Zen 5

Last updated

AMD Zen 5
General information
LaunchingJuly 2024 (2024-07)
Designed by AMD
Common manufacturer(s)
Cache
L1 cache 80 KB (per core):
  • 32 KB instructions
  • 48 KB data
L2 cache1 MB (per core)
Architecture and classification
Technology node TSMC N4X
TSMC N3
Instruction set x86, x86-64
Physical specifications
Socket(s)
Products, models, variants
Product code name(s)
  • Desktop
    • Granite Ridge
  • Thin & Light Mobile
  • Extreme Mobile
    • Fire Range
  • HEDT/Workstation
    • Shimada Peak
  • Server
    • Turin
History
Predecessor(s) Zen 4

Zen 5 is the codename for an upcoming CPU microarchitecture by AMD, shown on their roadmap in May 2022, [3] destined for a release in July 2024. [4] It is the successor to Zen 4 and is fabricated on TSMC's N4X and N3E processes. [5] [6]

Contents

The Zen 5 microarchitecture powers Ryzen 9000 series desktop processors (codenamed "Granite Ridge"), Ryzen Threadripper 9000 series enthusiast/workstation processors (codenamed "Shimada Peak"), [7] [8] Ryzen 9055HX series extreme mobile processors (codenamed "Fire Range"), Epyc 9005 server processors (codenamed "Turin"), [9] and Ryzen AI 300 thin and light mobile processors (codenamed "Kraken Point" and "Strix Point"). [10]

Background

A roadmap shown during AMD's Financial Analyst Day on June 9, 2022 confirmed that Zen 5 and Zen 5c would be launching in 3nm and 4nm variants in 2024. [11] The earliest details on the Zen 5 architecture promised a "re-pipelined front end and wide issue" with "integrated AI and Machine Learning optimizations".

During AMD's Q4 2023 earnings call on January 30, 2024, AMD CEO Lisa Su stated that Zen 5 products would be "coming in the second half of the year". [12]

Architecture

Zen 5 is a ground-up redesign of Zen 4 with a wider front-end, increased floating point throughput and more accurate branch prediction. [13]

Fabrication process

Zen 5 was designed with both 4nm and 3nm processes in mind. This acted as an insurance policy for AMD in the event that TSMC's mass production of its N3 nodes were to face delays, significant wafer defect issues or capacity issues. One industry analyst estimated early N3 wafer yields to be at 55% while others estimated yields to be similar to those of N5 at between 60-80%. [14] [15] Additionally, Apple, as TSMC's largest customer, is given priority access to the latest process nodes. In 2022, Apple was responsible for 23% of TSMC's $72 billion in total revenue. [16] After N3 began ramping at the end of 2022, Apple bought up the entirety of TSMC's early N3B wafer production capacity to fabricate their A17 and M3 SoCs. [17]

Zen 5's CCDs are fabricated on TSMC's N4X node which is intended to accomodate higher frequencies for high-performance computing (HPC) applications over significantly increased transistor density. Zen 4-based mobile processors were fabricated on the N4P node which is targeted more towards power efficiency. N4X maintains IP compatibility with N4P and offers a 6% frequency gain over N4P at the same power but comes with the trade-off of moderate leakage. [18] Compared to the N5 node used to produce Zen 4 CCDs, N4X can enable up to 15% higher frequencies while running at 1.2V. [19] Zen 5c CCDs for Turin Dense server processors are fabricated on TSMC's N3E node.

IPC

AMD claims a 16% IPC uplift on average for Zen 5 over Zen 4. [20]

Cache and instructions

The L1 cache per core is increased from 64 KB to 80 KB per core. The L1 instruction cache remains the same at 32 KB but the L1 data cache is increased from 32 KB to 48 KB per core. Furthermore, the bandwidth of the L1 data cache for 512-bit floating point unit pipes has also been doubled. Zen 5 contains 6 Arithmetic Logic Units (ALUs), up from 4 ALUs in prior Zen architectures. A greater number of ALUs that handle common integer operations can increase per-cycle scalar integer throughput by 50%. [21]

Zen 4 introduced AVX-512 instructions. AVX-512 capabilities have been expanded with Zen 5 with a doubling of the floating point pipe width to 512-bit. Additionally, there is greater bfloat16 throughput which is beneficial for AI workloads.

Memory support

Zen 5's Infinity Fabric clock (FCLK) has increased from 2000 to 2400 MHz. [22] Due to its 2000 MHz FCLK, Zen 4 required DDR5-6000 memory in order for the FLCK, memory clock (MCLK) and memory controller clock (UCLK) to run at a 1:1 ratio. [23] Zen 5's 2400 MHz Infinity Fabric clock therefore requires DDR5-7200 memory for the same 1:1 ratio.

