Homologous temperature expresses the thermodynamic temperature of a material as a fraction of the thermodynamic temperature of its melting point (i.e. using the Kelvin scale):
For example, the homologous temperature of lead at room temperature (25 °C) is approximately 0.50 (TH = T/Tmp = 298 K/601 K = 0.50).
The homologous temperature of a substance is useful for determining the rate of steady state creep (diffusion-dependent deformation). A higher homologous temperature results in an exponentially higher rate of diffusion dependent deformation. [1]
Additionally, for a given fixed homologous temperature, two materials with different melting points would have similar diffusion-dependent deformation behaviour. For example, solder (Tmp = 456 K) at 115 °C would have comparable mechanical properties to copper (Tmp = 1358 K) at 881 °C, because they would both be at 0.85Tmp despite being at different absolute temperatures.
In electronics applications, where circuits typically operate over a −55 °C to +125 °C range, eutectic tin-lead (Sn63) solder is working at 0.48Tmp to 0.87Tmp. The upper temperature is high relative to the melting point; from this we can deduce that solder will have limited mechanical strength (as a bulk material) and significant creep under stress. This is borne out by its comparatively low values for tensile strength, shear strength and modulus of elasticity. Copper, on the other hand, has a much higher melting point, so foils are working at only 0.16Tmp to 0.29Tmp and their properties are little affected by temperature.
Solder is a fusible metal alloy used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics.
Ductility is a mechanical property commonly described as a material's amenability to drawing. In materials science, ductility is defined by the degree to which a material can sustain plastic deformation under tensile stress before failure. Ductility is an important consideration in engineering and manufacturing. It defines a material's suitability for certain manufacturing operations and its capacity to absorb mechanical overload. Some metals that are generally described as ductile include gold and copper, while platinum is the most ductile of all metals in pure form. However, not all metals experience ductile failure as some can be characterized with brittle failure like cast iron. Polymers generally can be viewed as ductile materials as they typically allow for plastic deformation.
A eutectic system or eutectic mixture is a homogeneous mixture that has a melting point lower than those of the constituents. The lowest possible melting point over all of the mixing ratios of the constituents is called the eutectic temperature. On a phase diagram, the eutectic temperature is seen as the eutectic point.
In materials science, superplasticity is a state in which solid crystalline material is deformed well beyond its usual breaking point, usually over about 400% during tensile deformation. Such a state is usually achieved at high homologous temperature. Examples of superplastic materials are some fine-grained metals and ceramics. Other non-crystalline materials (amorphous) such as silica glass and polymers also deform similarly, but are not called superplastic, because they are not crystalline; rather, their deformation is often described as Newtonian fluid. Superplastically deformed material gets thinner in a very uniform manner, rather than forming a "neck" that leads to fracture. Also, the formation of microvoids, which is another cause of early fracture, is inhibited. Superplasticity must not be confused with superelasticity.
In materials science, creep is the tendency of a solid material to undergo slow deformation while subject to persistent mechanical stresses. It can occur as a result of long-term exposure to high levels of stress that are still below the yield strength of the material. Creep is more severe in materials that are subjected to heat for long periods and generally increase as they near their melting point.
In materials science and continuum mechanics, viscoelasticity is the property of materials that exhibit both viscous and elastic characteristics when undergoing deformation. Viscous materials, like water, resist shear flow and strain linearly with time when a stress is applied. Elastic materials strain when stretched and immediately return to their original state once the stress is removed.
A superalloy, or high-performance alloy, is an alloy with the ability to operate at a high fraction of its melting point. Key characteristics of a superalloy include mechanical strength, thermal creep deformation resistance, surface stability, and corrosion and oxidation resistance.
The Portevin–Le Chatelier (PLC) effect describes a serrated stress–strain curve or jerky flow, which some materials exhibit as they undergo plastic deformation, specifically inhomogeneous deformation. This effect has been long associated with dynamic strain aging or the competition between diffusing solutes pinning dislocations and dislocations breaking free of this stoppage.
Diffusion creep refers to the deformation of crystalline solids by the diffusion of vacancies through their crystal lattice. Diffusion creep results in plastic deformation rather than brittle failure of the material.
A nanocrystalline (NC) material is a polycrystalline material with a crystallite size of only a few nanometers. These materials fill the gap between amorphous materials without any long range order and conventional coarse-grained materials. Definitions vary, but nanocrystalline material is commonly defined as a crystallite (grain) size below 100 nm. Grain sizes from 100 to 500 nm are typically considered "ultrafine" grains.
