Contents
- "Comet Lake-S" (14 nm)
- Xeon W-12xx (uniprocessor)
- "Comet Lake-H" (14 nm)
- Xeon W-10xxxM (uniprocessor)
- References
 | This article includes a list of general references, but it lacks sufficient corresponding inline citations .(June 2020) |
| This article includes a list of general references, but it lacks sufficient corresponding inline citations .(June 2020) |
| Model number | sSpec number | Cores (threads) | Frequency | Turbo | L2 cache | L3 cache | GPU model | GPU frequency | TDP | Socket | I/O bus | Release date | Part number(s) | Release price (USD) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Standard power | ||||||||||||||||
| Xeon W-1250 |
| 6 (12) | 3.3 GHz | 4.7 GHz | 6 × 256 KB | 12 MB | HD Graphics P630 | 350-1200 MHz | 80 W | LGA 1200 | DMI 3.0 | May 2020 |
| $255 | ||
| Xeon W-1270 |
| 8 (16) | 3.4 GHz | 5.0 GHz | 8 × 256 KB | 16 MB | HD Graphics P630 | 350-1200 MHz | 80 W | LGA 1200 | DMI 3.0 | May 2020 |
| $362 | ||
| Xeon W-1290 |
| 10 (20) | 3.2 GHz | 5.1 GHz (5.2 w/ TVB) | 10 × 256 KB | 20 MB | HD Graphics P630 | 350-1200 MHz | 80 W | LGA 1200 | DMI 3.0 | May 2020 |
| $494 | ||
| Standard power, embedded | ||||||||||||||||
| Xeon W-1250E |
| 6 (12) | 3.5 GHz | 4.7 GHz | 6 × 256 KB | 12 MB | HD Graphics 630 | 350-1200 MHz | 80 W | LGA 1200 | DMI 3.0 | May 2020 |
| $260 | ||
| Xeon W-1270E |
| 8 (16) | 3.4 GHz | 4.8 GHz | 8 × 256 KB | 16 MB | HD Graphics 630 | 350-1200 MHz | 80 W | LGA 1200 | DMI 3.0 | May 2020 |
| $367 | ||
| Xeon W-1290E |
| 10 (20) | 3.5 GHz | 4.8 GHz | 10 × 256 KB | 20 MB | HD Graphics 630 | 350-1200 MHz | 95 W | LGA 1200 | DMI 3.0 | May 2020 |
| $500 | ||
| High power | ||||||||||||||||
| Xeon W-1250P |
| 6 (12) | 4.1 GHz | 4.8 GHz | 6 × 256 KB | 12 MB | HD Graphics P630 | 350-1200 MHz | 125 W | LGA 1200 | DMI 3.0 | May 2020 |
| $311 | ||
| Xeon W-1270P |
| 8 (16) | 3.8 GHz | 5.1 GHz | 8 × 256 KB | 16 MB | HD Graphics P630 | 350-1200 MHz | 125 W | LGA 1200 | DMI 3.0 | May 2020 |
| $428 | ||
| Xeon W-1290P |
| 10 (20) | 3.7 GHz | 5.2 GHz (5.3 w/ TVB) | 10 × 256 KB | 20 MB | HD Graphics P630 | 350-1200 MHz | 125 W | LGA 1200 | DMI 3.0 | May 2020 |
| $539 | ||
| Low power | ||||||||||||||||
| Xeon W-1290T |
| 10 (20) | 1.9 GHz | 4.7 GHz | 10 × 256 KB | 20 MB | HD Graphics P630 | 350-1200 MHz | 35 W | LGA 1200 | DMI 3.0 | May 2020 |
| $494 | ||
| Low power, embedded | ||||||||||||||||
| Xeon W-1250TE |
| 6 (12) | 2.4 GHz | 3.8 GHz | 6 × 256 KB | 12 MB | HD Graphics 630 | 350-1150 MHz | 35 W | LGA 1200 | DMI 3.0 | May 2020 |
| $260 | ||
| Xeon W-1270TE |
| 8 (16) | 2 GHz | 4.4 GHz | 8 × 256 KB | 16 MB | HD Graphics 630 | 350-1150 MHz | 35 W | LGA 1200 | DMI 3.0 | May 2020 |
| $367 | ||
| Xeon W-1290TE |
| 10 (20) | 1.8 GHz | 4.5 GHz | 10 × 256 KB | 20 MB | HD Graphics 630 | 350-1200 MHz | 35 W | LGA 1200 | DMI 3.0 | May 2020 |
| $500 | ||
| Model number | sSpec number | Cores (threads) | Frequency | Turbo | L2 cache | L3 cache | GPU model | GPU frequency | TDP | Socket | I/O bus | Release date | Part number(s) | Release price (USD) | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Standard power, mobile | ||||||||||||||||
| Xeon W-10855M |
| 6 (12) | 2.8 GHz | 4.9 GHz (5.1 w/ TVB) | 6 × 256 KB | 12 MB | UHD Graphics 630 | 350–1200 MHz | 45 W | BGA 1440 | DMI 3.0 | May 2020 |
| $450 | ||
| Xeon W-10885M |
| 8 (16) | 2.4 GHz | 5.1 GHz (5.3 w/ TVB) | 8 × 256 KB | 16 MB | UHD Graphics 630 | 350–1250 MHz | 45 W | BGA 1440 | DMI 3.0 | May 2020 |
| $623 | ||
