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The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket — as opposed to pins on the integrated circuit, known as a pin grid array (PGA). An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by soldering directly to the board.
In the fields of digital electronics and computer hardware, multi-channel memory architecture is a technology that increases the data transfer rate between the DRAM memory and the memory controller by adding more channels of communication between them. Theoretically, this multiplies the data rate by exactly the number of channels present. Dual-channel memory employs two channels. The technique goes back as far as the 1960s having been used in IBM System/360 Model 91 and in CDC 6600.
Socket C32 is a zero insertion force land grid array CPU socket designed by AMD for their single-CPU and dual-CPU Opteron 4000 series server CPUs. It is the successor to Socket AM3 for single-CPU servers and the successor for Socket F for lower-end dual-CPU servers. Socket C32 supports two DDR3 SDRAM channels. It is based on the Socket F and uses a similar 1207-pin LGA socket but is not physically or electrically compatible with Socket F due to the use of DDR3 SDRAM instead of the DDR2 SDRAM that Socket F platforms use.
Zen is the codename for a family of computer processor microarchitectures from AMD, first launched in February 2017 with the first generation of its Ryzen CPUs. It is used in Ryzen, Ryzen Threadripper, and Epyc (server).
Zen is the codename for the first iteration in a family of computer processor microarchitectures of the same name from AMD. It was first used with their Ryzen series of CPUs in February 2017. The first Zen-based preview system was demonstrated at E3 2016, and first substantially detailed at an event hosted a block away from the Intel Developer Forum 2016. The first Zen-based CPUs, codenamed "Summit Ridge", reached the market in early March 2017, Zen-derived Epyc server processors launched in June 2017 and Zen-based APUs arrived in November 2017.
Zen 2 is a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nm MOSFET node from TSMC. The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips, Ryzen 4000U/H and Ryzen 5000U for mobile applications, as Threadripper 3000 for high-end desktop systems, and as Ryzen 4000G for accelerated processing units (APUs). The Ryzen 3000 series CPUs were released on 7 July 2019, while the Zen 2-based Epyc server CPUs were released on 7 August 2019. An additional chip, the Ryzen 9 3950X, was released in November 2019.
Ryzen is a brand of multi-core x86-64 microprocessors designed and marketed by Advanced Micro Devices (AMD) for desktop, mobile, server, and embedded platforms based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream, enthusiast, server, and workstation segments and accelerated processing units (APUs) marketed for mainstream and entry-level segments and embedded systems applications.
Epyc is a brand of multi-core x86-64 microprocessors designed and sold by AMD, based on the company's Zen microarchitecture. Introduced in June 2017, they are specifically targeted for the server and embedded system markets.
Socket SP3 is a zero insertion force land grid array CPU socket designed by AMD supporting its Zen-, Zen 2- and Zen 3-based Epyc server processors, launched on June 20, 2017. Because the socket is the same size as socket TR4 and socket sTRX4, users can use CPU coolers not only designed for SP3, but also coolers designed for TR4 and sTRX4.
Socket TR4, also known as Socket SP3r2, is a zero insertion force land grid array (LGA) CPU socket designed by AMD supporting its first- and second-generation Zen-based Ryzen Threadripper desktop processors, launched on August 10, 2017 for the high-end desktop and workstation platforms. It was succeeded by Socket sTRX4 for the third generation of Ryzen Threadripper processors.
Zen 4 is the codename for a CPU microarchitecture designed by AMD, released on September 27, 2022. It is the successor to Zen 3 and uses TSMC's N6 process for I/O dies, and N5 process for CPU dies. Zen 4 powers Ryzen 7000 mainstream desktop processors and Ryzen 8000G series mainstream desktop APUs. It is also used in high-end mobile processors, thin & light mobile processors, as well as EPYC 8004/9004 server processors.
Zen 5 is the codename for an upcoming CPU microarchitecture by AMD, shown on their roadmap in May 2022, destined for a release in the second half of 2024. It is the successor to Zen 4 and is believed to use TSMC's 4 nm and 3 nm processes. It will power Ryzen 9050U/HS thin and light mobile processors, Ryzen 9055HX series extreme mobile processors, Epyc 9005 server processors, and Ryzen 9000 series desktop processors.
Socket sTRX4, also known as Socket SP3r3, is a land grid array (LGA) CPU socket designed by AMD supporting its Zen 2-based third-generation Ryzen Threadripper desktop processors, launched on November 25, 2019 for the high-end desktop and workstation platforms.
Zen 3 is the codename for a CPU microarchitecture by AMD, released on November 5, 2020. It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. Zen 3 powers Ryzen 5000 mainstream desktop processors and Epyc server processors. Zen 3 is supported on motherboards with 500 series chipsets; 400 series boards also saw support on select B450 / X470 motherboards with certain BIOSes. Zen 3 is the last microarchitecture before AMD switched to DDR5 memory and new sockets, which are AM5 for the desktop "Ryzen" chips alongside SP5 and SP6 for the EPYC server platform. According to AMD, Zen 3 has a 19% higher instructions per cycle (IPC) on average than Zen 2.
Sierra Forest is a codename for Intel's first generation E-core based Xeon server processors. It is fabricated using Intel's Intel 3 process and compatible with the LGA 7529 socket.
Socket SP5 is a zero insertion force land grid array CPU socket designed by AMD supporting its Zen 4-based Epyc server processors codenamed Genoa that launched on November 10, 2022.
Socket sTR5 is a land grid array (LGA) CPU socket designed by AMD. It supports the Zen 4-based Ryzen Threadripper 7000 series, which launched in November 2023.
References
- 1 2 3 Kennedy, Patrick (September 18, 2023). "AMD EPYC 8004 Siena Launched for Lower Power EPYC Edge". ServeTheHome. Retrieved September 27, 2023.
- 1 2 Olšan, Jan (September 21, 2023). "AMD launches Epyc 8004: lower-cost, lower-power SP6 platform". HWCooling. Retrieved September 27, 2023.
- ↑ Wallossek, Igor (September 18, 2023). "AMD Epyc 8004 and the Socket SP6 - AMD goes one better". igor's LAB. Retrieved September 28, 2023.
- ↑ "Shown is AMD SP6 socket for next generation Zen4 EPYC series, same size as SP3". hitechglitz.com. AnandTech. Retrieved September 28, 2023.
- ↑ "AMD EPYC 8004 "Siena" Processors with "Zen 4c" and New SP6 Platform Announced". TechPowerUp. September 19, 2023. Retrieved September 28, 2023.
- ↑ Bonshor, Gavin (October 19, 2023). "AMD Unveils Ryzen Threadripper 7000 Family: 96 Core Zen 4 for Workstations and HEDT". AnandTech. Retrieved October 26, 2023.