LGA 1700

Last updated

LGA 1700
2023 Podstawka LGA 1700.jpg
Release dateNovember 4, 2021 (2021-11-04)
Designed by Intel
Manufactured byLotes
Type LGA-ZIF
Chip form factors Flip-chip
Contacts1700
FSB protocol PCI Express 4.0
Direct Media Interface
Processor dimensions37.5 mm × 45 mm
1,687.5mm2
Processors
Predecessor LGA 1200
Successor LGA 1851
Memory support

This article is part of the CPU socket series

LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake, which was first released in November 2021.

Contents

LGA 1700 is designed as a replacement for LGA 1200 (known as Socket H5) and it has 1700 protruding pins to make contact with the pads on the processor. Compared to its predecessor, it has 500 more pins, which required a major change in socket and processor sizes; it is 7.5 mm longer. It is the first major change in Intel's LGA desktop CPU socket size since the introduction of LGA 775 in 2004, especially for consumer-grade CPU sockets. The larger size also required a change in the heatsink fastening holes configuration, making previously used cooling solutions incompatible with LGA 1700 motherboards and CPUs. [2]

Heatsink design

Since the introduction of land grid array (LGA)-based sockets in the consumer hardware space in 2004, [3] the thermal solution hole pattern (the distance between centers of the screw-holes for the heatsink) has changed three times for Intel's mainstream platforms:

While some motherboards do offer additional mounting holes for using older coolers, e.g. for using an LGA115x cooler on an LGA1700 motherboard, differences in Z-height and the mounting pressure will result in worse than expected cooling performance. For best results it is recommended to either change the cooling solution to a model certified for this platform or request an updated mounting-kit [4] [5] [6] for one of the higher-end solutions on the market. For heatsinks to be interchangeable, not only the hole pattern, but also the socket seating plane height, the maximum thermal solution center of gravity height from the IHS and the static total compressive minimum need to match.

Issues

Even though some CPU cooler manufacturers are providing adapter kits (usually in the form of different screws) to go with existing LGA115x and LGA1200 retention brackets, there have been reports of the CPU bending or bowing due to uneven mounting pressure from the LGA 1700 integrated loading mechanism (ILM). This leads to the CPU having reduced contact with the cooler plate, which in turn leads to increased temperatures. [7] LGA 1700 contact frames to replace the stock ILM have been released by Thermal Grizzly and Thermalright to ensure even CPU mounting pressure and cooler contact. [8] [9]

Maximum RAM

Initially motherboards based on Alder Lake and Raptor Lake chipsets supported 32 GB memory modules but most known OEMs in 2023 updated BIOS'es to support 48 GB modules and in December 2023 support for 64 GB modules started to roll out first by MSI and ASRock. [10] [11] Users are advised to consult with their motherboards web support pages to check what memory modules can be installed.

Alder Lake chipsets (600 series)

H610 [12] B660 [13] H670 [14] Q670 [15] Z690 [16] W680 [17]
Overclocking No RAM; BCLK on some ASRock, ASUS and MSI motherboards [18] [19] [20] [21] RAM onlyNoYes
Bus interface DMI 4.0 ×4 DMI 4.0 ×8
CPU support Alder Lake
Raptor Lake (a BIOS update may be required)
Memory capacityUp to 64/128 GB [lower-alpha 1] Up to 128/256 GB [lower-alpha 1] Up to 128/256 GB with ECC [lower-alpha 1]
Maximum DIMM slots24
Maximum USB 2.0 ports101214
USB 3.2 ports configurationGen 1 (5 Gbit/s)Up to 4Up to 6Up to 8Up to 10
Gen 2×1 (10 Gbit/s)Up to 2Up to 4Up to 8Up to 10
×2 (20 Gbit/s)NoneUp to 2Up to 4
Maximum SATA 3.0 ports48
Processor PCI Express configuration5.01×161×16 or 2×8
4.0None1×4
PCH PCI Express configuration4.0None612
3.081216
Independent display support (digital ports/pipes)34
Integrated wirelesssuggested: Intel Wi-Fi 6E AX211 (802.11ax / Wi-Fi 6E / Bluetooth 5.3) [lower-alpha 2]
PCIe RAID supportNo0, 1, 5
SATA RAID supportNo0, 1, 5, 10 [22]
Intel Optane memory supportNoYes
Intel Smart Sound [23] technologyYes
Intel Active Management, Trusted Execution and vPro technologyNoYesNoYes
Chipset TDP 6 W
Release dateQ1 2022Q4 2021Q2 2022
  1. 1 2 3 RAM capacity might be limited to the first number before a BIOS update
  2. Depends on OEM's implementation. OEMs include Wi-Fi chips as optional M.2 CNVio2 boards and can also choose from previous generations, such as the AX201 (Wi-Fi 6 / BT 5.2).

Raptor Lake chipsets (700 series)

B760 [24] H770 [25] Z790 [26]
Overclocking RAM; BCLK on some ASRock and MSI motherboards, 12th Gen CPUs only. 13th Gen disabled BCLK OC at CPU microcode level [27] [28] [29] RAM onlyYes
Bus InterfaceDMI 4.0 ×4DMI 4.0 ×8
CPU support Alder Lake and Raptor Lake
Memory capacityUp to 128/256 GB [lower-alpha 1]
Maximum DIMM slots4
Maximum USB 2.0 ports1214
USB 3.2 ports configurationGen 1 (5 Gbit/s)Up to 6Up to 8Up to 10
Gen 2×1 (10 Gbit/s)Up to 4Up to 10
×2 (20 Gbit/s)Up to 2Up to 5
Maximum SATA 3.0 ports48
Processor PCI Express configuration5.01x161×16 or 2×8
4.0 (for M.2)1x4
PCH PCI Express configuration4.0101620
3.048
Independent display support (digital ports/pipes)4
Integrated wirelessIntel Wi-Fi 6E AX211 (802.11ax / Wi-Fi 6E / Bluetooth 5.3) [lower-alpha 2]
PCIe RAID supportNo0, 1, 5
SATA RAID support0, 1, 5, 10
Intel Optane memory supportYes
Intel Smart Sound technologyYes
Intel Active Management, Trusted Execution and vPro technologyNo
Chipset TDP 6 W
Release dateQ1 2023Q4 2022
  1. RAM capacity might be limited to the first number before a BIOS update
  2. depends on OEM's implementation

See also

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