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The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board.
In the fields of digital electronics and computer hardware, multi-channel memory architecture is a technology that increases the data transfer rate between the DRAM memory and the memory controller by adding more channels of communication between them. Theoretically, this multiplies the data rate by exactly the number of channels present. Dual-channel memory employs two channels. The technique goes back as far as the 1960s having been used in IBM System/360 Model 91 and in CDC 6600.
Socket C32 is a zero insertion force land grid array CPU socket designed by AMD for their single-CPU and dual-CPU Opteron 4000 series server CPUs. It is the successor to Socket AM3 for single-CPU servers and the successor for Socket F for lower-end dual-CPU servers. Socket C32 supports two DDR3 SDRAM channels. It is based on the Socket F and uses a similar 1207-pin LGA socket but is not physically or electrically compatible with Socket F due to the use of DDR3 SDRAM instead of the DDR2 SDRAM that Socket F platforms use.
Double Data Rate 5 Synchronous Dynamic Random-Access Memory is a type of synchronous dynamic random-access memory. Compared to its predecessor DDR4 SDRAM, DDR5 was planned to reduce power consumption, while doubling bandwidth. The standard, originally targeted for 2018, was released on July 14, 2020.
Zen is the codename for a family of computer processor microarchitectures from AMD, first launched in February 2017 with the first generation of its Ryzen CPUs. It is used in Ryzen, Ryzen Threadripper, and Epyc (server).
Zen is the codename for the first iteration in a family of computer processor microarchitectures of the same name from AMD. It was first used with their Ryzen series of CPUs in February 2017. The first Zen-based preview system was demonstrated at E3 2016, and first substantially detailed at an event hosted a block away from the Intel Developer Forum 2016. The first Zen-based CPUs, codenamed "Summit Ridge", reached the market in early March 2017, Zen-derived Epyc server processors launched in June 2017 and Zen-based APUs arrived in November 2017.
Zen 2 is a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nm MOSFET node from TSMC. The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips, Ryzen 4000U/H and Ryzen 5000U for mobile applications, as Threadripper 3000 for high-end desktop systems, and as Ryzen 4000G for accelerated processing units (APUs). The Ryzen 3000 series CPUs were released on 7 July 2019, while the Zen 2-based Epyc server CPUs were released on 7 August 2019. An additional chip, the Ryzen 9 3950X, was released in November 2019.
Epyc is a brand of multi-core x86-64 microprocessors designed and sold by AMD, based on the company's Zen microarchitecture. Introduced in June 2017, they are specifically targeted for the server and embedded system markets.
Threadripper, or Ryzen Threadripper, is a brand of HEDT multi-core x86-64 microprocessors designed and marketed by Advanced Micro Devices (AMD), and based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream and workstation segments, and as such comes in two line-ups, Threadripper and Threadipper Pro respectively.
Socket SP3 is a zero insertion force land grid array CPU socket designed by AMD supporting its Zen-, Zen 2- and Zen 3-based Epyc server processors, launched on June 20, 2017. Because the socket is the same size as socket TR4 and socket sTRX4, users can use CPU coolers not only designed for SP3, but also coolers designed for TR4 and sTRX4.
Socket TR4, also known as Socket SP3r2, is a zero insertion force land grid array (LGA) CPU socket designed by AMD supporting its first- and second-generation Zen-based Ryzen Threadripper desktop processors, launched on August 10, 2017 for the high-end desktop and workstation platforms. It was succeeded by Socket sTRX4 for the third generation of Ryzen Threadripper processors.
Sapphire Rapids is a codename for Intel's server and workstation processors based on the Golden Cove microarchitecture and produced using Intel 7. It features up to 60 cores and an array of accelerators, and it is the first generation of Intel server and workstation processors to use a chiplet design.
Zen 4 is the codename for a CPU microarchitecture designed by AMD, released on September 27, 2022. It is the successor to Zen 3 and uses TSMC's N6 process for I/O dies, N5 process for CCDs, and N4 process for APUs. Zen 4 powers Ryzen 7000 performance desktop processors, Ryzen 8000G series mainstream desktop APUs, and Ryzen Threadripper 7000 series HEDT and workstation processors. It is also used in extreme mobile processors, thin & light mobile processors, as well as EPYC 8004/9004 server processors.
Zen 5 is the codename for an upcoming CPU microarchitecture by AMD, shown on their roadmap in May 2022, destined for a release in July 2024. It is the successor to Zen 4 and is fabricated on TSMC's N4X and N3E processes.
Zen 3 is the codename for a CPU microarchitecture by AMD, released on November 5, 2020. It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. Zen 3 powers Ryzen 5000 mainstream desktop processors and Epyc server processors. Zen 3 is supported on motherboards with 500 series chipsets; 400 series boards also saw support on select B450 / X470 motherboards with certain BIOSes. Zen 3 is the last microarchitecture before AMD switched to DDR5 memory and new sockets, which are AM5 for the desktop "Ryzen" chips alongside SP5 and SP6 for the EPYC server platform and sTRX8. According to AMD, Zen 3 has a 19% higher instructions per cycle (IPC) on average than Zen 2.
Sierra Forest is the codename for 6th generation Xeon Scalable server processors designed by Intel, launched in June 2024. It is the first generation of Xeon processors to exclusively feature density-optimized E-cores. Sierra Forest processors are targeted towards cloud server customers with up to 288 Crestmont E-cores.
LGA 4677 is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Intel, compatible with Sapphire Rapids server and workstation processors, which was released in January 2023.
Socket SP6 is a zero insertion force land grid array CPU socket designed by AMD supporting its Zen 4c-based Siena Epyc server processors that launched on September 18, 2023. It is designed for server systems targeting infrastructure and edge computing segments.
Socket sTR5 is a land grid array (LGA) CPU socket designed by AMD. It supports the Zen 4-based Ryzen Threadripper 7000 series, which launched in November 2023.
References
- ↑ Alcorn, Paul (November 10, 2022). "AMD 4th-Gen EPYC Genoa 9654, 9554, and 9374F Review: 96 Cores, Zen 4 and 5nm". Tom's Hardware. Retrieved November 11, 2022.
- ↑ Mujtaba, Hassan (April 7, 2022). "AMD SP5 Socket Pictured In All Its Glory, LGA 6096 For Future EPYC CPUs With 96 Cores & Above". Wccftech. Retrieved November 11, 2022.
- ↑ "AMD EPYC 9004 "Genoa-X" and "Bergamo" CPUs SKU lists leaks out, EPYC 9754 features 128 Zen4c cores". VideoCardz. September 1, 2022. Retrieved November 11, 2022.
- ↑ Ranous, Jordan (November 10, 2022). "4th Gen AMD EPYC Review (AMD Genoa)". StorageReview. Retrieved November 11, 2022.
- ↑ Garreffa, Anthony (December 11, 2021). "AMD EPYC 'Genoa' supports up to 12TB (yes, 12 terabytes) of DDR5 RAM". TweakTown. Retrieved November 11, 2022.