This is an overview of chipsets sold under the AMD brand, manufactured before May 2004 by the company itself, before the adoption of open platform approach as well as chipsets manufactured by ATI Technologies after October 2006 as the completion of the ATI acquisition.
Model | Code name | Released | CPU support | Fab (nm) | FSB/HT (MHz) | Southbridge | Features / Notes |
---|---|---|---|---|---|---|---|
AMD-640 chipset | AMD-640 | 1997 | K6, | ? | 66 (FSB) | AMD-645 | AMD licensed VIA Technologies' Apollo VP2/97 |
AMD-750 chipset | AMD-751 | 1999 | Athlon, Duron | 100 (FSB) | AMD-756, VIA-VT82C686A | AGP 2×, SDRAM Irongate chipset family; early steppings had issues with AGP 2×; drivers often limited support to AGP 1×; later fixed with "super bypass" memory access adjustment. [1] | |
AMD-760 chipset | AMD-761 | Nov 2000 | Athlon, Athlon XP, Duron | 133 (FSB) | AMD-766, VIA-T82C686B | AGP 4×, DDR SDRAM | |
AMD-760MP chipset | AMD-762 | May 2001 | Athlon MP | AMD-766 | AGP 4× | ||
AMD-760MPX chipset | AMD-768 | AGP 4×, Hardware RNG Most initial boards shipped without USB headers due to a fault with the integrated USB controller. Manufacturers included PCI USB cards to cover this shortcoming. A later refresh of the chipset had the USB problem remedied. [2] | |||||
AMD-8000 series chipset | AMD-8111 | Apr 2004 | Opteron | 800 (HT 1.x) | AMD-8131 AMD-8132 | Hardware RNG |
A-Link Express and A-Link Express II are essentially PCIe 1.1 x4 lanes.
See Comparison of ATI Chipsets for the comparison of chipsets sold under the ATI brand for AMD processors, before AMD's acquisition of ATI.
Model | Codename | Released | CPU support | Fab (nm) | HT (MHz) | IGP | CrossFire | Southbridge | Features / Notes |
---|---|---|---|---|---|---|---|---|---|
AMD 480X chipset (originally CrossFire Xpress 1600) | RD480 | Oct 2006 | Athlon 64, Sempron | 110 | 1000 (HT 2.0) | No | x8 + x8 | SB600, ULi-M1575 | ? |
AMD 570X/550X chipset (originally CrossFire Xpress 3100) | RD570 | Jun 2007 | Phenom, [3] Athlon 64, Sempron | ? | No | x16 + x8 | SB600 | ||
AMD 580X chipset (originally CrossFire Xpress 3200) | RD580 | Oct 2006 | x16 + x16 | ||||||
AMD 690V chipset | RS690C | Feb 2007 | Athlon 64, Sempron | 80 | 1000 (HT 2.0) | Radeon X1200 (350MHz) | No | SB600 | DirectX 9.0, AVIVO, HDMI/HDCP, no LVDS |
AMD 690G chipset | RS690 | Phenom, Athlon 64, Sempron | Radeon X1250 (400MHz) | DirectX 9.0, AVIVO, HDMI/HDCP | |||||
AMD M690V chipset | RS690MC | Turion 64 X2, Athlon 64 X2 mobile | 800 (HT 2.0) | Radeon X1200 (350 MHz) | No | DirectX 9.0, AVIVO, DVI, HDMI/HDCP, no LVDS, Powerplay 7.0 | |||
AMD M690 chipset | RS690M | Radeon X1250 (350 MHz) | DirectX 9.0, AVIVO, DVI/HDCP, no HDMI, Powerplay 7.0 | ||||||
AMD M690E chipset | RS690T | Athlon Neo, Mobile Sempron | Radeon X1250 (350Mhz) | No | DirectX 9.0, AVIVO, 2× HDMI/HDCP, Powerplay 7.0 | ||||
AMD M690T chipset | Turion 64 X2, Athlon 64 X2 mobile | Radeon X1270 (400Mhz) | DirectX 9.0, AVIVO, HDMI/HDCP, Powerplay 7.0 | ||||||
AMD 740 chipset | RX740 | 2008 | Athlon 64, Phenom, Sempron | 55 | 1000 (HT 2.0) | No | No | SB600, SB700, SB750 | Single PCIe 1.1 x16 |
AMD 740G chipset | RS740 | Radeon 2100 | DirectX 9.0, AVIVO, HDMI/HDCP, OR single PCIe 1.1 x16 | ||||||
