EFuse

Last updated

In computing, an eFuse (electronic fuse) is a microscopic fuse put into a computer chip. This technology was invented by IBM in 2004 [1] to allow for the dynamic real-time reprogramming of chips. In the abstract, computer logic is generally "etched" or "hard-wired" onto a chip and cannot be changed after the chip has finished being manufactured. By utilizing a set of eFuses, a chip manufacturer can allow for the circuits on a chip to change while it is in operation. [2]

Contents

Mechanism of action

eFuses can be made out of silicon or metal traces. In both cases, they work (blow) by electromigration, the phenomenon that electric flow causes the conductor material to move. Although electromigration is generally undesired in chip design as it causes failures, eFuses are made of weak traces that are designed to fail before others do. [3] [4]

Uses

eFuses were initially marketed by IBM as a way to provide in-chip performance tuning. If certain sub-systems fail, or are taking too long to respond, or are consuming too much power, the chip can instantly change its behavior by blowing an eFUSE. [3] [5] [6] Today, most eFuses are used to etch serialization or calibration data onto a chip thus making it a read-only value. [7]

Descriptive term

eFuses are perhaps more commonly used as a one-time programmable ROM or write-restricted memory, and not actual physical electric fuses. This ranges from writing unique information onto CPUs, [4] or in the case of game consoles and other restricted hardware, preventing downgrades by permanently recording a newer version. The Xbox 360, Nintendo Switch, Pixel 6 and Samsung Galaxy S22 are known for using eFuses this way. [8]

Implementations

eFuses used for performance adjustment or unique IDs:

eFuses known to be used for hardware restriction:

Variants

Resettable eFuses are used for protecting circuits. They act similarly to resettable fuses, and are generally shipped as a standalone chip package. [14]

There are several ways of implementing an antifuse in silicon: see Antifuse § Antifuses in integrated circuits.

See also

Related Research Articles

<span class="mw-page-title-main">Central processing unit</span> Central computer component which executes instructions

A central processing unit (CPU), also called a central processor, main processor, or just processor, is the most important processor in a given computer. Its electronic circuitry executes instructions of a computer program, such as arithmetic, logic, controlling, and input/output (I/O) operations. This role contrasts with that of external components, such as main memory and I/O circuitry, and specialized coprocessors such as graphics processing units (GPUs).

<span class="mw-page-title-main">Microprocessor</span> Computer processor contained on an integrated-circuit chip

A microprocessor is a computer processor for which the data processing logic and control is included on a single integrated circuit (IC), or a small number of ICs. The microprocessor contains the arithmetic, logic, and control circuitry required to perform the functions of a computer's central processing unit (CPU). The IC is capable of interpreting and executing program instructions and performing arithmetic operations. The microprocessor is a multipurpose, clock-driven, register-based, digital integrated circuit that accepts binary data as input, processes it according to instructions stored in its memory, and provides results as output. Microprocessors contain both combinational logic and sequential digital logic, and operate on numbers and symbols represented in the binary number system.

<span class="mw-page-title-main">PowerPC</span> RISC instruction set architecture by AIM alliance

PowerPC is a reduced instruction set computer (RISC) instruction set architecture (ISA) created by the 1991 Apple–IBM–Motorola alliance, known as AIM. PowerPC, as an evolving instruction set, has been named Power ISA since 2006, while the old name lives on as a trademark for some implementations of Power Architecture–based processors.

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips. It is a multiple-step photolithographic and physico-chemical process during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.

<span class="mw-page-title-main">Very-large-scale integration</span> Creating an integrated circuit by combining many transistors into a single chip

Very-large-scale integration (VLSI) is the process of creating an integrated circuit (IC) by combining millions or billions of MOS transistors onto a single chip. VLSI began in the 1970s when MOS integrated circuit chips were developed and then widely adopted, enabling complex semiconductor and telecommunication technologies. The microprocessor and memory chips are VLSI devices.

A programmable read-only memory (PROM) is a form of digital memory where the contents can be changed once after manufacture of the device. The data is then permanent and cannot be changed. It is one type of read-only memory (ROM). PROMs are used in digital electronic devices to store permanent data, usually low level programs such as firmware or microcode. The key difference from a standard ROM is that the data is written into a ROM during manufacture, while with a PROM the data is programmed into them after manufacture. Thus, ROMs tend to be used only for large production runs with well-verified data. PROMs may be used where the volume required does not make a factory-programmed ROM economical, or during development of a system that may ultimately be converted to ROMs in a mass produced version.

In computer engineering, Halt and Catch Fire, known by the assembly language mnemonic HCF, is an idiom referring to a computer machine code instruction that causes the computer's central processing unit (CPU) to cease meaningful operation, typically requiring a restart of the computer. It originally referred to a fictitious instruction in IBM System/360 computers, making a joke about its numerous non-obvious instruction mnemonics.

The 90 nm process refers to the technology used in semiconductor manufacturing to create integrated circuits with a minimum feature size of 90 nanometers. It was an advancement over the previous 130 nm process. Eventually, it was succeeded by smaller process nodes, such as the 65 nm, 45 nm, and 32 nm processes.