Coble creep, a form of diffusion creep, is a mechanism for deformation of crystalline solids. Contrasted with other diffusional creep mechanisms, Coble creep is similar to Nabarro–Herring creep in that it is dominant at lower stress levels and higher temperatures than creep mechanisms utilizing dislocation glide. Coble creep occurs through the diffusion of atoms in a material along grain boundaries. This mechanism is observed in polycrystals or along the surface in a single crystal, which produces a net flow of material and a sliding of the grain boundaries.
Damage mechanics is concerned with the representation, or modeling, of damage of materials that is suitable for making engineering predictions about the initiation, propagation, and fracture of materials without resorting to a microscopic description that would be too complex for practical engineering analysis.
In geology, a deformation mechanism is a process occurring at a microscopic scale that is responsible for changes in a material's internal structure, shape and volume. The process involves planar discontinuity and/or displacement of atoms from their original position within a crystal lattice structure. These small changes are preserved in various microstructures of materials such as rocks, metals and plastics, and can be studied in depth using optical or digital microscopy.
Viscoplasticity is a theory in continuum mechanics that describes the rate-dependent inelastic behavior of solids. Rate-dependence in this context means that the deformation of the material depends on the rate at which loads are applied. The inelastic behavior that is the subject of viscoplasticity is plastic deformation which means that the material undergoes unrecoverable deformations when a load level is reached. Rate-dependent plasticity is important for transient plasticity calculations. The main difference between rate-independent plastic and viscoplastic material models is that the latter exhibit not only permanent deformations after the application of loads but continue to undergo a creep flow as a function of time under the influence of the applied load.
Dislocation creep is a deformation mechanism in crystalline materials. Dislocation creep involves the movement of dislocations through the crystal lattice of the material, in contrast to diffusion creep, in which diffusion is the dominant creep mechanism. It causes plastic deformation of the individual crystals, and thus the material itself.
Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for surface micro-machined structures, e.g., accelerometers or gyroscopes. This technique utilizes low melting-point glass and therefore provides various advantages including that viscosity of glass decreases with an increase of temperature. The viscous flow of glass has effects to compensate and planarize surface irregularities, convenient for bonding wafers with a high roughness due to plasma etching or deposition. A low viscosity promotes hermetically sealed encapsulation of structures based on a better adaption of the structured shapes. Further, the coefficient of thermal expansion (CTE) of the glass material is adapted to silicon. This results in low stress in the bonded wafer pair. The glass has to flow and wet the soldered surfaces well below the temperature where deformation or degradation of either of the joined materials or nearby structures occurs. The usual temperature of achieving flowing and wetting is between 450 and 550 °C.
Grain boundary sliding (GBS) is a material deformation mechanism where grains slide against each other. This occurs in polycrystalline material under external stress at high homologous temperature and low strain rate and is intertwined with creep. Homologous temperature describes the operating temperature relative to the melting temperature of the material. There are mainly two types of grain boundary sliding: Rachinger sliding, and Lifshitz sliding. Grain boundary sliding usually occurs as a combination of both types of sliding. Boundary shape often determines the rate and extent of grain boundary sliding.
The elements bismuth and indium have relatively low melting points when compared to other metals, and their alloy bismuth–indium (Bi–In) is classified as a fusible alloy. It has a melting point lower than the eutectic point of the tin–lead alloy. The most common application of the Bi-In alloy is as a low temperature solder, which can also contain, besides bismuth and indium, lead, cadmium, and tin.
Diffusion bonding or diffusion welding is a solid-state welding technique used in metalworking, capable of joining similar and dissimilar metals. It operates on the principle of solid-state diffusion, wherein the atoms of two solid, metallic surfaces intersperse themselves over time. This is typically accomplished at an elevated temperature, approximately 50-75% of the absolute melting temperature of the materials. Diffusion bonding is usually implemented by applying high pressure, in conjunction with necessarily high temperature, to the materials to be welded; the technique is most commonly used to weld "sandwiches" of alternating layers of thin metal foil, and metal wires or filaments. Currently, the diffusion bonding method is widely used in the joining of high-strength and refractory metals within the aerospace and nuclear industries.
Solder fatigue is the mechanical degradation of solder due to deformation under cyclic loading. This can often occur at stress levels below the yield stress of solder as a result of repeated temperature fluctuations, mechanical vibrations, or mechanical loads. Techniques to evaluate solder fatigue behavior include finite element analysis and semi-analytical closed-form equations.
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