LGA 1200

Last updated

LGA 1200
LGA1200 Socket.jpg
Release dateMay 27, 2020 (2020-05-27)
Designed by Intel
Manufactured by Foxconn
Type LGA-ZIF
Chip form factors Flip-chip
Contacts1200
FSB protocol PCI Express
Processors
Predecessor LGA 1151
Successor LGA 1700
Memory support DDR4

This article is part of the CPU socket series

LGA 1200, also known as Socket H5, is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Comet Lake (10th gen) and Rocket Lake (11th-gen) desktop CPUs, which was released in April 2020. [1] [2]

Contents

LGA 1200 is designed as a replacement for the LGA 1151 (known as Socket H4). LGA 1200 is a land grid array mount with 1200 protruding pins to make contact with the pads on the processor. It uses a modified design of LGA 1151, with 49 more pins on it, improving power delivery and offering support for future incremental I/O features. Pin 1 position remains the same as it was in previous generation processors, but it has shifted socket keying to left (previously it was right), making Comet Lake processors incompatible both electrically and mechanically with previous chips. [3]

ASRock, Asus, Biostar, Gigabyte and MSI have confirmed their motherboards based on the Intel Z490 chipset support the 11th generation Intel Rocket Lake desktop CPUs. [4] [5] [6] [7] Full PCIe 4.0 support is confirmed for selected brands. ASUS did not include support to PCIe 4.0 on M.2, hindering support for PCIe gen 4.0 NVMe SSDs. [8] [9]

Heatsink

Pads of an Intel Core i9-10900K Intel Core i9-10900K LGA 1200 pins.png
Pads of an Intel Core i9-10900K

The 4 holes for fastening the heatsink to the motherboard are placed in a square with a lateral length of 75 mm for Intel's sockets LGA 1156, LGA 1155, LGA 1150, LGA 1151 and LGA 1200. Cooling solutions should therefore be interchangeable. [10] [11] [12]

Comet Lake chipsets (400 series)

Memory support configuration common for all chipsets:

H410 B460 H470 Q470 Z490 W480
Overclocking Thermal limits CPU overclocking is offered by ASRock, ASUS and MSI [13] [14] NoYesNo
Bus InterfaceDMI 3.0 x4
CPU support Comet Lake-S only [15] [16] Comet Lake-S / Rocket Lake (a BIOS update is required) [16] [17]
Memory supportUp to 64 GBUp to 128 GB
Maximum DIMM slots24
Maximum USB 2.0 ports101214
USB 3.2 ports configurationGen1Up to 4Up to 8Up to 10
Gen2N/AUp to 4Up to 6Up to 8
Maximum SATA 3.0 ports468
Processor PCI Express v3.0 configuration1x161x16 or 2x8 or 1x8+2x4
PCH PCI Express configuration6162024
Independent Display Support (digital ports/pipes)23
Integrated Wireless (802.11ax)NoIntel Wi-Fi 6 AX201 [lower-alpha 1]
SATA RAID 0/1/5/10 supportNoYes
Intel Optane Memory Support
Intel Smart Sound Technology
Intel Active Management, Trusted Execution and vPro TechnologyNoYesNoYes
Chipset TDP 6W
Chipset lithography22 nm [18] 14 nm [18]
Release dateQ2 2020

Rocket Lake chipsets (500 series)

Memory support configuration common for all chipsets (except W580):

W580 based motherboards support DDR4-3200 RAM in dual channel mode.