The 65 nm process is an advanced lithographic node used in volume CMOS (MOSFET) semiconductor fabrication. Printed linewidths can reach as low as 25 nm on a nominally 65 nm process, while the pitch between two lines may be greater than 130 nm.

Embedded DRAM (eDRAM) is dynamic random-access memory (DRAM) integrated on the same die or multi-chip module (MCM) of an application-specific integrated circuit (ASIC) or microprocessor. eDRAM's cost-per-bit is higher when compared to equivalent standalone DRAM chips used as external memory, but the performance advantages of placing eDRAM onto the same chip as the processor outweigh the cost disadvantages in many applications. In performance and size, eDRAM is positioned between level 3 cache and conventional DRAM on the memory bus, and effectively functions as a level 4 cache, though architectural descriptions may not explicitly refer to it in those terms.

<span class="mw-page-title-main">Multi-chip module</span> Electronic assembly containing multiple integrated circuits that behaves as a unit

A multi-chip module (MCM) is generically an electronic assembly where multiple integrated circuits, semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach.

Free60 is the successor to the Xbox Linux Project that aims to put Linux, BSD, or Darwin on the Microsoft Xbox 360 using a software or hardware based "hack". The Xbox 360 uses hardware encryption and will not run unsigned code out of the box.

<span class="mw-page-title-main">Xenon (processor)</span> CPU used in the Xbox 360

Microsoft XCPU, codenamed Xenon, is a CPU used in the Xbox 360 game console, to be used with ATI's Xenos graphics chip.

The transistor count is the number of transistors in an electronic device. It is the most common measure of integrated circuit complexity. The rate at which MOS transistor counts have increased generally follows Moore's law, which observes that transistor count doubles approximately every two years. However, being directly proportional to the area of a die, transistor count does not represent how advanced the corresponding manufacturing technology is. A better indication of this is transistor density which is the ratio of a semiconductor's transistor count to its die area.

The "14 nanometer process" refers to a marketing term for the MOSFET technology node that is the successor to the "22 nm" node. The "14 nm" was so named by the International Technology Roadmap for Semiconductors (ITRS). Until about 2011, the node following "22 nm" was expected to be "16 nm". All "14 nm" nodes use FinFET technology, a type of multi-gate MOSFET technology that is a non-planar evolution of planar silicon CMOS technology.

The Xbox 360 technical specifications describe the various components of the Xbox 360 video game console.

<span class="mw-page-title-main">Random-access memory</span> Form of computer data storage

Random-access memory is a form of electronic computer memory that can be read and changed in any order, typically used to store working data and machine code. A random-access memory device allows data items to be read or written in almost the same amount of time irrespective of the physical location of data inside the memory, in contrast with other direct-access data storage media, where the time required to read and write data items varies significantly depending on their physical locations on the recording medium, due to mechanical limitations such as media rotation speeds and arm movement.

Per the International Technology Roadmap for Semiconductors, the 45 nm process is a MOSFET technology node referring to the average half-pitch of a memory cell manufactured at around the 2007–2008 time frame.

<span class="mw-page-title-main">ESP8266</span> System-on-a-chip microcontroller model with Wi-Fi

The ESP8266 is a low-cost Wi-Fi microcontroller, with built-in TCP/IP networking software, and microcontroller capability, produced by Espressif Systems in Shanghai, China.

References

  1. "IBM's eFuse technology portends adaptable chips".
  2. DCC (1989-03-14). "Method and apparatus for causing an open circuit in a conductive line". Archived from the original on 2017-02-11.
  3. 1 2 3 Smith, Tony. "IBM eFuse to yield self-repairing, self-regulating CPUs". The Register.
  4. 1 2 3 "Examining metal eFuses". EETAsia. Archived from the original on 2021-06-14. Retrieved 2020-12-30.
  5. "IBM introduces chip morphing technology". IBM. 2004-07-30. Archived from the original on 2010-07-24. Retrieved 2009-09-17.
  6. Port, Otis (2005-06-06). "Mighty Morphing Power Processors". BusinessWeek . Archived from the original on May 29, 2005.
  7. "Espressif ESP-IDF esp_mac.h". Espressif. 2023-06-08. Retrieved 2023-11-07.
  8. Amadeo, Ron (2022-08-31). "Google gives developers a way to sidestep Android 13's one-way update". Ars Technica. Retrieved 2022-09-04.
  9. Rizzolo, R. F.; Foote, T. G.; et al. (2007-02-13). "IBM System z9 eFUSE applications and methodology". IBM Journal of Research and Development. 51: 65–75. doi:10.1147/rd.511.0065 . Retrieved 2007-02-28.
  10. "Understanding the Xbox 360's Fusesets". Free60 Wiki.
  11. Speedy22 (2006-03-07). "XBOX 360 CPU Datasheet. Version 1.5" (PDF). Archived from the original (PDF) on 2006-03-15. Retrieved 2007-02-28.{{cite web}}: CS1 maint: numeric names: authors list (link)
  12. "IBM delivers Power-based chip for Microsoft Xbox 360 worldwide launch". IBM. 2005-10-25. Archived from the original on 2007-03-11. Retrieved 2007-02-28.
  13. "What is a Knox Warranty Bit and how is it triggered?". docs.samsungknox.com. Retrieved 2024-07-16.
  14. "E-fuses". STMicroelectronics.