A multi-chip module (MCM) is generically an electronic assembly where multiple integrated circuits, semiconductor dies and/or other discrete components are integrated, usually onto a unifying substrate, so that in use it can be treated as if it were a larger IC. Other terms for MCM packaging include "heterogeneous integration" or "hybrid integrated circuit". The advantage of using MCM packaging is it allows a manufacturer to use multiple components for modularity and/or to improve yields over a conventional monolithic IC approach.
AMD Accelerated Processing Unit (APU), formerly known as Fusion, is a series of 64-bit microprocessors from Advanced Micro Devices (AMD), combining a general-purpose AMD64 central processing unit (CPU) and integrated graphics processing unit (IGPU) on a single die.
Intel Core is a line of streamlined midrange consumer, workstation and enthusiast computer central processing units (CPUs) marketed by Intel Corporation. These processors displaced the existing mid- to high-end Pentium processors at the time of their introduction, moving the Pentium to the entry level. Identical or more capable versions of Core processors are also sold as Xeon processors for the server and workstation markets.
Skylake is the codename used by Intel for a processor microarchitecture that was launched in August 2015 succeeding the Broadwell microarchitecture. Skylake is a microarchitecture redesign using the same 14 nm manufacturing process technology as its predecessor, serving as a tock in Intel's tick–tock manufacturing and design model. According to Intel, the redesign brings greater CPU and GPU performance and reduced power consumption. Skylake CPUs share their microarchitecture with Kaby Lake, Coffee Lake, Cannon Lake, Whiskey Lake, and Comet Lake CPUs.
Goldmont is a microarchitecture for low-power Atom, Celeron and Pentium branded processors used in systems on a chip (SoCs) made by Intel. They allow only one thread per core.
Zen is the codename for the first iteration in a family of computer processor microarchitectures of the same name from AMD. It was first used with their Ryzen series of CPUs in February 2017. The first Zen-based preview system was demonstrated at E3 2016, and first substantially detailed at an event hosted a block away from the Intel Developer Forum 2016. The first Zen-based CPUs, codenamed "Summit Ridge", reached the market in early March 2017, Zen-derived Epyc server processors launched in June 2017 and Zen-based APUs arrived in November 2017.
Kaby Lake is Intel's codename for its seventh generation Core microprocessor family announced on August 30, 2016. Like the preceding Skylake, Kaby Lake is produced using a 14 nanometer manufacturing process technology. Breaking with Intel's previous "tick–tock" manufacturing and design model, Kaby Lake represents the optimized step of the newer process–architecture–optimization model. Kaby Lake began shipping to manufacturers and OEMs in the second quarter of 2016, and mobile chips have started shipping while Kaby Lake (desktop) chips were officially launched in January 2017.
Ice Lake is Intel's codename for the 10th generation Intel Core mobile and 3rd generation Xeon Scalable server processors based on the Sunny Cove microarchitecture. Ice Lake represents an Architecture step in Intel's Process-Architecture-Optimization model. Produced on the second generation of Intel's 10 nm process, 10 nm+, Ice Lake is Intel's second microarchitecture to be manufactured on the 10 nm process, following the limited launch of Cannon Lake in 2018. However, Intel altered their naming scheme in 2020 for the 10 nm process. In this new naming scheme, Ice Lake's manufacturing process is called simply 10 nm, without any appended pluses.