H510 B560 H570 Q570 Z590 W580
Overclocking NoRAM onlyNoYesRAM only
Bus InterfaceDMI 3.0 x4DMI 3.0 x8 (runs in x4 mode for Comet Lake-S CPUs)
CPU support Comet Lake-S / Rocket Lake Rocket Lake
Maximum DIMM slots24
Maximum USB 2.0 ports101214
USB 3.2 ports configurationGen1Up to 4Up to 6Up to 8Up to 10Up to 10
Gen2x1Up to 4Up to 8
x2Up to 2Up to 3
Maximum SATA 3.0 ports468
Processor PCI Express v4.0 configuration1x161x16 + 1x41x16 + 1x4 or
2x8 + 1x4 or
1x8 + 3x4
PCH PCI Express configuration6122024
Independent Display Support (digital ports/pipes)23
Integrated Wireless (802.11ax)Intel Wi-Fi 6 AX201 [lower-alpha 1]
PCIe RAID 0/1/5/10 supportNoYes
SATA RAID 0/1/5/10 supportNoYes
Intel Optane Memory SupportNoYes
Intel Smart Sound Technology
Intel Active Management, Trusted Execution and vPro TechnologyNoYesNoYes
Chipset TDP 6W
Chipset lithography14 nm[ citation needed ]
Release dateQ1 2021Q2 2021Q1 2021Q2 2021
  1. 1 2 depends on OEM's implementation

See also

Related Research Articles

<span class="mw-page-title-main">Mini-ITX</span> 17 × 17 cm motherboard

Mini-ITX is a 170 mm × 170 mm motherboard form factor developed by VIA Technologies in 2001. Mini-ITX motherboards have been traditionally used in small-configured computer systems. Originally, Mini-ITX was a niche standard designed for fanless cooling with a low power consumption architecture, which made them useful for home theater PC systems, where fan noise can detract from the cinema experience.

<span class="mw-page-title-main">Land grid array</span> Type of surface-mount packaging for integrated circuits

The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board.

<span class="mw-page-title-main">Platform Controller Hub</span> Family of Intels single-chip chipsets

The Platform Controller Hub (PCH) is a family of Intel's single-chip chipsets, first introduced in 2009. It is the successor to the Intel Hub Architecture, which used two chips–a northbridge and southbridge, and first appeared in the Intel 5 Series.

<span class="mw-page-title-main">Intel Core</span> Line of CPUs by Intel

Intel Core is a line of multi-core central processing units (CPUs) for midrange, embedded, workstation, high-end and enthusiast computer markets marketed by Intel Corporation. These processors displaced the existing mid- to high-end Pentium processors at the time of their introduction, moving the Pentium to the entry level. Identical or more capable versions of Core processors are also sold as Xeon processors for the server and workstation markets.

<span class="mw-page-title-main">LGA 2011</span> CPU socket created by Intel

LGA 2011, also called Socket R, is a CPU socket by Intel released on November 14, 2011. It launched along with LGA 1356 to replace its predecessor, LGA 1366 and LGA 1567. While LGA 1356 was designed for dual-processor or low-end servers, LGA 2011 was designed for high-end desktops and high-performance servers. The socket has 2011 protruding pins that touch contact points on the underside of the processor.

<span class="mw-page-title-main">LGA 1155</span> Intel CPU socket

LGA 1155, also called Socket H2, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for their CPUs based on the Sandy Bridge and Ivy Bridge microarchitectures.

<span class="mw-page-title-main">Skylake (microarchitecture)</span> CPU microarchitecture by Intel

Skylake is Intel's codename for its sixth generation Core microprocessor family that was launched on August 5, 2015, succeeding the Broadwell microarchitecture. Skylake is a microarchitecture redesign using the same 14 nm manufacturing process technology as its predecessor, serving as a tock in Intel's tick–tock manufacturing and design model. According to Intel, the redesign brings greater CPU and GPU performance and reduced power consumption. Skylake CPUs share their microarchitecture with Kaby Lake, Coffee Lake, Whiskey Lake, and Comet Lake CPUs.

<span class="mw-page-title-main">LGA 1150</span> Intel motherboard socket for Haswell CPUs

LGA 1150, also known as Socket H3, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for CPUs built on the Haswell microarchitecture. This socket is also used by the Haswell's successor, Broadwell microarchitecture.

