path of a gas molecule is greater than approximately 40 km, so the gas is in free molecular flow, and gas molecules will collide with the chamber walls many times before colliding with each other. Almost all molecular interactions therefore take place on various surfaces in the chamber.
Ultrasonic cleaning is a process that uses ultrasound to agitate a fluid. The ultrasound can be used with just water, but use of a solvent appropriate for the object to be cleaned and the type of soiling present enhances the effect. Cleaning normally lasts between three and six minutes, but can also exceed 20 minutes, depending on which object has to be cleaned.
Dip soldering is a small-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly. The solder wets to the exposed metallic areas of the board, creating a reliable mechanical and electrical connection.
Oxy-fuel welding and oxy-fuel cutting are processes that use fuel gases and oxygen to weld or cut metals. French engineers Edmond Fouché and Charles Picard became the first to develop oxygen-acetylene welding in 1903. Pure oxygen, instead of air, is used to increase the flame temperature to allow localized melting of the workpiece material in a room environment. A common propane/air flame burns at about 2,250 K, a propane/oxygen flame burns at about 2,526 K, an oxyhydrogen flame burns at 3,073 K and an acetylene/oxygen flame burns at about 3,773 K.
Glass-to-metal seals are a very important element of the construction of vacuum tubes, electric discharge tubes, incandescent light bulbs, glass encapsulated semiconductor diodes, reed switches, pressure tight glass windows in metal cases, and metal or ceramic packages of electronic components.
An ultrasonic horn is a tapering metal bar commonly used for augmenting the oscillation displacement amplitude provided by an ultrasonic transducer operating at the low end of the ultrasonic frequency spectrum. The device is necessary because the amplitudes provided by the transducers themselves are insufficient for most practical applications of power ultrasound. Another function of the ultrasonic horn is to efficiently transfer the acoustic energy from the ultrasonic transducer into the treated media, which may be solid or liquid. Ultrasonic processing of liquids relies of intense shear forces and extreme local conditions generated by acoustic cavitation.
Ultrasonic machining is a subtractive manufacturing process that removes material from the surface of a part through high frequency, low amplitude vibrations of a tool against the material surface in the presence of fine abrasive particles. The tool travels vertically or orthogonal to the surface of the part at amplitudes of 0.05 to 0.125 mm. The fine abrasive grains are mixed with water to form a slurry that is distributed across the part and the tip of the tool. Typical grain sizes of the abrasive material range from 100 to 1000, where smaller grains produce smoother surface finishes.
Ultrasonic nozzles are a type of spray nozzle that uses high frequency vibration produced by piezoelectric transducers acting upon the nozzle tip that will create capillary waves in a liquid film. Once the amplitude of the capillary waves reaches a critical height, they become too tall to support themselves and tiny droplets fall off the tip of each wave resulting in atomization.
Soldering is a process in which two or more items are joined together by melting and putting a filler metal (solder) into the joint, the filler metal having a lower melting point than the adjoining metal. Unlike welding, soldering does not involve melting the work pieces. In brazing, the work piece metal also does not melt, but the filler metal is one that melts at a higher temperature than in soldering. In the past, nearly all solders contained lead, but environmental and health concerns have increasingly dictated use of lead-free alloys for electronics and plumbing purposes.
Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for surface micro-machined structures, e.g., accelerometers or gyroscopes. This technique utilizes low melting glass and therefore provides various advantages including that viscosity of glass decreases with an increase of temperature. The viscous flow of glass has effects to compensate and planarize surface irregularities, convenient for bonding wafers with a high roughness due to plasma etching or deposition. A low viscosity promotes hermetically sealed encapsulation of structures based on a better adaption of the structured shapes. Further, the coefficient of thermal expansion (CTE) of the glass material is adapted to silicon. This results in low stress in the bonded wafer pair. The glass has to flow and wet the soldered surfaces well below the temperature where deformation or degradation of either of the joined materials or nearby structures occurs. The usual temperature of achieving flowing and wetting is between 450 and 550 °C.
Aluminium alloys are often chosen due to their high strength-to-weight ratio, corrosion resistance, low cost, high thermal and electrical conductivity. There are a variety of techniques to join aluminium including mechanical fasteners, welding, adhesive bonding, brazing, soldering and friction stir welding (FSW), etc. Various techniques are used based on the cost and strength required for the joint. In addition, process combinations can performed to provide means for difficult to join assemblies and to reduce certain process limitations.