Tiger Lake is Intel's codename for the 11th generation Intel Core mobile processors based on the new Willow Cove Core microarchitecture, manufactured using Intel's third-generation 10 nm process node known as 10SF. Tiger Lake replaces the Ice Lake family of mobile processors, representing an Optimization step in Intel's process–architecture–optimization model.
Coffee Lake is Intel's codename for its eighth generation Core microprocessor family, announced on September 25, 2017. It is manufactured using Intel's second 14 nm process node refinement. Desktop Coffee Lake processors introduced i5 and i7 CPUs featuring six cores and Core i3 CPUs with four cores and no hyperthreading.
Process–architecture–optimization is a development model for central processing units (CPUs) that Intel adopted in 2016. Under this three-phase (three-year) model, every microprocessor die shrink is followed by a microarchitecture change and then by one or more optimizations. It replaced the two-phase (two-year) tick–tock model that Intel adopted in 2006. The tick–tock model was no longer economically sustainable, according to Intel, because production of ever smaller dies becomes ever more costly.
Comet Lake is Intel's codename for its 10th generation Core microprocessors. They are manufactured using Intel's third 14 nm Skylake process refinement, succeeding the Whiskey Lake U-series mobile processor and Coffee Lake desktop processor families. Intel announced low-power mobile Comet Lake-U CPUs on August 21, 2019, H-series mobile CPUs on April 2, 2020, desktop Comet Lake-S CPUs April 30, 2020, and Xeon W-1200 series workstation CPUs on May 13, 2020. Comet Lake processors and Ice Lake 10 nm processors are together branded as the Intel "10th Generation Core" family. Intel officially launched Comet Lake-Refresh CPUs on the same day as 11th Gen Core Rocket Lake launch. The low-power mobile Comet Lake-U Core and Celeron 5205U CPUs were discontinued on July 7, 2021.
Ampere Computing LLC is an American fabless semiconductor company based in Santa Clara, California that develops cloud native server microprocessors (CNPs). Ampere also has offices in: Portland, Oregon; Taipei, Taiwan; Raleigh, North Carolina; Bangalore, India; and Ho Chi Minh City, Vietnam.
Sunny Cove is a codename for a CPU microarchitecture developed by Intel, first released in September 2019. It succeeds the Palm Cove microarchitecture and is fabricated using Intel's 10 nm process node. The microarchitecture is implemented in 10th-generation Intel Core processors for mobile and third generation Xeon scalable server processors. 10th-generation Intel Core mobile processors were released in September 2019, while the Xeon server processors were released in April 6, 2021.
Rocket Lake is Intel's codename for its 11th generation Core microprocessors. Released on March 30, 2021, it is based on the new Cypress Cove microarchitecture, a variant of Sunny Cove backported to Intel's 14 nm process node. Rocket Lake cores contain significantly more transistors than Skylake-derived Comet Lake cores.
Alder Lake is Intel's codename for the 12th generation of Intel Core processors based on a hybrid architecture utilizing Golden Cove performance cores and Gracemont efficient cores. It is fabricated using Intel's Intel 7 process, previously referred to as Intel 10 nm Enhanced SuperFin (10ESF). The 10ESF has a 10%-15% boost in performance over the 10SF used in the mobile Tiger Lake processors. Intel officially announced 12th Gen Intel Core CPUs on October 27, 2021. Intel officially announced 12th Gen Intel Core mobile CPUs and non-K series desktop CPUs on January 4, 2022. Intel officially announced the launch of Alder Lake-P and -U series on February 23, 2022, and Alder Lake-HX series on May 10, 2022.
Gracemont is a microarchitecture for low-power processors used in systems on a chip (SoCs) made by Intel, and is the successor to Tremont. Like its predecessor, it is also implemented as low-power cores in a hybrid design of the Alder Lake and Raptor Lake processors.
Willow Cove is a codename for a CPU microarchitecture developed by Intel and released in September 2020. Willow Cove is the successor to the Sunny Cove microarchitecture, and is fabricated using Intel's enhanced 10 nm process node called 10 nm SuperFin (10SF). The microarchitecture powers 11th-generation Intel Core mobile processors.