AMD 760G chipset | RS780L | 2009 | 2600 (HT 3.0) | Radeon 3000 | Hybrid | SB710 | DirectX 10, AVIVO HD, HDMI/HDCP, OR single PCIe 2.0 x16 | ||
AMD 770 chipset | RX780 | 2008 | 65 | No | No | SB600, SB700, SB710, SB750 | Single PCIe 2.0 x16 | ||
AMD 780V chipset | RS780C | 55 | Radeon 3100 | No | SB700, SB710, SB750 | DirectX 10, AVIVO HD, HDMI/HDCP, DisplayPort/DPCP, OR single PCIe 2.0 x16 | |||
AMD 780G chipset | RS780I | Radeon HD 3200 | Hybrid | DirectX 10, UVD+, HDMI/HDCP, DisplayPort/DPCP, Side-port memory, OR single PCIe 2.0 x16 | |||||
AMD M780V chipset | RS780MC | Mobile Turion, Mobile Athlon, Athlon Neo | Radeon 3100 | PowerXpress AXIOM/MXM module(s) | SB600, SB700, SB710 | DirectX 10, UVD+, HDMI/HDCP, DisplayPort, DVI, VGA, OR single PCIe 2.0 x16 | |||
AMD M780G chipset | RS780M | Radeon HD 3200 | |||||||
AMD 785G chipset | RS880 | 2009 | Athlon 64, Phenom, Sempron | Radeon HD 4200 | Hybrid, x16 + x4 | SB710, SB750, SB810, SB850 | DirectX 10.1, UVD2, Side-port memory, HDMI/HDCP, DisplayPort/DPCP, OR two PCIe 2.0 x16 TDP: 11 W (500 MHz), 3 W in PowerPlay | ||
785E | RS785E | ? | 2200 (HT 3.0) | Radeon HD 4200 | Hybrid | SB810, SB850, SB820M | |||
AMD 790GX chipset | RS780D | 2008 | Athlon 64, Phenom, Sempron | 2600 (HT 3.0) | Radeon HD 3300 | Hybrid, x8 + x8 [4] | SB750 | DirectX 10, UVD+, Side-port memory, HDMI/HDCP, DisplayPort/DPCP, OR two PCIe 2.0 x16 | |
AMD 790X chipset | RD780 | 65 | No | x8 + x8 | SB600, SB700, SB750, SB850 | Two PCIe 2.0 x16 | |||
AMD 790FX chipset | RD790 | Nov 2007 | No | CrossFire X (dual x16 or quad x8) | SB600, SB750, SB850 | Up to four PCIe 2.0 x16 Support for AMD Quad FX platform (FASN8), Dual socket enthusiast platform with NUMA, optional single socket variant, 720-pin 1.1 V FC-BGA | |||
Model | Codename | Released | CPU support | Fab (nm) | HT (MHz) | IGP | CrossFire | Southbridge | Features / Notes |
A-Link Express III is essentially PCIe 2.0 x4 lanes.
Model | Code name | Released | CPU support | Fab (nm) | HT (MHz) | AMD-V (Hardware Virtualization) | IGP | CrossFire | SLI [5] | TDP (W) | Southbridge | Features / Notes |
---|---|---|---|---|---|---|---|---|---|---|---|---|
AMD 870 chipset | RX880 | 2010 | Phenom II, Athlon 64, Sempron | 65 | 2600 (HT 3.0) | ? | No | Hybrid, x16 + x4 | No | ? | SB850 | Single PCIe 2.0 x16 |
AMD 880G chipset | RS880P | Q4 2010 | Phenom II, Athlon II, Sempron | 55 | ? | Radeon HD 4250 | Hybrid | No | SB710, SB750, SB810, SB850, SB920, SB950 | DirectX 10.1, UVD2, HDMI/HDCP, DisplayPort/DPCP, OR single PCIe 2.0 x16 AM3+ socket support | ||
AMD 880M chipset | RS880M | Q2 2010 | Mobile Turion II, Mobile Athlon II, Mobile Sempron | ? | Radeon HD 4200 | PowerXpress AXIOM/MXM module(s) | No | SB820 | DirectX 10.1, UVD2, HDMI/HDCP, DisplayPort, DVI, VGA, sideport memory, OR single PCI-E 2.0 x16 Mobile Chipset, Tigris platform | |||
AMD 880M chipset | Athlon II Neo, Turion II Neo | Radeon HD 4225 | No | DirectX 10.1, UVD2, HDMI/HDCP, DisplayPort, DVI, VGA, OR Single PCI-E 2.0 x16 Mobile Chipset, Nile platform | ||||||||
AMD 880M chipset | Mobile Phenom II, Mobile Turion II, Mobile Athlon II, Mobile Sempron V-Series | Radeon HD 4250 Radeon HD 4270 | No | DirectX 10.1, UVD2, HDMI/HDCP, DisplayPort, DVI, VGA, OR single PCI-E 2.0 x16 Mobile Chipset, Danube platform | ||||||||