Products

Desktop

Granite Ridge

AMD announced an initial lineup of four models of Ryzen 9000 processors on June 3, 2024, including one Ryzen 5, one Ryzen 7 and two Ryzen 9 models. Manufactured on a 4 nm process, the processors will feature between 6 and 16 cores. [20] Ryzen 9000 processors will be released in July.

SKU Cores
(threads)		 Chiplets Core
config [lower-alpha 1] 		Clock rate (GHz)Graphics Cache PCIe
lanes		 Memory
support 		Socket TDP Release datePrice
(USD) [lower-alpha 2]
BaseBoostArch-
itecture		Cores [lower-alpha 3] Clock
(GHz)		L1L2L3
Ryzen
5		 9600X 6 (12)1 × CCD
1 × I/OD		1 × 63.95.4 RDNA
2 		2 CUs
128:8:4:2		2.2480 KB6 MB32 MB28
PCIe 5.0 		DDR5-5600
dual-channel 		AM5 65 WJul 31, 2024TBA
Ryzen
7		 9700X 8 (16)1 × 83.85.52.2640 KB8 MB65 WTBA
Ryzen
9		 9900X 12 (24)2 × CCD
1 × I/OD		2 × 64.45.62.2960 KB12 MB64 MB120 WTBA
9950X 16 (32)2 × 84.35.72.21.25 MB16 MB170 WTBA

Mobile

Strix Point

The Ryzen AI 300 series of high-performance ultrathin notebook processors were announced on June 3, 2024. Codenamed Strix Point, these processors are named under a new model numbering system similar to Intel's Core and Core Ultra model numbering. Strix Point will feature a 3rd gen Ryzen AI engine based on XDNA 2, providing up to 50 TOPS of neural processing unit performance. The integrated graphics is upgraded to RDNA 3.5, and top end models will have 16 CUs of GPU and 12 cores of CPU, an increase from the maximum of 8 CPU cores on previous generation Ryzen ultrathin mobile processors. [24] Notebooks featuring Ryzen AI 300 series processors will be released in July.

SKU Cores
(threads)		Arch-
itecture(s)		 Clock rate (GHz)Graphics NPU Cache Memory
support 		Socket PCIe
lanes		 TDP Release date
BaseBoostArch-
itecture		ModelCores [lower-alpha 3] Clock
(GHz)		Arch-
itecture		TOPSL1L2L3Default
(cTDP}
Ryzen
AI 9		36510 (20)4 × Zen 5
6 × Zen 5c 		2.05.0 RDNA
3.5 		880M12 CUs
768:48:24:12:24		2.9XDNA
2		50800 KB10 MB24 MBDDR5-5600
LPDDR5x-7500		FP816
PCIe 4.0 		28 W
(15-45 W)		2024
HX 37012 (24)4 × Zen 5
8 × Zen 5c 		2.05.1890M16 CUs
1024:64:32:16:32		2.9960 KB12 MB

Server

Turin

Alongside Granite Ridge desktop and Strix Point mobile processors, the Epyc 9005 series of high-performance server processors, codenamed Turin, were also announced at Computex on June 3, 2024. It uses the same SP5 socket as the previous Epyc 9004 series processors, and will pack up to 128 cores and 256 threads on the top-end model. Turin will be built on a TSMC 4 nm process. [25]

Turin Dense

A variant of Epyc 9005 using Zen 5c cores was also shown off at Computex. It will feature a maximum of 192 cores and 384 threads, and be manufactured on a 3 nm process. [25]

Zen 5c

Zen 5c is a compact variant of the Zen 5 core, primarily targeted at hyperscale cloud compute server customers. [26] It will succeed the Zen 4c core.

Related Research Articles

<span class="mw-page-title-main">AMD</span> American multinational semiconductor company

Advanced Micro Devices, Inc. (AMD) is an American multinational corporation and semiconductor company based in Santa Clara, California, that develops computer processors and related technologies for business and consumer markets.

The transistor count is the number of transistors in an electronic device. It is the most common measure of integrated circuit complexity. The rate at which MOS transistor counts have increased generally follows Moore's law, which observes that transistor count doubles approximately every two years. However, being directly proportional to the area of a die, transistor count does not represent how advanced the corresponding manufacturing technology is. A better indication of this is transistor density which is the ratio of a semiconductor's transistor count to its die area.

<span class="mw-page-title-main">AMD APU</span> Series of microprocessors by AMD

AMD Accelerated Processing Unit (APU), formerly known as Fusion, is a series of 64-bit microprocessors from Advanced Micro Devices (AMD), combining a general-purpose AMD64 central processing unit (CPU) and 3D integrated graphics processing unit (IGPU) on a single die.

Zen is the codename for a family of computer processor microarchitectures from AMD, first launched in February 2017 with the first generation of its Ryzen CPUs. It is used in Ryzen, Ryzen Threadripper, and Epyc (server).

