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Release date | September 27, 2022 |
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Designed by | AMD |
Manufactured by | Lotes, Foxconn |
Type | LGA-ZIF |
Chip form factors | Flip-chip |
Contacts | 1718 |
FSB protocol | PCI Express, Infinity Fabric |
Voltage range | 0.8V (cores) 1.05V (in-package I/O die) |
Processor dimensions | 40mm × 40mm 1,600mm2 |
Processors | Ryzen: Epyc:
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Predecessor | AM4 |
Memory support | DDR5 |
This article is part of the CPU socket series |
Socket AM5 (LGA 1718) is a zero insertion force flip-chip land grid array (LGA) [1] CPU socket designed by AMD that is used for AMD Ryzen microprocessors starting with the Zen 4 microarchitecture. [2] [3] AM5 was launched in September 2022 and is the successor to AM4. [4]
The Ryzen 7000 series processors were the first AM5 processors. The 7000 series added support for PCI Express 5.0 and DDR5. [5]
In March 2017, with the launch of its new Zen processors, AMD used the AM4 socket that they had previously used with their Bristol Ridge (derived from Excavator) powered Athlon X4 and some A-Series, a pin grid array (PGA) socket that they promised to support until 2020. [6]
At CES 2022, AMD CEO Lisa Su unveiled the AM5 socket and the integrated heat spreader design for the upcoming Ryzen 7000 processors due in late 2022.
On May 23, 2022, AMD provided details about the AM5 socket, its corresponding motherboards, and Ryzen 7000 Series CPUs at Computex in Taipei, Taiwan. [7] At Computex, motherboard vendors ASRock, Gigabyte and others debuted their new X670 motherboards featuring the AM5 socket. [8] [9]
AMD stated that it plans to support the AM5 socket for a number of years as it did with the AM4 socket. [10] During the Ryzen 7000 series reveal on August 29, 2022, AMD confirmed that it would support the AM5 socket until at least 2025. [11] At Computex 2024, AMD announced that this support period would then be extended through 2027. [12]
The AM5 socket specifies the 4 holes for fastening the heatsink to the motherboard to be placed at the corners of a rectangle with a lateral length of 54×90 mm, as well as UNC #6-32 screw threads for the backplate, identical to those of the preceding AM4 socket. Furthermore, the Z-height of the CPU package is kept the same as that of AM4, for backward compatibility of heatsinks. [16]
Unlike AM4, the backplate on AM5 is not removable, as it also serves the purpose of securing the CPU retention mechanism for the LGA socket. [17]
Not all existing CPU coolers from AM4 are compatible. In particular, coolers that use their own backplate mounting hardware, instead of the default motherboard-provided backplate, will not work. Some cooler manufacturers are offering upgrade kits to allow incompatible older coolers to be used on AM5. [18] [19]
The AM5 chipsets line-up had been criticised for being confusing [20] due to chipsets with very similar prefixes (and tens-digit-place designation) having very different meanings between 600 and 800 series. (e.g. X670 and X870 would be considered having very similar names, based on naming of previous chipset generations, but X870 is mostly identical to B650E (not X670) in terms of architecture and features provided by the cheapest itself) Following highlight some of the differences, refer to the feature table for full comparison.
The AM5 600 series chipsets were released alongside the release of Ryzen 7000 series desktop CPUs.
X670/X670E uses 2 "Promontory 21" silicon by ASMedia. One of which connected to the CPU, and the second one daisy chained to the first one.
The AM5 800 series chipsets were released roughly around or after the Ryzen 9000 series desktop CPUs' launch.
X870E also daisy chained 2 "Promontory 21" silicon as X670/X670E. (Note that is not the case for X870 despite the name)
Branding | ||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|
A620 / A620A | B650 | B650E | X670 | X670E | B840 | B850 | X870 | X870E | ||||
Processor features support | CPU support | Zen 4 | Yes | |||||||||
Zen 5 | Yes [a] | Yes | ||||||||||
CPU overclocking | No | Yes | No | Yes | ||||||||
PCIe 5.0 support [b] | x16 slot | No | No | Yes | No | Yes | No | No | Yes | |||
M.2 slot [c] + 4× GPP [d] | No | M.2: Optional | Yes | No | M.2: Yes | Yes | ||||||
GPP: No | GPP: No | |||||||||||
USB ports | USB 3.2 Gen 2x1 | 4 | ||||||||||
Chipset features | PCIe lanes [e] | Gen 4 | None | ×8 | ×12 | None | ×8 | ×12 | ||||
Gen 3 | Up to ×8 | Up to ×4 | Up to ×8 | Up to ×10 | Up to x4 | Up to ×8 | ||||||
USB ports | USB 2.0 | 6 | 12 | 6 | 12 | |||||||
USB 3.2 Gen 1x1 (5 Gb/s) | 2 | None | 2 | None | ||||||||
USB 3.2 Gen 2x1 (10 Gb/s) | 2 | with max x2 ports: 4 without x2 ports: 6 [f] | with max x2 ports: 8 without x2 ports: 12 [g] | 2 | with max x2 ports: 4 without x2 ports: 6 [f] | with max x2 ports: 8 without x2 ports: 12 [g] | ||||||
USB 3.2 Gen 2x2 (20 Gb/s) | None | Up to 1 [f] | Up to 2 [g] | None | Up to 1 [f] | Up to 2 [g] | ||||||
Storage features | SATA III ports | Up to 4 | Up to 8 | Up to 4 | Up to 8 | |||||||
RAID | 0, 1, 10 | |||||||||||
Platform features | USB4 Gen 3×2 (40 Gb/s) [h] | Optional | Yes | |||||||||
Wi-Fi [h] | Optional [i] | |||||||||||
PCIe x16 slot configurations | 1×16 | 1×16 or 2×8 | 1×16 | 1×16 or 2×8 | ||||||||
Multi-GPU | CrossFire | No | Yes | Yes | Yes | Yes | No | Yes | Yes | |||
SLI | No | No | No | No | No | No | No | No | No | |||
Chipset links | To CPU | PCIe 4.0 ×4 | ||||||||||
Interchipset | — | PCIe 4.0 ×4 | — | PCIe 4.0 ×4 | ||||||||
Chipset TDP | ~4.5 W | ~7 W | ~14 W [j] | ~7 W | ~14 W [j] | |||||||
Architecture | Promontory 22 / 21 x1 (A620) [21] Promontory 19 x1 (A620A) [22] | Promontory 21 ×1 | Promontory 21 ×2 | Promontory 21 ×1 | Promontory 21 ×2 | |||||||
Release date | Mar 31, 2023 | Oct 10, 2022 | Sep 27, 2022 | Jan 6, 2025 | Sep 2024 | |||||||
References | [23] [20] [24] [25] | [23] [20] [26] [27] [28] | [23] [20] | [23] [20] [29] [30] [31] |