AMD 890GX chipset | RS880D | Phenom II, Athlon II, Sempron | ? | Radeon HD 4290 | Hybrid, x8 + x8 | No | 22 | SB710, SB750, SB810, SB850 | DirectX 10.1, UVD2, HDMI/HDCP, DisplayPort/DPCP, Side-port memory, OR two PCIe 2.0 x16 | |||
AMD 890FX chipset | RD890 | Bulldozer, [6] Phenom II, Athlon II, Sempron | 65 | Yes [7] | No | x16 + x16 or x8 quad | No | 18 | SB710, SB750, SB810, SB850 | Four PCIe 2.0 x16 | ||
AMD 970 chipset | RX980 | Q2 2011 | Bulldozer, Piledriver Phenom II, Athlon II, Sempron, FX | 65 | 2400 (HT 3.0) | Yes [8] | No | x16 + x4 | No | 13.6 | SB710, SB750, SB810, SB850, SB920, SB950 | Single PCIe 2.0 x16, IOMMU AM3+ socket support |
AMD 990X chipset | RD980 | 2600 (HT 3.0) | x8 + x8 | x8 + x8 | 14 | Two PCIe 2.0 x16, IOMMU AM3+ socket support | ||||||
AMD 990FX chipset | RD990 | x16 + x16 or x8 quad | x16 + x16 or x16 + x8 + x8 or x8 quad | 19.6 | Four PCIe 2.0 x16, IOMMU AM3+ socket support | |||||||
Model | Code name | Released | CPU support | Fab (nm) | HT (MHz) | AMD-V (Hardware Virtualization) | IGP | CrossFire | SLI | TDP (W) | Southbridge | Features / Notes |
Model | Codename | Released | Fab (nm) | USB 2.0 + 1.1 | Audio | Parallel ATA 1 | Features / Notes |
---|---|---|---|---|---|---|---|
AMD 640 chipset | AMD-645 | 1997 | 2 × ATA/33 | ||||
AMD 750 chipset | AMD-756 | 1999 | 0 + 4 | 2 × ATA/66 | |||
AMD 760 chipset | AMD-766 | 2001 | 2 × ATA/100 | ||||
AMD 760MPX chipset | AMD-768 | AC'97 | |||||
Geode GX1 | Geode CS5530 | AC'97 | 2 × ATA/33 | National Semiconductor release | |||
Geode GXm Geode GXLV | Geode CS5530A | ||||||
Geode GX | Geode CS5535 | 0 + 4 | 2 × ATA/66 | ||||
Geode LX | Geode CS5536 | 4 + 0 | 2 × ATA/100 | ||||
AMD-8111 nForce Professional ULi-1563 | AMD-8131 | 2004 | 4 + 2 | AC'97 | 2 × ATA/133 | PCI-X | |
AMD-8132 | PCI-X 2.0 | ||||||
AMD-8151 | AMD-8151 | AGP 8X |
1 Parallel ATA, also known as Enhanced IDE supports up to 2 devices per channel.
Model | Codename | Released | Fab (nm) | SATA | USB 2.0 + 1.1 | Parallel ATA 1 | RAID | NIC | Package | TDP (W) | Features / Notes |
---|---|---|---|---|---|---|---|---|---|---|---|
AMD 480/570/580/690 CrossFire Chipset | SB600 | 2006 | 130 | 4 × 3 Gbit/s AHCI 1.1 SATA Revision 2.0 | 10 + 0 | 1 × ATA/133 | 0,1,10 | No | 548-pin FC-BGA | 4.0 | |
AMD 700 chipset series | SB700 | Q1 2008 | 6 × 3 Gbit/s AHCI 1.1 SATA Revision 2.0 | 12 + 2 | 1 × ATA/133 | No | 4.5 | DASH 1.0 | |||
SB700S | DASH 1.0 Server southbridge | ||||||||||
SB710 | Q4 2008 | DASH 1.0 | |||||||||
SB750 | 0,1,5,10 | ||||||||||
AMD 800 chipset series | SB810 | Q1 2010 | 65 | 6 × 3 Gbit/s AHCI 1.2 SATA Revision 2.0 | 14 + 2 | No | 0,1,10 | 10/100/1000 | 605-pin FC-BGA | 6.0 | |
SB850 | 6 × 6 Gbit/s AHCI 1.2 SATA Revision 3.0 | 0,1,5,10 | |||||||||
SB820M | 0,1 | 3.4 - 5.3 | mobile/embedded | ||||||||
AMD 900 chipset series | SB920 | May 30, 2011 | 6 × 6 Gbit/s AHCI 1.2 SATA Revision 3.0 | No | 0,1,10 | 10/100/1000 | 6.0 | ||||
SB950 | 0,1,5,10 | ||||||||||
Model | Codename | Released | Fab (nm) | SATA | USB 2.0 + 1.1 | Parallel ATA1 | RAID | NIC | Package | TDP (W) | Features / Notes |
