Release date | September 27, 2022 |
---|---|
Designed by | AMD |
Manufactured by | Lotes |
Type | LGA-ZIF |
Chip form factors | Flip-chip |
Contacts | 1718 |
FSB protocol | PCI Express, Infinity Fabric |
Voltage range | 0.8V (cores) 1.05V (in-package I/O die) |
Processor dimensions | 40mm × 40mm 1,600mm2 |
Processors | Ryzen: Epyc:
|
Predecessor | AM4 |
Memory support | DDR5 |
This article is part of the CPU socket series |
Socket AM5 (LGA 1718) is a zero insertion force flip-chip land grid array (LGA) [1] CPU socket designed by AMD that is used for AMD Ryzen microprocessors starting with the Zen 4 microarchitecture. [2] [3] AM5 was launched in September 2022 and is the successor to AM4. [4]
The Ryzen 7000 series processors were the first AM5 processors. The 7000 series added support for PCI Express 5.0 and DDR5. [5]
In March 2017, with the launch of its new Zen processors, AMD used the AM4 socket that they had previously used with their Bristol Ridge (derived from Excavator) powered Athlon X4 and some A-Series, a pin grid array (PGA) socket that they promised to support until 2020. [6]
At CES 2022, AMD CEO Lisa Su unveiled the AM5 socket and the integrated heat spreader design for the upcoming Ryzen 7000 processors due in late 2022.
On May 23, 2022, AMD provided details about the AM5 socket, its corresponding motherboards, and Ryzen 7000 Series CPUs at Computex in Taipei, Taiwan. [7] At Computex, motherboard vendors ASRock, Gigabyte and others debuted their new X670 motherboards featuring the AM5 socket. [8] [9]
AMD stated that it plans to support the AM5 socket for a number of years as it did with the AM4 socket. [10] During the Ryzen 7000 series reveal on August 29, 2022, AMD confirmed that it would support the AM5 socket until at least 2025. [11] At Computex 2024, AMD announced that this support period would then be extended through 2027. [12]
The AM5 socket specifies the 4 holes for fastening the heatsink to the motherboard to be placed in the corners of a rectangle with a lateral length of 54×90 mm, as well as UNC #6-32 screw threads for the backplate, identical to those of the preceding AM4 socket. Furthermore, the Z-height of the CPU package is kept the same as that of AM4, for backward compatibility of heatsinks. [16]
Unlike AM4, the backplate on AM5 is not removable, as it also serves the purpose of securing the CPU retention mechanism for the LGA socket. [17]
Not all existing CPU coolers from AM4 are compatible. In particular, coolers that use their own backplate mounting hardware, instead of the default motherboard-provided backplate, will not work. Some cooler manufacturers are offering upgrade kits to allow incompatible older coolers to be used on AM5. [18] [19]
Branding | |||||||||
---|---|---|---|---|---|---|---|---|---|
A620 | B650 | B650E | X670 | X670E | X870 | X870E | |||
Platform features | PCIe 5.0 support [lower-alpha 1] | x16 slot | No | No | Yes | No | Yes | Yes | Yes |
M.2 slot + 4× GPP | No | M.2 Optional | Yes | Yes | Yes | Yes | Yes | ||
x16 slot configurations | 1×16 | 1×16 or 2×8 | |||||||
Multi-GPU | CrossFire | No | Yes | Yes | Yes | Yes | Yes | Yes | |
SLI | No | No | No | No | No | No | No | ||
USB4 Gen 3×2 (40 Gb/s) [lower-alpha 2] | Optional | Optional | Optional | Optional | Optional | Yes | Yes | ||
Wi-Fi version [lower-alpha 2] [lower-alpha 3] | 6 | 7 | |||||||
Processor overclocking | No | Yes | Yes | Yes | Yes | Yes | Yes | ||
Chipset specifications | PCIe lanes [lower-alpha 4] | Gen 4 | None | ×8 | ×12 | ×8 | ×12 | ||
Gen 3 | Up to ×8 | Up to ×4 | Up to ×8 | Up to ×4 | Up to ×8 | ||||
USB support | USB 2.0 | 6 | 12 | 6 | 12 | ||||
USB 3.2 Gen 1x1 (5 Gb/s) | 2 | None | |||||||
USB 3.2 Gen 2x1 (10 Gb/s) | 2 | 4 | 8 | 4 | 8 | ||||
USB 3.2 Gen 2x2 (20 Gb/s) | None | 1 [lower-alpha 5] | 2 [lower-alpha 6] | 1 [lower-alpha 5] | 2 [lower-alpha 6] | ||||
Storage features | SATA III ports | Up to 4 | Up to 8 | Up to 4 | Up to 8 | ||||