<span class="mw-page-title-main">LGA 1151</span> Intel microprocessor compatible socket

LGA 1151, also known as Socket H4, is a type of zero insertion force flip-chip land grid array (LGA) socket for Intel desktop processors which comes in two distinct versions: the first revision which supports both Intel's Skylake and Kaby Lake CPUs, and the second revision which supports Coffee Lake CPUs exclusively.

Intel X99, codenamed "Wellsburg", is a Platform Controller Hub (PCH) designed and manufactured by Intel, targeted at the high-end desktop (HEDT) and enthusiast segments of the Intel product lineup. The X99 chipset supports both Intel Core i7 Extreme and Intel Xeon E5-16xx v3 and E5-26xx v3 processors, which belong to the Haswell-E and Haswell-EP variants of the Haswell microarchitecture, respectively. All supported processors use the LGA 2011-v3 socket.

<span class="mw-page-title-main">Socket AM4</span> CPU socket for AMD processors with Zen and Excavator architectures

Socket AM4 is a PGA microprocessor socket used by AMD's central processing units (CPUs) built on the Zen and Excavator microarchitectures.

<span class="mw-page-title-main">Coffee Lake</span> Eighth-generation Intel Core microprocessor family

Coffee Lake is Intel's codename for its eighth-generation Core microprocessor family, announced on September 25, 2017. It is manufactured using Intel's second 14 nm process node refinement. Desktop Coffee Lake processors introduced i5 and i7 CPUs featuring six cores and Core i3 CPUs with four cores and no hyperthreading.

Comet Lake is Intel's codename for its 10th generation Core processors. They are manufactured using Intel's third 14 nm Skylake process revision, succeeding the Whiskey Lake U-series mobile processor and Coffee Lake desktop processor families. Intel announced low-power mobile Comet Lake-U CPUs on August 21, 2019, H-series mobile CPUs on April 2, 2020, desktop Comet Lake-S CPUs April 30, 2020, and Xeon W-1200 series workstation CPUs on May 13, 2020. Comet Lake processors and Ice Lake 10 nm processors are together branded as the Intel "10th Generation Core" family. Intel officially launched Comet Lake-Refresh CPUs on the same day as 11th Gen Core Rocket Lake launch. The low-power mobile Comet Lake-U Core and Celeron 5205U CPUs were discontinued on July 7, 2021.

Rocket Lake is Intel's codename for its 11th generation Core microprocessors. Released on March 30, 2021, it is based on the new Cypress Cove microarchitecture, a variant of Sunny Cove backported to Intel's 14 nm process node. Rocket Lake cores contain significantly more transistors than Skylake-derived Comet Lake cores.

<span class="mw-page-title-main">Alder Lake</span> Intel microprocessor family

Alder Lake is Intel's codename for the 12th generation of Intel Core processors based on a hybrid architecture utilizing Golden Cove performance cores and Gracemont efficient cores. It is fabricated using Intel's Intel 7 process, previously referred to as Intel 10 nm Enhanced SuperFin (10ESF). The 10ESF has a 10%-15% boost in performance over the 10SF used in the mobile Tiger Lake processors. Intel officially announced 12th Gen Intel Core CPUs on October 27, 2021, mobile CPUs and non-K series desktop CPUs on January 4, 2022, Alder Lake-P and -U series on February 23, 2022, and Alder Lake-HX series on May 10, 2022.

<span class="mw-page-title-main">LGA 1700</span> Intel microprocessor compatible socket for Alder Lake and Raptor Lake

LGA 1700 is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake, which was first released in November 2021.

Raptor Lake is Intel's codename for the 13th and 14th generations of Intel Core processors based on a hybrid architecture, utilizing Raptor Cove performance cores and Gracemont efficient cores. Like Alder Lake, Raptor Lake is fabricated using Intel's Intel 7 process. Raptor Lake features up to 24 cores and 32 threads and is socket compatible with Alder Lake systems. Like earlier generations, Raptor Lake processors also need accompanying chipsets.