1 Parallel ATA, also known as Enhanced IDE supports up to 2 devices per channel.
For AMD APU models from 2011 until 2016. AMD marketed their chipsets as Fusion Controller Hubs (FCH), implementing it across their product range in 2017 alongside the release of the Zen architecture. Before then, only APUs used FCHs, while their other CPUs still used a northbridge and southbridge. The Fusion Controller Hubs are similar in function to Intel's Platform Controller Hub.
AMD's FCH has been discontinued since the release of the Carrizo series of CPUs as it has been integrated into the same die as the rest of the CPU. [9] However, since the release of the Zen architecture, there's still a component called a chipset which only handles relatively low speed I/O such as USB and SATA ports and connects to the CPU with a PCIe connection. In these systems all PCIe connections are routed directly to the CPU. [10] The UMI interface previously used by AMD for communicating with the FCH is replaced with a PCIe connection. Technically the processor can operate without a chipset; it only continues to be present for interfacing with low speed I/O. AMD server CPUs adopt a self contained system on chip design instead which doesn't require a chipset. [11] [12] [13] [14]
Model | Codename | UMI | SATA | USB 3.0+2.0+1.1 | RAID | NIC | 33 MHz PCI | SD [S 1] | VGA DAC | TDP (W) | Features / notes | Part number |
---|---|---|---|---|---|---|---|---|---|---|---|---|
Mobile | ||||||||||||
A55T | Hudson-M2T [N 1] | ×2 Gen 1 | 1× 3 Gbit/s AHCI 1.1 | 0 + 8 + 0 | No | No | No | SDIO | No | |||
A50M | Hudson-M1 [N 1] | ×4 Gen 1 [M 1] | 6× 6 Gbit/s AHCI 1.2 | 0 + 14 + 2 | No | 5.9 [15] | ~920 mW idle | 100-CG2198 [15] | ||||
A60M | Hudson-M2 [N 1] | ×4 Gen 1 +DP | 0,1 | 10/100/1000 | Yes | Yes | 4.7 | |||||
A68M | Hudson-M3L [N 1] | 2× 6 Gbit/s AHCI 1.2 | 2 + 8 + 0 | No | ~750 mW idle | 218-0792006 | ||||||
A70M | Hudson-M3 [N 1] | 6× 6 Gbit/s AHCI 1.2 | 4 + 10 + 2 | Yes | First native USB 3.0 controller [16] | 100-CG2389 [15] | ||||||
A76M | Bolton-M3 [N 1] | 218-0844012 | ||||||||||
Desktop | ||||||||||||
A45 | Hudson-D1 [N 2] | ×4 Gen. 2 [M 2] | 6× 3 Gbit/s AHCI 1.1 | 0 + 14 + 2 | No | No | Up to 4 slots | No | No | 218-0792008 | ||
A55 | Hudson-D2 [N 2] | ×4 Gen 2 +DP | 0,1,10 | 10/100/1000 | Up to 3 slots | Yes | Yes | 7.6 | ||||
A58 | Bolton-D2 [N 2] | ×4 Gen 2 | 6× 3 Gbit/s AHCI 1.3 | 218-0844023 | ||||||||
A68H | Bolton-D2H [N 2] | 4× 6 Gbit/s AHCI 1.3 | 2 + 10 + 2 | xHCI 1.0 | 218-0844029-00 | |||||||
A75 | Hudson-D3 [N 2] | ×4 Gen 2 +DP | 6× 6 Gbit/s AHCI 1.2 | 4 + 10 + 2 | 10/100/1000 | 7.8 [15] | First native USB 3.0 controller [16] | 100-CG2386 [15] | ||||
A78 | Bolton-D3 [N 2] | 6× 6 Gbit/s AHCI 1.3 | 7.8 | xHCI 1.0 | 218-0844014 | |||||||
A85X | Hudson-D4 [N 2] | 8× 6 Gbit/s AHCI 1.2 | 0,1,5,10 | 10/100/1000 | USB 3.0 (xHCI 0.96) | 218-0755117 | ||||||