RAID | 0, 1, 10 | ||||||||
Chipset TDP | ~4.5 W | ~7 W | ~14 W [lower-alpha 7] | ~7 W | ~14 W [lower-alpha 7] | ||||
Architecture | Promontory 21 ×1 | Promontory 21 ×2 | Promontory 21 ×1 | Promontory 21 ×2 | |||||
Chipset links | To CPU | PCIe 4.0 ×4 | |||||||
Interchipset | — | PCIe 4.0 ×4 | — | PCIe 4.0 ×4 | |||||
CPU support | Zen 4 | Yes | |||||||
Zen 5 | Yes | ||||||||
Release date | Mar 31, 2023 | Oct 10, 2022 | Sep 27, 2022 | Sep 2024 | |||||
Reference(s) | [20] [21] [22] | [20] [23] [24] | [20] [25] [26] [27] |
AMD Accelerated Processing Unit (APU), formerly known as Fusion, is a series of 64-bit microprocessors from Advanced Micro Devices (AMD), combining a general-purpose AMD64 central processing unit (CPU) and 3D integrated graphics processing unit (IGPU) on a single die.
AMD Generic Encapsulated Software Architecture (AGESA) is a procedure library developed by Advanced Micro Devices (AMD), used to perform the Platform Initialization (PI) on mainboards using their AMD64 architecture. As part of the BIOS of such mainboards, AGESA is responsible for the initialization of the CPU cores, chipset, main memory, and the HyperTransport controller.
Socket AM4 is a PGA microprocessor socket used by AMD's central processing units (CPUs) built on the Zen and Excavator microarchitectures.
Zen 2 is a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nm MOSFET node from TSMC. The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips, Ryzen 4000U/H and Ryzen 5000U for mobile applications, as Threadripper 3000 for high-end desktop systems, and as Ryzen 4000G for accelerated processing units (APUs). The Ryzen 3000 series CPUs were released on 7 July 2019, while the Zen 2-based Epyc server CPUs were released on 7 August 2019. An additional chip, the Ryzen 9 3950X, was released in November 2019.
Ryzen is a brand of multi-core x86-64 microprocessors designed and marketed by Advanced Micro Devices (AMD) for desktop, mobile, server, and embedded platforms based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream, enthusiast, server, and workstation segments and accelerated processing units (APUs) marketed for mainstream and entry-level segments and embedded systems applications.
Zen+ is the name for a computer processor microarchitecture by AMD. It is the successor to the first gen Zen microarchitecture, and was first released in April 2018, powering the second generation of Ryzen processors, known as Ryzen 2000 for mainstream desktop systems, Threadripper 2000 for high-end desktop setups and Ryzen 3000G for accelerated processing units (APUs).
Epyc is a brand of multi-core x86-64 microprocessors designed and sold by AMD, based on the company's Zen microarchitecture. Introduced in June 2017, they are specifically targeted for the server and embedded system markets.
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Socket TR4, also known as Socket SP3r2, is a zero insertion force land grid array (LGA) CPU socket designed by AMD supporting its first- and second-generation Zen-based Ryzen Threadripper desktop processors, launched on August 10, 2017 for the high-end desktop and workstation platforms. It was succeeded by Socket sTRX4 for the third generation of Ryzen Threadripper processors.
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Zen 5 is the name for a CPU microarchitecture by AMD, shown on their roadmap in May 2022, launched for mobile in July 2024 and for desktop in August 2024. It is the successor to Zen 4 and is currently fabricated on TSMC's N4X process. Zen 5 is also planned to be fabricated on the N3E process in the future.
Socket sTRX4, also known as Socket SP3r3, is a land grid array (LGA) CPU socket designed by AMD supporting its Zen 2-based third-generation Ryzen Threadripper desktop processors, launched on November 25, 2019 for the high-end desktop and workstation platforms.
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