<span class="mw-page-title-main">Zen (first generation)</span> 2017 AMD 14-nanometre processor microarchitecture

Zen is the codename for the first iteration in a family of computer processor microarchitectures of the same name from AMD. It was first used with their Ryzen series of CPUs in February 2017. The first Zen-based preview system was demonstrated at E3 2016, and first substantially detailed at an event hosted a block away from the Intel Developer Forum 2016. The first Zen-based CPUs, codenamed "Summit Ridge", reached the market in early March 2017, Zen-derived Epyc server processors launched in June 2017 and Zen-based APUs arrived in November 2017.

<span class="mw-page-title-main">Zen 2</span> 2019 AMD 7-nanometre processor microarchitecture

Zen 2 is a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nm MOSFET node from TSMC. The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips, Ryzen 4000U/H and Ryzen 5000U for mobile applications, as Threadripper 3000 for high-end desktop systems, and as Ryzen 4000G for accelerated processing units (APUs). The Ryzen 3000 series CPUs were released on 7 July 2019, while the Zen 2-based Epyc server CPUs were released on 7 August 2019. An additional chip, the Ryzen 9 3950X, was released in November 2019.

<span class="mw-page-title-main">Ryzen</span> AMD brand for microprocessors

Ryzen is a brand of multi-core x86-64 microprocessors designed and marketed by Advanced Micro Devices (AMD) for desktop, mobile, server, and embedded platforms based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream, enthusiast, server, and workstation segments and accelerated processing units (APUs) marketed for mainstream and entry-level segments and embedded systems applications.

Zen+ is the codename for a computer processor microarchitecture by AMD. It is the successor to the first gen Zen microarchitecture, and was first released in April 2018, powering the second generation of Ryzen processors, known as Ryzen 2000 for mainstream desktop systems, Threadripper 2000 for high-end desktop setups and Ryzen 3000G for accelerated processing units (APUs).

<span class="mw-page-title-main">Epyc</span> AMD brand for server microprocessors

Epyc is a brand of multi-core x86-64 microprocessors designed and sold by AMD, based on the company's Zen microarchitecture. Introduced in June 2017, they are specifically targeted for the server and embedded system markets.

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<span class="mw-page-title-main">Socket SP3</span> CPU socket for AMD CPUs

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<span class="mw-page-title-main">Zen 4</span> 2022 AMD 5-nanometer processor microarchitecture

Zen 4 is the codename for a CPU microarchitecture designed by AMD, released on September 27, 2022. It is the successor to Zen 3 and uses TSMC's N6 process for I/O dies, N5 process for CCDs, and N4 process for APUs. Zen 4 powers Ryzen 7000 performance desktop processors, Ryzen 8000G series mainstream desktop APUs, and Ryzen Threadripper 7000 series HEDT and workstation processors. It is also used in extreme mobile processors, thin & light mobile processors, as well as EPYC 8004/9004 server processors.

<span class="mw-page-title-main">Zen 3</span> 2020 AMD 7-nanometer processor microarchitecture

Zen 3 is the codename for a CPU microarchitecture by AMD, released on November 5, 2020. It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. Zen 3 powers Ryzen 5000 mainstream desktop processors and Epyc server processors. Zen 3 is supported on motherboards with 500 series chipsets; 400 series boards also saw support on select B450 / X470 motherboards with certain BIOSes. Zen 3 is the last microarchitecture before AMD switched to DDR5 memory and new sockets, which are AM5 for the desktop "Ryzen" chips alongside SP5 and SP6 for the EPYC server platform and sTRX8. According to AMD, Zen 3 has a 19% higher instructions per cycle (IPC) on average than Zen 2.