A88X | Bolton-D4 [N 2] | ×4 Gen 2 | 8× 6 Gbit/s AHCI 1.3 | USB 3.0 (xHCI 1.0) | 218-0844016 | |||||||
Embedded | ||||||||||||
A55E | Hudson-E1 [N 3] | ×4 Gen 2 | 6× 6 Gbit/s AHCI 1.2 | 0 + 14 + 2 | 0,1,5,10 | 10/100/1000 | Up to 4 slots | No | No | 5.9 [15] | 100-CG2293 [15] | |
A77E [17] | Bolton-E4 [N 3] | 1-, 2-, or 4-lane 2 or 5 GB/s | 6× 6 Gbit/s AHCI 1.3 | 4 + 10 + 2 | Up to 3 slots | Yes | Yes | 4-lane PCIe 2.0 | 218-0844020-00 | |||
Model | Codename | UMI | SATA | USB 3.0+2.0+1.1 | RAID | NIC | 33 MHz PCI | SD [S 1] | VGA DAC | TDP (W) | Features / notes | Part number |
Secure Digital:
Codename:
UMI:
There are currently 3 generations of AM4-based chipsets on the market. Models beginning with the numeral "3" are representatives of the first generation, those with "4" the second generation, etc.
In addition to their traditional chipsets, AMD offers chipsets with "processor-direct access", exclusively through OEM partners. [18] Enthusiast publication igor'sLAB obtained leaked documents about an AMD "Knoll Activator" that enables "activating... processor I/O and processor features in the absence of an alternative AMD chipset." It is concluded that motherboards with the Knoll Activator would be built with I/O from the processor and low-cost I/O chips. [19]
Individual chipset models differ in the number of PCI Express lanes, USB ports, and SATA connectors, as well as supported technologies; the table below shows these differences. [20] [21]
Model | Release date | PCIe support [lower-alpha 1] | Multi-GPU | USB support [lower-alpha 2] | Storage features | Processor overclocking | TDP | CPU support | Architecture | Part number | |||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CrossFire | SLI | SATA ports | RAID | AMD StoreMI | Excavator | Zen | Zen+ | Zen 2 | Zen 3 | ||||||||
A300 | Feb 2017 | None | Untested | None | None | Yes [22] | No [23] | No | ~120 μW [lower-alpha 3] | No | Yes [24] [25] | Knoll Express [26] | 100-CG2978 218-0892000 KNOLL1 | ||||
X300 | Yes | Yes [27] | unknown | ||||||||||||||
Pro 500 | Jan 2020 [28] | Unknown | No | Partial [lower-alpha 4] | 218-0891003 unreleased | ||||||||||||
A320 | Feb 2017 [29] [30] | PCIe 2.0 ×4 | No | No | 1, 2, 6 | 4 | 0, 1, 10 | No | Limited [lower-alpha 5] | ~5.8 W [31] | Yes | Yes | Yes | Varies [lower-alpha 6] | Promontory | 218-0891004 | |
B350 | PCIe 2.0 ×6 | Yes | 2, 2, 6 | Yes | 218-0891005 | ||||||||||||
X370 | PCIe 2.0 ×8 | Yes | 2, 6, 6 | 8 | 218-0891006 | ||||||||||||
B450 | Mar 2018 [32] | PCIe 2.0 ×6 | No | 2, 2, 6 | 4 | Yes | Yes, with PBO | Varies [lower-alpha 7] | Yes | Varies [lower-alpha 7] [33] | 218-0891011 | ||||||
X470 | PCIe 2.0 ×8 | Yes | 2, 6, 6 | 8 | 218-0891008 | ||||||||||||
A520 | Aug 2020 [34] | PCIe 3.0 ×6 | No | 1, 2, 6 | 4 | No | Varies | 218-0891015 | |||||||||
B550 [lower-alpha 8] | Jun 2020 [35] [36] | PCIe 3.0 ×10 | Yes | Varies | 2, 2, 6 | 6 | Yes, with PBO | ~7W | 218-0891014 - b550, 218-0891009 - B550A | ||||||||
