Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with many pins, zero insertion force (ZIF) sockets are preferred. Common sockets include Pin Grid Array (PGA) or Land Grid Array (LGA). These designs apply a compression force once either a handle (PGA type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket. Certain devices use Ball Grid Array (BGA) sockets, although these require soldering and are generally not considered user replaceable.
CPU sockets are used on the motherboard in desktop and server computers. Because they allow easy swapping of components, they are also used for prototyping new circuits. Laptops typically use surface-mount CPUs, which take up less space on the motherboard than a socketed part.
As the pin density increases in modern sockets, increasing demands are placed on the printed circuit board fabrication technique, which permits the large number of signals to be successfully routed to nearby components. Likewise, within the chip carrier, the wire bonding technology also becomes more demanding with increasing pin counts and pin densities. Each socket technology will have specific reflow soldering requirements. As CPU and memory frequencies increase, above 30 MHz or thereabouts, electrical signalling increasingly shifts to differential signaling over parallel buses, bringing a new set of signal integrity challenges. The evolution of the CPU socket amounts to a coevolution of all these technologies in tandem.
Modern CPU sockets are almost always designed in conjunction with a heat sink mounting system, or in lower power devices, other thermal considerations.
Function
A CPU socket is made of plastic, and often comes with a lever or latch, and with metal contacts for each of the pins or lands on the CPU. Many packages are keyed to ensure the proper insertion of the CPU. CPUs with a PGA (pin grid array) package are inserted into the socket and, if included, the latch is closed. CPUs with an LGA (land grid array) package are inserted into the socket, the latch plate is flipped into position atop the CPU, and the lever is lowered and locked into place, pressing the CPU's contacts firmly against the socket's lands and ensuring a good connection, as well as increased mechanical stability.
It is possible to use Socket 7 processors in a Socket 5. An adapter is required, or if one is careful, a socket 7 can be pulled off its pins and put onto a socket 5 board, allowing the use of socket 7 processors.
Socket L: 1000MHz in Single CPU mode, 2000MHz in Dual CPU mode
Replaces Socket 940 Socket L was intended for enthusiasts who wanted server power in a desktop PC. It is just a re-branded Socket F that doesn't need special RAM, and may have only been used in the Asus L1N64-SLI WS Motherboard.
Zero insertion force (ZIF) is a type of IC socket or electrical connector that requires very little force for insertion. With a ZIF socket, before the IC is inserted, a lever or slider on the side of the socket is moved, pushing all the sprung contacts apart so that the IC can be inserted with very little force - generally the weight of the IC itself is sufficient and no external downward force is required. The lever is then moved back, allowing the contacts to close and grip the pins of the IC. ZIF sockets are much more expensive than standard IC sockets and also tend to take up a larger board area due to the space taken up by the lever mechanism. Typically, they are only used when there is a good reason to do so.
Socket 7 is a physical and electrical specification for an x86-style CPU socket on a personal computer motherboard. It was released in June 1995. The socket supersedes the earlier Socket 5, and accepts P5 Pentium microprocessors manufactured by Intel, as well as compatibles made by Cyrix/IBM, AMD, IDT and others. Socket 7 was the only socket that supported a wide range of CPUs from different manufacturers and a wide range of speeds.
A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.
A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package.
Socket 478, also known as mPGA478 or mPGA478B, is a 478-contact CPU socket used for Intel's Pentium 4 and Celeron series CPUs.
Socket A is a zero insertion force pin grid array (PGA) CPU socket used for AMD processors ranging from the Athlon Thunderbird to the Athlon XP/MP 3200+, and AMD budget processors including the Duron and Sempron. Socket A also supports AMD Geode NX embedded processors. It compliments the prior Slot A CPU interface used in some Athlon Thunderbird processors. The front-side bus frequencies supported for the AMD Athlon XP and Sempron are 133 MHz, 166 MHz, and 200 MHz. Socket A supports 32-bit CPUs only.
The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board.
LGA 775, also known as Socket T, is an Intel desktop CPU socket. Unlike PGA CPU sockets, such as its predecessor Socket 478, LGA 775 has no socket holes; instead, it has 775 protruding pins which touch contact points on the underside of the processor (CPU).
Socket 3 was a series of CPU sockets for various x86 microprocessors. It was sometimes found alongside a secondary socket designed for a math coprocessor chip, such as the 487. Socket 3 resulted from Intel's creation of lower voltage microprocessors. An upgrade to Socket 2, it rearranged the pin layout. Socket 3 is compatible with 168-pin socket CPUs.
Socket 939 is a CPU socket released by AMD in June 2004 to supersede the previous Socket 754 for Athlon 64 processors. Socket 939 was succeeded by Socket AM2 in May 2006. It was the second socket designed for AMD's AMD64 range of processors.
Socket 1, originally called the "OverDrive" socket, was the second of a series of standard CPU sockets created by Intel into which various x86 microprocessors were inserted. It was an upgrade to Intel's first standard 169-pin pin grid array (PGA) socket and the first with an official designation. Socket 1 was intended as a 486 upgrade socket, and added one extra pin to prevent upgrade chips from being inserted incorrectly.
Socket F is a CPU socket designed by AMD for its Opteron line of CPUs released on August 15, 2006. In 2010 Socket F was replaced by Socket C32 for entry-level servers and Socket G34 for high-end servers.
Socket S1 is the CPU socket type used by AMD for their Turion 64, Athlon 64 Mobile, Phenom II Mobile and later Sempron processors, which debuted with the dual-core Turion 64 X2 CPUs on May 17, 2006.
Socket 604 is a 604-pin microprocessor socket designed to interface an Intel Xeon processor to the rest of the computer. It provides both an electrical interface as well as physical support. This socket is designed to support a heatsink.
LGA 1155, also called Socket H2, is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel for their CPUs based on the Sandy Bridge and Ivy Bridge microarchitectures.
Socket G2, also known as rPGA 988B is Intel's CPU socket used with their line of mobile Core i7, the successor to the Core 2 line, and also with several mobile Core i5 and Core i3 processors. It is based on Intel's Sandy Bridge and Ivy Bridge architecture. Like its predecessor, socket G1 systems, it can only run in dual-channel memory mode, but with data rates up to 1600 MHz. Socket G2 CPUs are also known as FCPGA988 socket processors, which should be pin compatible with PPGA988.
Socket G3, also known as rPGA 946B/947 or FCPGA 946, is a socket for Intel microprocessors that supports Haswell-based mobile CPUs. Compatible SKUs have an 'M' suffix in the model number.
LGA 1200, also known as Socket H5, is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Comet Lake and Rocket Lake (11th-gen) desktop CPUs, which was released in April 2020.
LGA 1700 is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake, which was first released in November 2021.
Socket AM5 is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by AMD that is used for AMD Ryzen microprocessors starting with the Zen 4 microarchitecture. AM5 was launched in September 2022 and is the successor to AM4.
Combined means that the given socket is supported by all platforms, including desktop, mobile, and server.
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