Rambus DRAM (RDRAM), and its successors Concurrent Rambus DRAM (CRDRAM) and Direct Rambus DRAM (DRDRAM), are types of synchronous dynamic RAM developed by Rambus from the late-1980s through to the early-2000s. The third-generation of Rambus DRAM, DRDRAM was replaced by XDR DRAM. Rambus DRAM was developed for high-bandwidth applications, and was positioned by Rambus as replacement for various types of contemporary memories, such as SDRAM.
Xeon is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets. It was introduced in June 1998. Xeon processors are based on the same architecture as regular desktop-grade CPUs, but have some advanced features such as support for ECC memory, higher core counts, support for larger amounts of RAM, larger cache memory and extra provision for enterprise-grade reliability, availability and serviceability features responsible for handling hardware exceptions through the Machine Check Architecture. They are often capable of safely continuing execution where a normal processor cannot due to these extra RAS features, depending on the type and severity of the Machine Check Exception. Some also support multi-socket systems with two, four, or eight sockets through use of the Quick Path Interconnect bus.
Mini-ITX is a 17 × 17 cm (6.7 × 6.7 in) motherboard, developed by VIA Technologies in 2001. They are commonly used in small-configured computer systems. Originally, they were a niche product, designed for fan-less cooling with a low power consumption architecture, which made them useful for home theater PC systems, where fan noise can detract from the cinema experience. The four mounting holes in a Mini-ITX board line up with four of the holes in ATX-specification motherboards, and the locations of the backplate and expansion slot are the same. Mini-ITX boards can therefore often be used in cases designed for ATX, micro-ATX and other ATX variants if desired.
In the fields of digital electronics and computer hardware, multi-channel memory architecture is a technology that increases the data transfer rate between the DRAM memory and the memory controller by adding more channels of communication between them. Theoretically this multiplies the data rate by exactly the number of channels present. Dual-channel memory employs two channels. The technique goes back as far as the 1960s having been used in IBM System/360 Model 91 and in CDC 6600.
The Radeon Xpress 200 is a computer chipset released by ATI. The chipset supports AMD 64-bit processors as well as supporting Intel Pentium 4, Pentium D and Celeron processors. Additionally, it includes support for DDR400 RAM and DDR-2 667 RAM on the Intel Edition.
Sandy Bridge is the codename for the microarchitecture used in the "second generation" of the Intel Core processors - the Sandy Bridge microarchitecture is the successor to Nehalem microarchitecture. Intel demonstrated a Sandy Bridge processor in 2009, and released first products based on the architecture in January 2011 under the Core brand.
The AMD 700 chipset series is a set of chipsets designed by ATI for AMD Phenom processors to be sold under the AMD brand. Several members were launched in the end of 2007 and the first half of 2008, others launched throughout the rest of 2008.
The AMD 690 chipset series is an integrated graphics chipset family which was developed and manufactured by AMD subsidiary ATI for both AMD and Intel platforms focusing on both desktop and mobile computing markets. The corresponding chipset for the Intel platform has a marketing name of Radeon Xpress 1200 series.
Phenom II is a family of AMD's multi-core 45 nm processors using the AMD K10 microarchitecture, succeeding the original Phenom. Advanced Micro Devices released the Socket AM2+ version of Phenom II in December 2008, while Socket AM3 versions with DDR3 support, along with an initial batch of triple- and quad-core processors were released on February 9, 2009. Dual-processor systems require Socket F+ for the Quad FX platform. The next-generation Phenom II X6 was released on April 27, 2010.
Bloomfield is the code name for Intel high-end desktop processors sold as Core i7-9xx and single-processor servers sold as Xeon 35xx., in almost identical configurations, replacing the earlier Yorkfield processors. The Bloomfield core is closely related to the dual-processor Gainestown, which has the same CPUID value of 0106Ax and which uses the same socket. Bloomfield uses a different socket than the later Lynnfield and Clarksfield processors based on the same 45 nm Nehalem microarchitecture, even though some of these share the same Intel Core i7 brand.
LGA 1155, also called Socket H2, is a socket used for Intel microprocessors based on Sandy Bridge and Ivy Bridge microarchitectures.
Bonnell is a CPU microarchitecture used by Intel Atom processors which can execute up to two instructions per cycle. Like many other x86 microprocessors, it translates x86 instructions into simpler internal operations prior to execution. The majority of instructions produce one micro-op when translated, with around 4% of instructions used in typical programs producing multiple micro-ops. The number of instructions that produce more than one micro-op is significantly fewer than the P6 and NetBurst microarchitectures. In the Bonnell microarchitecture, internal micro-ops can contain both a memory load and a memory store in connection with an ALU operation, thus being more similar to the x86 level and more powerful than the micro-ops used in previous designs. This enables relatively good performance with only two integer ALUs, and without any instruction reordering, speculative execution or register renaming. A side effect of having no speculative execution is invulnerability against Meltdown and Spectre.
Skylake is the codename used by Intel for a processor microarchitecture that was launched in August 2015 succeeding the Broadwell microarchitecture. Skylake is a microarchitecture redesign using the same 14 nm manufacturing process technology as its predecessor, serving as a "tock" in Intel's "tick–tock" manufacturing and design model. According to Intel, the redesign brings greater CPU and GPU performance and reduced power consumption. Skylake CPUs share its microarchitecture with Kaby Lake, Coffee Lake and Cannon Lake CPUs.
Socket G2, also known as rPGA 988B is Intel's CPU socket used with their line of mobile Core i7, the successor to the Core 2 line, and also with several mobile Core i5 and Core i3 processors. It is based on Intel's Sandy Bridge architecture. Like its predecessor, socket G1 systems, it can only run in dual-channel memory mode, but with data rates up to 1600 MHz. They are also known as FCPGA988 socket processors. Which should be pin compatible with PPGA988.
LGA 1151, also known as Socket H4, is an Intel microprocessor compatible socket which comes in two distinct versions: the first revision which supports both Intel's Skylake and Kaby Lake CPUs, and the second revision which supports Coffee Lake CPUs exclusively.
Kaby Lake is an Intel codename for a processor microarchitecture Intel announced on August 30, 2016. Like the preceding Skylake, Kaby Lake is produced using a 14 nanometer manufacturing process technology. Breaking with Intel's previous "tick–tock" manufacturing and design model, Kaby Lake represents the optimized step of the newer "process-architecture-optimization" model. Kaby Lake began shipping to manufacturers and OEMs in the second quarter of 2016, and mobile chips have started shipping while Kaby Lake (desktop) chips were officially launched in January 2017.
