A semiconductor is a material that has an electrical conductivity value falling between that of a conductor, such as copper, and an insulator, such as glass. Its resistivity generally falls as its temperature rises; metals behave in the opposite way. Its conducting properties may be altered in useful ways by introducing impurities ("doping") into the crystal structure. When two differently doped regions exist in the same crystal, a semiconductor junction is created. The behavior of charge carriers, which include electrons, ions, and electron holes, at these junctions is the basis of diodes, transistors, and most modern electronics. Some examples of semiconductors are silicon, germanium, gallium arsenide, and elements near the so-called "metalloid staircase" on the periodic table. After silicon, gallium arsenide is the second-most common semiconductor and is used in laser diodes, solar cells, microwave-frequency integrated circuits, and others. Silicon is a critical element for fabricating most electronic circuits.
Conduction is the process by which heat is transferred from the hotter end to the colder end of an object. The ability of the object to conduct heat is known as its thermal conductivity, and is denoted k.
In materials science, a metal matrix composite (MMC) is a composite material with fibers or particles dispersed in a metallic matrix, such as copper, aluminum, or steel. The secondary phase is typically a ceramic or another metal. They are typically classified according to the type of reinforcement: short discontinuous fibers (whiskers), continuous fibers, or particulates. There is some overlap between MMCs and cermets, with the latter typically consisting of less than 20% metal by volume. When at least three materials are present, it is called a hybrid composite. MMCs can have much higher strength-to-weight ratios, stiffness, and ductility than traditional materials, so they are often used in demanding applications. MMCs typically have lower thermal and electrical conductivity and poor resistance to radiation, limiting their use in the very harshest environments.
Thermoelectric cooling uses the Peltier effect to create a heat flux at the junction of two different types of materials. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other, with consumption of electrical energy, depending on the direction of the current. Such an instrument is also called a Peltier device, Peltier heat pump, solid state refrigerator, or thermoelectric cooler (TEC) and occasionally a thermoelectric battery. It can be used either for heating or for cooling, although in practice the main application is cooling. It can also be used as a temperature controller that either heats or cools.
A heat sink is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature.
Thermal paste is a thermally conductive chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of a thermal interface material.
Thermoelectric materials show the thermoelectric effect in a strong or convenient form.
A heat pipe is a heat-transfer device that employs phase transition to transfer heat between two solid interfaces.
Photodetectors, also called photosensors, are sensors of light or other electromagnetic radiation. There are a wide variety of photodetectors which may be classified by mechanism of detection, such as photoelectric or photochemical effects, or by various performance metrics, such as spectral response. Semiconductor-based photodetectors typically use a p–n junction that converts photons into charge. The absorbed photons make electron–hole pairs in the depletion region. Photodiodes and photo transistors are a few examples of photo detectors. Solar cells convert some of the light energy absorbed into electrical energy.
All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.
The role of the substrate in power electronics is to provide the interconnections to form an electric circuit, and to cool the components. Compared to materials and techniques used in lower power microelectronics, these substrates must carry higher currents and provide a higher voltage isolation. They also must operate over a wide temperature range.
A thermoelectric generator (TEG), also called a Seebeck generator, is a solid state device that converts heat directly into electrical energy through a phenomenon called the Seebeck effect. Thermoelectric generators function like heat engines, but are less bulky and have no moving parts. However, TEGs are typically more expensive and less efficient.
A heat spreader transfers energy as heat from a hotter source to a colder heat sink or heat exchanger. There are two thermodynamic types, passive and active. The most common sort of passive heat spreader is a plate or block of material having high thermal conductivity, such as copper, aluminum, or diamond. An active heat spreader speeds up heat transfer with expenditure of energy as work supplied by an external source.
The thermal copper pillar bump, also known as the "thermal bump", is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects for use in electronics and optoelectronic packaging, including: flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semiconductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality locally on the surface of a chip or to another electrical component. The diameter of a thermal bump is 238 μm and 60 μm high.
AlSiC, pronounced "alsick", is a metal matrix composite consisting of aluminium matrix with silicon carbide particles. It has high thermal conductivity, and its thermal expansion can be adjusted to match other materials, e.g. silicon and gallium arsenide chips and various ceramics. It is chiefly used in microelectronics as substrate for power semiconductor devices and high density multi-chip modules, where it aids with removal of waste heat.
In heat transfer, thermal engineering, and thermodynamics, thermal conductance and thermal resistance are fundamental concepts that describe the ability of materials or systems to conduct heat and the opposition they offer to the heat current. The ability to manipulate these properties allows engineers to control temperature gradient, prevent thermal shock, and maximize the efficiency of thermal systems. Furthermore, these principles find applications in a multitude of fields, including materials science, mechanical engineering, electronics, and energy management. Knowledge of these principles is crucial in various scientific, engineering, and everyday applications, from designing efficient temperature control, thermal insulation, and thermal management in industrial processes to optimizing the performance of electronic devices.
Electronic components have a wide range of failure modes. These can be classified in various ways, such as by time or cause. Failures can be caused by excess temperature, excess current or voltage, ionizing radiation, mechanical shock, stress or impact, and many other causes. In semiconductor devices, problems in the device package may cause failures due to contamination, mechanical stress of the device, or open or short circuits.
Heat exchangers are devices that transfer heat to achieve desired heating or cooling. An important design aspect of heat exchanger technology is the selection of appropriate materials to conduct and transfer heat fast and efficiently.
Thermopile laser sensors are used for measuring laser power from a few µW to several W. The incoming radiation of the laser is converted into heat energy at the surface. This heat input produces a temperature gradient across the sensor. Making use of the thermoelectric effect a voltage is generated by this temperature gradient. Since the voltage is directly proportional to the incoming radiation, it can be directly related to the irradiation power.
Thermal inductance refers to the phenomenon wherein a thermal change of an object surrounded by a fluid will induce a change in convection currents within that fluid, thus inducing a change in the kinetic energy of the fluid. It is considered the thermal analogue to electrical inductance in system equivalence modeling; its unit is the thermal henry.
