The International Roadmap for Devices and Systems, or IRDS, is a set of predictions about likely developments in electronic devices and systems. The IRDS was established in 2016 and is the successor to the International Technology Roadmap for Semiconductors. These predictions are intended to allow coordination of efforts across academia, manufacturers, equipment suppliers, and national research laboratories. The IEEE specifies the goals of the roadmap as: [1]
The executive committee is drawn from regions with a major stake in developments in electronics: Europe, South Korea, Japan, Taiwan, and the United States.
International Focus Teams (IFTs) assess present status and future evolution of the ecosystem in their specific field of expertise and produce a 15-year roadmap. IFT reports includes evolution, key challenges, major roadblocks, and possible solutions. IFTs include:
An integrated circuit, also known as a microchip, chip or IC, is a small electronic device made up of multiple interconnected electronic components such as transistors, resistors, and capacitors. These components are etched onto a small piece of semiconductor material, usually silicon. Integrated circuits are used in a wide range of electronic devices, including computers, smartphones, and televisions, to perform various functions such as processing and storing information. They have greatly impacted the field of electronics by enabling device miniaturization and enhanced functionality.
Moore's law is the observation that the number of transistors in an integrated circuit (IC) doubles about every two years. Moore's law is an observation and projection of a historical trend. Rather than a law of physics, it is an empirical relationship linked to gains from experience in production.
Complementary metal–oxide–semiconductor is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process that uses complementary and symmetrical pairs of p-type and n-type MOSFETs for logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips, and other digital logic circuits. CMOS technology is also used for analog circuits such as image sensors, data converters, RF circuits, and highly integrated transceivers for many types of communication.
A mixed-signal integrated circuit is any integrated circuit that has both analog circuits and digital circuits on a single semiconductor die. Their usage has grown dramatically with the increased use of cell phones, telecommunications, portable electronics, and automobiles with electronics and digital sensors.
The International Technology Roadmap for Semiconductors (ITRS) is a set of documents that was coordinated and organized by Semiconductor Research Corporation and produced by a group of experts in the semiconductor industry. These experts were representative of the sponsoring organisations, including the Semiconductor Industry Associations of Taiwan, South Korea, the United States, Europe, Japan, and China.
Technology computer-aided design is a branch of electronic design automation (EDA) that models semiconductor fabrication and semiconductor device operation. The modeling of the fabrication is termed process TCAD, while the modeling of the device operation is termed device TCAD. Included are the modelling of process steps, and modelling of the behavior of the electrical devices based on fundamental physics, such as the doping profiles of the devices. TCAD may also include the creation of "compact models", which try to capture the electrical behavior of such devices but do not generally derive them from the underlying physics. SPICE simulator itself is usually considered as part of EDA rather than TCAD.
Semiconductor device modeling creates models for the behavior of the electrical devices based on fundamental physics, such as the doping profiles of the devices. It may also include the creation of compact models, which try to capture the electrical behavior of such devices but do not generally derive them from the underlying physics. Normally it starts from the output of a semiconductor process simulation.
A multigate device, multi-gate MOSFET or multi-gate field-effect transistor (MuGFET) refers to a metal–oxide–semiconductor field-effect transistor (MOSFET) that has more than one gate on a single transistor. The multiple gates may be controlled by a single gate electrode, wherein the multiple gate surfaces act electrically as a single gate, or by independent gate electrodes. A multigate device employing independent gate electrodes is sometimes called a multiple-independent-gate field-effect transistor (MIGFET). The most widely used multi-gate devices are the FinFET and the GAAFET, which are non-planar transistors, or 3D transistors.
Thomas Martin Conte is the Associate Dean for Research and Professor of Computer Science at Georgia Institute of Technology College of Computing; and, since 2011, also Professor of Electrical and Computer Engineering at Georgia Institute of Technology College of Engineering. He is a fellow of Institute of Electrical and Electronics Engineers (IEEE). He served as the president of the IEEE Computer Society in 2015.
Chih-Tang "Tom" Sah is a Chinese-American electronics engineer and condensed matter physicist. He is best known for inventing CMOS logic with Frank Wanlass at Fairchild Semiconductor in 1963. CMOS is used in nearly all modern very large-scale integration (VLSI) semiconductor devices.
A three-dimensional integrated circuit is a MOS integrated circuit (IC) manufactured by stacking as many as 16 or more ICs and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. The 3D IC is one of several 3D integration schemes that exploit the z-direction to achieve electrical performance benefits in microelectronics and nanoelectronics.
In semiconductor manufacturing, the International Roadmap for Devices and Systems defines the "5 nm" process as the MOSFET technology node following the "7 nm" node. In 2020, Samsung and TSMC entered volume production of "5 nm" chips, manufactured for companies including Apple, Marvell, Huawei and Qualcomm.
The IEEE International Electron Devices Meeting (IEDM) is an annual micro- and nanoelectronics conference held each December that serves as a forum for reporting technological breakthroughs in the areas of semiconductor and related device technologies, design, manufacturing, physics, modeling and circuit-device interaction.
Embedded intelligence is characterized as the ability of a product, process, or service to reflect on its own operational performance, usage load, or environment. The motivation for this may be to enhance the performance, lifetime, or quality of the product. This self-reflection might be facilitated by information collected via embedded sensors, and processed locally or communicated remotely for processing.
Beyond CMOS refers to the possible future digital logic technologies beyond the scaling limits of CMOS technology. which limits device density and speeds due to heating effects.
The Task Force on Rebooting Computing (TFRC), housed within IEEE Computer Society, is the new home for the IEEE Rebooting Computing Initiative. Founded in 2013 by the IEEE Future Directions Committee, Rebooting Computing has provided an international, interdisciplinary environment where experts from a wide variety of computer-related fields can come together to explore novel approaches to future computing. IEEE Rebooting Computing began as a global initiative launched by IEEE that proposes to rethink the concept of computing through a holistic look at all aspects of computing, from the device itself to the user interface. As part of its work, IEEE Rebooting Computing provides access to various resources like conferences and educational events, feature and scholarly articles, reports, and videos.
Dr. Gary Patton is an American technologist and business executive. He is currently the Corporate Vice President and General Manager of Design Enablement and Components Research in the Technology Development Group at Intel. He has spent most of his career in IBM, starting in IBM's Research Division and holding management and executive positions in IBM's Microelectronics Division in Technology Development, Design Enablement, Manufacturing, and Business Line Management.
RF CMOS is a metal–oxide–semiconductor (MOS) integrated circuit (IC) technology that integrates radio-frequency (RF), analog and digital electronics on a mixed-signal CMOS RF circuit chip. It is widely used in modern wireless telecommunications, such as cellular networks, Bluetooth, Wi-Fi, GPS receivers, broadcasting, vehicular communication systems, and the radio transceivers in all modern mobile phones and wireless networking devices. RF CMOS technology was pioneered by Pakistani engineer Asad Ali Abidi at UCLA during the late 1980s to early 1990s, and helped bring about the wireless revolution with the introduction of digital signal processing in wireless communications. The development and design of RF CMOS devices was enabled by van der Ziel's FET RF noise model, which was published in the early 1960s and remained largely forgotten until the 1990s.
Francesca Iacopi is an engineer, researcher and an academic. She specializes in materials and nanoelectronics engineering and is a professor at the University of Technology Sydney. She is a chief investigator of the ARC Centre of Excellence in Transformative Meta-Optical Systems, a Fellow of the Institution of Engineers Australia, and a senior member of Institute of Electrical and Electronics Engineers.