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Release date | May 27, 2020 |
---|---|
Designed by | Intel |
Manufactured by | Foxconn |
Type | LGA-ZIF |
Chip form factors | Flip-chip |
Contacts | 1200 |
FSB protocol | PCI Express |
Processors | |
Predecessor | LGA 1151 |
Successor | LGA 1700 |
Memory support | DDR4 |
This article is part of the CPU socket series |
LGA 1200, also known as Socket H5, is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Comet Lake (10th gen) and Rocket Lake (11th-gen) desktop CPUs, which was released in April 2020. [1] [2]
LGA 1200 is designed as a replacement for the LGA 1151 (known as Socket H4). LGA 1200 is a land grid array mount with 1200 protruding pins to make contact with the pads on the processor. It uses a modified design of LGA 1151, with 49 more pins on it, improving power delivery and offering support for future incremental I/O features. Pin 1 position remains the same as it was in previous generation processors, but it has shifted socket keying to left (previously it was right), making Comet Lake processors incompatible both electrically and mechanically with previous chips. [3]
ASRock, Asus, Biostar, Gigabyte and MSI have confirmed their motherboards based on the Intel Z490 chipset support the 11th generation Intel Rocket Lake desktop CPUs. [4] [5] [6] [7] Full PCIe 4.0 support is confirmed for selected brands. ASUS did not include support to PCIe 4.0 on M.2, hindering support for PCIe gen 4.0 NVMe SSDs. [8] [9]
The 4 holes for fastening the heatsink to the motherboard are placed in a square with a lateral length of 75 mm for Intel's sockets LGA 1156, LGA 1155, LGA 1150, LGA 1151 and LGA 1200. Cooling solutions should therefore be interchangeable. [10] [11] [12]
Memory support configuration common for all chipsets:
H410 | B460 | H470 | Q470 | Z490 | W480 | ||
---|---|---|---|---|---|---|---|
Overclocking | Thermal limits CPU overclocking is offered by ASRock, ASUS and MSI [13] [14] | No | Yes | No | |||
Bus Interface | DMI 3.0 x4 | ||||||
CPU support | Comet Lake-S only [15] [16] | Comet Lake-S / Rocket Lake (a BIOS update is required) [16] [17] | |||||
Memory support | Up to 64 GB | Up to 128 GB | |||||
Maximum DIMM slots | 2 | 4 | |||||
Maximum USB 2.0 ports | 10 | 12 | 14 | ||||
USB 3.2 ports configuration | Gen1 | Up to 4 | Up to 8 | Up to 10 | |||
Gen2 | N/A | Up to 4 | Up to 6 | Up to 8 | |||
Maximum SATA 3.0 ports | 4 | 6 | 8 | ||||
Processor PCI Express v3.0 configuration | 1x16 | 1x16 or 2x8 or 1x8+2x4 | |||||
PCH PCI Express configuration | 6 | 16 | 20 | 24 | |||
Independent Display Support (digital ports/pipes) | 2 | 3 | |||||
Integrated Wireless (802.11ax) | No | Intel Wi-Fi 6 AX201 [lower-alpha 1] | |||||
SATA RAID 0/1/5/10 support | No | Yes | |||||
Intel Optane Memory Support | |||||||
Intel Smart Sound Technology | |||||||
Intel Active Management, Trusted Execution and vPro Technology | No | Yes | No | Yes | |||
Chipset TDP | 6W | ||||||
Chipset lithography | 22 nm [18] | 14 nm [18] | |||||
Release date | Q2 2020 |
Memory support configuration common for all chipsets (except W580):
W580 based motherboards support DDR4-3200 RAM in dual channel mode.
H510 | B560 | H570 | Q570 | Z590 | W580 | |||
---|---|---|---|---|---|---|---|---|
Overclocking | No | RAM only | No | Yes | RAM only | |||
Bus Interface | DMI 3.0 x4 | DMI 3.0 x8 (runs in x4 mode for Comet Lake-S CPUs) | ||||||
CPU support | Comet Lake-S / Rocket Lake | Rocket Lake | ||||||
Maximum DIMM slots | 2 | 4 | ||||||
Maximum USB 2.0 ports | 10 | 12 | 14 | |||||
USB 3.2 ports configuration | Gen1 | Up to 4 | Up to 6 | Up to 8 | Up to 10 | Up to 10 | ||
Gen2 | x1 | — | Up to 4 | Up to 8 | ||||
x2 | Up to 2 | Up to 3 | ||||||
Maximum SATA 3.0 ports | 4 | 6 | 8 | |||||
Processor PCI Express v4.0 configuration | 1x16 | 1x16 + 1x4 | 1x16 + 1x4 or 2x8 + 1x4 or 1x8 + 3x4 | |||||
PCH PCI Express configuration | 6 | 12 | 20 | 24 | ||||
Independent Display Support (digital ports/pipes) | 2 | 3 | ||||||
Integrated Wireless (802.11ax) | Intel Wi-Fi 6 AX201 [lower-alpha 1] | |||||||
PCIe RAID 0/1/5/10 support | No | Yes | ||||||
SATA RAID 0/1/5/10 support | No | Yes | ||||||
Intel Optane Memory Support | No | Yes | ||||||
Intel Smart Sound Technology | ||||||||
Intel Active Management, Trusted Execution and vPro Technology | No | Yes | No | Yes | ||||
Chipset TDP | 6W | |||||||
Chipset lithography | 14 nm[ citation needed ] | |||||||
Release date | Q1 2021 | Q2 2021 | Q1 2021 | Q2 2021 | ||||
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