References

  1. "Intel® Z490 Chipset Product Specifications". Intel. Retrieved April 30, 2020.
  2. Bonshor, Gavin. "The Intel Z490 Overview: 44+ Motherboards Examined". AnandTech. Retrieved April 30, 2020.
  3. Mujtaba, Hassan (November 1, 2019). "Intel's Entire 10th Gen Comet Lake Desktop CPU Lineup Leaked – Up To 10 Cores, 20 Thread Core i9-10900, 80W TDP, W480 Chipset With New LGA 1200 Socket". Wccftech. Retrieved November 30, 2019.
  4. "Biostar and ASrock confirm 11th Gen Core 'Rocket Lake-S' support on Z490 motherboards". VideoCardz. December 26, 2020. Retrieved December 26, 2020.
  5. "Gigabyte Says Intel Z490 Chipset Motherboards Will Support 11th Gen "Rocket Lake-S"". TechPowerUp. May 1, 2020. Retrieved February 21, 2021.
  6. Campbell, Mark (January 7, 2021). "ASUS updates its Z490 motherboards with 11th Gen Intel CPU support". Overclock3D. Retrieved February 18, 2021.
  7. Mujtaba, Hassan (December 29, 2020). "MSI Adds Intel Rocket Lake 11th Gen CPU Support on Z490 Motherboards". Wccftech. Retrieved February 18, 2021.
  8. Mujtaba, Hassan (February 8, 2021). "ASUS Z490 Motherboards Tested With Intel Rocket Lake Desktop CPU, Lack PCIe Gen 4.0 Support on M.2 Slots". Wccftech. Retrieved February 18, 2021.
  9. Mujtaba, Hassan (July 3, 2020). "ASUS Z490 Motherboards Severely Lack Behind In PCIe 4.0 Support Compared To Competitors, No Proper Hardware-Level Integration For Rocket Lake CPUs". Wccftech. Retrieved February 18, 2021.
  10. Bonshor, Gavin (April 30, 2020). "The Intel Z490 Overview: 44+ Motherboards Examined". AnandTech. Retrieved May 1, 2020.
  11. "ID-COOLINGFrostflow 240-R】ID-COOLING FROSTFLOW 240-R 红色灯效经典款一体式水冷散热器 240冷排全平台扣具含115X/2066/AM4【行情 报价 价格 评测】-京东". item.jd.com. Retrieved December 26, 2019.
  12. "ID-COOLINGSE-214pro红黑版】ID-COOLING SE-214i 热管镀镍版塔式侧吹CPU散热器 四热管12cm温控静音减震红灯风扇【行情 报价 价格 评测】-京东". item.jd.com. Retrieved December 26, 2019.
  13. AleksandarK (May 1, 2020). "ASRock Enables Overclocking on Non-Z Motherboards for 10th Generation Non-K Comet Lake CPUs". TechPowerUp. Retrieved November 12, 2022.
  14. "ASUS, ASRock and MSI bring 'overclocking' to H470/B460 and non-K Intel Core CPUs". VideoCardz. May 28, 2020. Retrieved November 12, 2022.
  15. Cutress, Ian (January 11, 2021). "Intel Previews 11th Gen Core Rocket Lake: Core i9-11900K and Z590, Coming Q1". AnandTech. Retrieved February 11, 2021.
  16. 1 2 "BIOS Updates for Intel® 400 Series Chipset and Upcoming 11th Gen Intel® Core™ Desktop Processor-Based System Builds". Intel. Retrieved February 11, 2021.
  17. "Intel® W480 Chipset Compatible Products". Intel. Retrieved July 27, 2023.
  18. 1 2 "Intel B460 and H410 Incompatibility with "Rocket Lake" Explained". TechPowerUp. February 10, 2021. Retrieved February 11, 2021.