X570 | Jul 2019 [37] [38] | PCIe 4.0 ×16 | Yes | 8, 0, 4 | 12 | ~15 W [39] [40] [lower-alpha 9] | No | Yes | Yes | Bixby | 100-CG3091 |
The 300 series, 400 series, and the B550 chipsets are designed in collaboration with ASMedia and the family is codenamed Promontory. [41] The X570 is designed by AMD with IP licensed from ASMedia and other companies and is codenamed Bixby. [42] Network interface controller, Wi-Fi, and Bluetooth are provided by external chips connected to the chipset through PCIe or USB. All 300 series chipsets are made using 55 nm lithography. [43] The X570 chipset is a repurposed Matisse/Vermeer IO die made using a 14 nm process. [44]
Supports both 1st and 2nd generation AMD Ryzen Threadripper processors. [45]
Model | CPU PCIe Link | PCIe support | Multi-GPU support | SATA + SATA Express | USB 3.1 Gen 2 + 3.1 Gen 1 + 2.0 | RAID | Overclocking | TDP | Chipset lithography | |
---|---|---|---|---|---|---|---|---|---|---|
CrossFire | SLI | |||||||||
X399 [46] [45] | ×4 | PCIe 2.0 ×8 | Yes | Yes | 4 + 2 | 2 + 14 + 6 | 0,1,10 | Yes | 5 W [47] | Unknown |
Supports 3rd generation AMD Ryzen Threadripper (3960X to 3990X) processors. [48]
Model | CPU PCIe Link | PCIe support | Multi-GPU support | SATA | USB 3.1 Gen 2 + 2.0 | RAID | Overclocking | TDP | Chipset lithography | Notes | |
---|---|---|---|---|---|---|---|---|---|---|---|
CrossFire | SLI | ||||||||||
TRX40 [48] | ×8 | PCIe 4.0 ×8 | Yes | Yes | 4 (+ up to 2 × 4 extra) | 8 + 4 | 0,1,10 | Yes | 15 W [47] | 14 nm | HW-wise identical to X570[ citation needed ] |
Although the X399, TRX40 and WRX80 motherboards' CPU sockets use the same number of pins, the sockets are incompatible with each other due to ID pins and no-connects of some pins. Twelve TRX40 motherboards were released at launch in November 2019. The TRX40 chipset does not support the HD Audio interface on its own, so motherboard vendors must include a USB audio device or a PCIe audio device on TRX40 motherboards to integrate audio codecs. [47]
Supports 3rd (3900WX) and 4th generation (5900WX) AMD Ryzen Threadripper Pro processors. [49]
Model | CPU PCIe Link | PCIe support | Multi-GPU support | SATA | USB 3.1 Gen 2 + 2.0 | RAID | Overclocking | TDP | Chipset lithography | Notes | |
---|---|---|---|---|---|---|---|---|---|---|---|
CrossFire | SLI | ||||||||||
WRX80 | ×8 | PCIe 4.0 ×16 | Yes | Yes | 4 | 8 + 4 | 0,1,10 | Yes | 15 W | 14 nm | HW-wise identical to EPYC/Threadripper IO die[ citation needed ] |
Although the X399, TRX40 and WRX80 motherboards' CPU sockets use the same number of pins, the sockets are incompatible with each other due to ID pins and no-connects of some pins. [47] Three WRX80 motherboards were released at launch in March 2021. The WRX80 chipset does not support the HD Audio interface on its own, so motherboard vendors must include a USB audio device or a PCIe audio device on WRX80 motherboards to integrate audio codecs.