References

  1. ↑ "AMD Ryzen 8000 "Strix Point" APU Leak Points to 16 RDNA 3.5 CUs". TechPowerUp. September 4, 2023. Retrieved October 7, 2023.
  2. ↑ "AMD Ryzen 8000 "Hawk Point" officially in upcoming Minisforum 2-in-1 tablet". VideoCardz.com. Retrieved October 7, 2023.
  3. ↑ "AMD confirms Zen4 & Ryzen 7000 series lineup: Raphael in 2022, Dragon Range and Phoenix in 2023". VideoCardz. May 3, 2022. Retrieved October 2, 2022.
  4. ↑ Bonshor, Gavin (June 2, 2024). "AMD Unveils Ryzen 9000 CPUs For Desktop, Zen 5 Takes Center Stage at Computex 2024". AnandTech. Archived from the original on June 3, 2024. Retrieved June 2, 2024.
  5. ↑ "AMD Ryzen 8000 CPUs to be Based on 4nm Node (Not 3nm), 5th Gen Epyc to Get 3nm [Rumor]". Hardware Times. April 29, 2023. Retrieved August 4, 2023.
  6. ↑ Alcorn, Paul (June 9, 2022). "AMD Shares New CPU Core Roadmap, 3nm Zen 5 by 2024, 4th-Gen Infinity Architecture". Tom's Hardware. Retrieved August 4, 2023.
  7. ↑ Bonshor, Gavin (June 9, 2022). "AMD's Desktop CPU Roadmap: 2024 Brings Zen 5-based "Granite Ridge"". AnandTech. Retrieved June 11, 2022.
  8. ↑ Allan, Darren (January 26, 2024). "AMD Zen 5 chips could turn up in April, but you'll have to be patient for the most powerful next-gen desktop CPUs". TechRadar. Retrieved February 2, 2024.
  9. ↑ Alcorn, Paul (June 2, 2024). "AMD announces 3nm EPYC Turin with 192 cores and 384 threads — 5.4X faster than Intel Xeon in AI work, launches second half of 2024". Archived from the original on June 3, 2024. Retrieved June 2, 2024.
  10. ↑ Alcorn, Paul (June 2, 2024). "AMD unwraps Ryzen AI 300 series 'Strix Point' processors — 50 TOPS of AI performance, Zen 5c density cores come to Ryzen 9 for the first time". Tom's Hardware. Archived from the original on June 3, 2024. Retrieved June 2, 2024.
  11. ↑ "AMD FAD 2022 AMD CPU Core Roadmap To Zen 5". ServeTheHome. Retrieved June 3, 2024.
  12. ↑ "AMD reaffirms Ryzen CPUs with Zen5 architecture are coming in the second half of 2024". VideoCardz. January 31, 2024. Retrieved June 3, 2024.
  13. ↑ Bonshor, Gavin (June 2, 2024). "AMD Unveils Ryzen 9000 CPUs For Desktop, Zen 5 Takes Center Stage at Computex 2024". AnandTech. Retrieved June 3, 2024.
  14. ↑ Norem, Josh (July 14, 2023). "Analyst: TSMC Hitting 55% Yields on 3nm Node for Apple's A17 Bionic, M3 SoCs". ExtremeTech. Retrieved June 3, 2024.
  15. ↑ Shilov, Anton (December 31, 2022). "Analysts Estimate TSMC's 3nm Yields Between 60% and 80%". Tom's Hardware. Retrieved June 3, 2024.
  16. ↑ Norem, Josh (August 8, 2023). "Apple Bought All of TSMC's 3nm Capacity for an Entire Year". ExtremeTech. Retrieved June 3, 2024.
  17. ↑ Norem, Josh (April 27, 2023). "TSMC Says It Can't Keep Up With Apple's Demands for 3nm Wafers". ExtremeTech. Retrieved June 3, 2024.
  18. ↑ "Advanced Technologies for HPC: N4/N4P/N4X". TSMC. Retrieved June 3, 2024.
  19. ↑ Shilov, Anton (December 17, 2021). "TSMC Unveils N4X Node: Extreme High-Performance at High Voltages". AnandTech. Retrieved June 3, 2024.
  20. 1 2 "AMD introduces Ryzen 9000 Zen5 desktop CPUs "Granite Ridge"". VideoCardz. June 3, 2024. Retrieved June 3, 2024.
  21. ↑ "Zen 5's Leaked Slides". Chips and Cheese. October 8, 2023. Retrieved June 3, 2024.
  22. ↑ Mujtaba, Hassan (June 2, 2024). "AMD Ryzen 9000 Desktop CPUs Official: Zen 5 Achieves 16% IPC Uplift, 9950X, 9900X, 9700X, 9600X SKUs, Up To 16 Cores At 5.7 GHz, July Launch". Wccftech. Retrieved June 3, 2024.
  23. ↑ Cunningham, Andrew (September 27, 2022). "Everything you need to know about Zen 4, socket AM5, and AMD's newest chipsets". Ars Technica. Retrieved June 3, 2024.
  24. ↑ Alcorn, Paul (June 3, 2024). "AMD unwraps Ryzen AI 300 series 'Strix Point' processors — 50 TOPS of AI performance, Zen 5c density cores come to Ryzen 9 for the first time". Tom's Hardware. Retrieved June 3, 2024.
  25. 1 2 Alcorn, Paul (June 3, 2024). "AMD announces 3nm EPYC Turin with 192 cores and 384 threads — 5.4X faster than Intel Xeon in AI work, launches second half of 2024". Tom's Hardware. Retrieved June 3, 2024.
  26. ↑ Smith, Ryan (June 9, 2022). "AMD Zen Architecture Roadmap: Zen 5 in 2024 With All-New Microarchitecture". AnandTech. Retrieved December 11, 2022.
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