AMD uses a single Promontory 21 chipset for all configurations that include a chipset. A single Promontory 21 chip provides four SATA III ports and twelve PCIe 4.0 lanes. Four lanes are reserved for the chipset uplink to the CPU while another four are used to connect to another Promontory 21 chip in a daisy-chained topology for X670, X670E and X870E chipsets. [50]
Branding | |||||||||
---|---|---|---|---|---|---|---|---|---|
A620 | B650 | B650E | X670 | X670E | X870 | X870E | |||
Platform features | PCIe 5.0 support [lower-alpha 1] | x16 slot | No | No | Yes | No | Yes | Yes | Yes |
M.2 slot + 4× GPP | No | M.2 Optional | Yes | Yes | Yes | Yes | Yes | ||
x16 slot configurations | 1×16 | 1×16 or 2×8 | |||||||
Multi-GPU | CrossFire | No | Yes | Yes | Yes | Yes | Yes | Yes | |
SLI | No | No | No | No | No | No | No | ||
USB4 Gen 3×2 (40 Gb/s) [lower-alpha 2] | Optional | Optional | Optional | Optional | Optional | Yes | Yes | ||
Wi-Fi version [lower-alpha 2] [lower-alpha 3] | 6 | 7 | |||||||
Processor overclocking | No | Yes | Yes | Yes | Yes | Yes | Yes | ||
Chipset specifications | PCIe lanes [lower-alpha 4] | Gen 4 | None | ×8 | ×12 | ×8 | ×12 | ||
Gen 3 | Up to ×8 | Up to ×4 | Up to ×8 | Up to ×4 | Up to ×8 | ||||
USB support | USB 2.0 | 6 | 12 | 6 | 12 | ||||
USB 3.2 Gen 1x1 (5 Gb/s) | 2 | None | |||||||
USB 3.2 Gen 2x1 (10 Gb/s) | 2 | 4 | 8 | 4 | 8 | ||||
USB 3.2 Gen 2x2 (20 Gb/s) | None | 1 [lower-alpha 5] | 2 [lower-alpha 6] | 1 [lower-alpha 5] | 2 [lower-alpha 6] | ||||
Storage features | SATA III ports | Up to 4 | Up to 8 | Up to 4 | Up to 8 | ||||
RAID | 0, 1, 10 | ||||||||
Chipset TDP | ~4.5 W | ~7 W | ~14 W [lower-alpha 7] | ~7 W | ~14 W [lower-alpha 7] | ||||
Architecture | Promontory 21 ×1 | Promontory 21 ×2 | Promontory 21 ×1 | Promontory 21 ×2 | |||||
Chipset links | To CPU | PCIe 4.0 ×4 | |||||||
Interchipset | — | PCIe 4.0 ×4 | — | PCIe 4.0 ×4 | |||||
CPU support | Zen 4 | Yes | |||||||
Zen 5 | Yes | ||||||||
Release date | Mar 31, 2023 | Oct 10, 2022 | Sep 27, 2022 | Sep 2024 | |||||
Reference(s) | [51] [52] [53] | [51] [54] [55] | [51] [56] [57] [58] |
The sTR5 socket has two chipset options available, TRX50 and WRX90:
HD audio support is provided by the CPU, rather than by the chipset. [60]
Model | CPU PCIe Link | PCIe support | Multi-GPU support | SATA | USB 3.2 Gen 2x2 + 3.1 Gen 2 + 2.0 | RAID | Overclocking | TDP | Chipset lithography | Notes | |
---|---|---|---|---|---|---|---|---|---|---|---|
CrossFire | SLI | ||||||||||
TRX50 [61] | PCIe 4.0 ×8 | 4 | 1 + 4 + 4 | Yes | |||||||
WRX90 [60] [61] | ×4 |
In a computer system, a chipset is a set of electronic components on one or more integrated circuits that manages the data flow between the processor, memory and peripherals. The chipset is usually found on the motherboard of computers. Chipsets are usually designed to work with a specific family of microprocessors. Because it controls communications between the processor and external devices, the chipset plays a crucial role in determining system performance. Sometimes the term "chipset" is used to describe a system on chip (SoC) used in a mobile phone.
AMD Accelerated Processing Unit (APU), formerly known as Fusion, is a series of 64-bit microprocessors from Advanced Micro Devices (AMD), combining a general-purpose AMD64 central processing unit (CPU) and 3D integrated graphics processing unit (IGPU) on a single die.
The Platform Controller Hub (PCH) is a family of Intel's single-chip chipsets, first introduced in 2009. It is the successor to the Intel Hub Architecture, which used two chips–a northbridge and southbridge, and first appeared in the Intel 5 Series.
AMD Generic Encapsulated Software Architecture (AGESA) is a procedure library developed by Advanced Micro Devices (AMD), used to perform the Platform Initialization (PI) on mainboards using their AMD64 architecture. As part of the BIOS of such mainboards, AGESA is responsible for the initialization of the CPU cores, chipset, main memory, and the HyperTransport controller.
Zen is the first iteration in the Zen family of computer processor microarchitectures from AMD. It was first used with their Ryzen series of CPUs in February 2017. The first Zen-based preview system was demonstrated at E3 2016, and first substantially detailed at an event hosted a block away from the Intel Developer Forum 2016. The first Zen-based CPUs, codenamed "Summit Ridge", reached the market in early March 2017, Zen-derived Epyc server processors launched in June 2017 and Zen-based APUs arrived in November 2017.
Socket AM4 is a PGA microprocessor socket used by AMD's central processing units (CPUs) built on the Zen and Excavator microarchitectures.
Zen 2 is a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nm MOSFET node from TSMC. The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips, Ryzen 4000U/H and Ryzen 5000U for mobile applications, as Threadripper 3000 for high-end desktop systems, and as Ryzen 4000G for accelerated processing units (APUs). The Ryzen 3000 series CPUs were released on 7 July 2019, while the Zen 2-based Epyc server CPUs were released on 7 August 2019. An additional chip, the Ryzen 9 3950X, was released in November 2019.
Ryzen is a brand of multi-core x86-64 microprocessors designed and marketed by Advanced Micro Devices (AMD) for desktop, mobile, server, and embedded platforms based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream, enthusiast, server, and workstation segments and accelerated processing units (APUs) marketed for mainstream and entry-level segments and embedded systems applications.
Zen+ is the name for a computer processor microarchitecture by AMD. It is the successor to the first gen Zen microarchitecture, and was first released in April 2018, powering the second generation of Ryzen processors, known as Ryzen 2000 for mainstream desktop systems, Threadripper 2000 for high-end desktop setups and Ryzen 3000G for accelerated processing units (APUs).
Threadripper, or Ryzen Threadripper, is a brand of HEDT and workstation multi-core x86-64 microprocessors designed and marketed by Advanced Micro Devices (AMD), and based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream and workstation segments, and as such comes in two line-ups, Threadripper and Threadripper PRO respectively.
Socket SP3 is a zero insertion force land grid array CPU socket designed by AMD supporting its Zen-, Zen 2- and Zen 3-based Epyc server processors, launched on June 20, 2017. Because the socket is physically the same size as socket TR4 and socket sTRX4, users can use CPU coolers not only designed for SP3, but also coolers designed for TR4 and sTRX4.
Socket TR4, also known as Socket SP3r2, is a zero insertion force land grid array (LGA) CPU socket designed by AMD supporting its first- and second-generation Zen-based Ryzen Threadripper desktop processors, launched on August 10, 2017 for the high-end desktop and workstation platforms. It was succeeded by Socket sTRX4 for the third generation of Ryzen Threadripper processors.
Zen 4 is the name for a CPU microarchitecture designed by AMD, released on September 27, 2022. It is the successor to Zen 3 and uses TSMC's N6 process for I/O dies, N5 process for CCDs, and N4 process for APUs. Zen 4 powers Ryzen 7000 performance desktop processors, Ryzen 8000G series mainstream desktop APUs, and Ryzen Threadripper 7000 series HEDT and workstation processors. It is also used in extreme mobile processors, thin & light mobile processors, as well as EPYC 8004/9004 server processors.
Socket sTRX4, also known as Socket SP3r3, is a land grid array (LGA) CPU socket designed by AMD supporting its Zen 2-based third-generation Ryzen Threadripper desktop processors, launched on November 25, 2019 for the high-end desktop and workstation platforms.
Zen 3 is the name for a CPU microarchitecture by AMD, released on November 5, 2020. It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. Zen 3 powers Ryzen 5000 mainstream desktop processors and Epyc server processors. Zen 3 is supported on motherboards with 500 series chipsets; 400 series boards also saw support on select B450 / X470 motherboards with certain BIOSes. Zen 3 is the last microarchitecture before AMD switched to DDR5 memory and new sockets, which are AM5 for the desktop "Ryzen" chips alongside SP5 and SP6 for the EPYC server platform and sTRX8. According to AMD, Zen 3 has a 19% higher instructions per cycle (IPC) on average than Zen 2.
Socket AM5 is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by AMD that is used for AMD Ryzen microprocessors starting with the Zen 4 microarchitecture. AM5 was launched in September 2022 and is the successor to AM4.
Socket sWRX8, also known as Socket SP3r4, is a land grid array (LGA) CPU socket designed by AMD supporting its Ryzen Threadripper Pro 3000 and 5000 series workstation processors, which are based on Zen 2 and Zen 3 platforms, respectively. It was initially launched in July 2020 for OEMs only, with retail availability coming later in March 2021.
Socket sTR5 is a land grid array (LGA) CPU socket designed by AMD. It supports the Zen 4-based Ryzen Threadripper 7000 series, which launched in November 2023.
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: CS1 maint: multiple names: authors list (link)the X570 platform is targeting a release of Computex 2019, which takes place between May 28th and June 1st.
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One of the caveats to a more powerful chipset is that it draws around 11 W of power.
The source also mentions the TDP of the AMD X570 chipset to be at least 15 Watts, a 3-fold increase over the X470 with its 5W TDP.
Q6: It has been noted that AMD has been working with ASMedia on the chipset side of the platform, using a 55nm PCIe 3.0x4 based chipset.