Release date | September 2016 |
---|---|
Designed by | AMD |
Manufactured by | Lotes |
Type | μOPGA-ZIF |
Chip form factors | Flip-chip |
Contacts | 1331 |
FSB protocol | Infinity Fabric, PCI Express |
Voltage range | 1.3V |
Processor dimensions | 40mm × 40mm 1,600mm2 |
Processors | Ryzen: Athlon:
|
Predecessor | AM3+, FM2+, AM1 |
Successor | AM5 |
Memory support | DDR4 |
This article is part of the CPU socket series |
Socket AM4 is a PGA microprocessor socket used by AMD's central processing units (CPUs) built on the Zen (including Zen+, Zen 2 and Zen 3) and Excavator microarchitectures. [1] [2]
AM4 was launched in September 2016 and was designed to replace the sockets AM3+, FM2+ and FS1b as a single platform. It has 1331 pin slots and is the first from AMD to support DDR4 memory as well as achieve unified compatibility between high-end CPUs (previously using Socket AM3+) and AMD's lower-end APUs (on various other sockets). [3] [4] In 2017, AMD made a commitment to using the AM4 platform with socket 1331 until 2020. [5] [6] [7] AM5 succeeded the AM4 platform in late 2022 with the introduction of the Ryzen 7000 series, however, AMD has continued to release new CPUs for AM4 even after the release of AM5. [8] [9] [10] [11]
The AM4 socket specifies the 4 holes for fastening the heatsink to the motherboard to be placed in the corners of a rectangle with a lateral length of 54×90 mm. Previous sockets have 48×96 mm.
Some heat sinks for older sockets are not compatible. [14] [15] Some cooler manufacturers, however, are reported to be offering brackets allowing previously manufactured coolers to work with AM4, [16] while other coolers will be redesigned. [17] [18] Alternatively, some motherboard makers are including both AM3 and AM4 cooler mounting holes, allowing previous generation coolers to be used. [19] AM4 coolers that use a two-pronged bracket approach (such as the AMD Wraith Prism) to mount the cooler will work with AM4 and all the way back to Socket 754/939.
Socket AM4 is currently a base for 8 chipset models. While the processors for this socket have been designed as systems in a package (SiP), with the traditional northbridge and southbridge on board the processor, the motherboard chipset will increase the number of PCI Express lanes and other connectivity options. These connectivity options include: NVMe, SATA, and USB 3.2 Gen 2. [2] [18] [20] There also exists chipset-less variations of A320 and X370, called A300 and X300 respectively, that rely solely on the I/O die integrated into the CPU; these platforms are designed solely for small form factor (SFF) systems where there is a possibility that there is not enough space on the board to fit an actual chipset; these 'chipsets' are also solely available for OEM use only and are not available for purchase with SFF boards. [2] [18] [21]
Model | Release date | PCIe support [lower-alpha 1] | Multi-GPU | USB support [lower-alpha 2] | Storage features | Processor overclocking | TDP | CPU support | Architecture | |||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CrossFire | SLI | SATA ports | RAID | AMD StoreMI | Excavator | Zen | Zen+ | Zen 2 | Zen 3 | |||||||
A300 | Feb 2017 | None | Untested | None | None | Yes [22] | No [23] | No | ~120 μW [lower-alpha 3] | No | Yes [24] [25] | Knoll Express [26] | ||||
X300 | Yes | Yes [27] | ||||||||||||||
Pro 500 | Jan 2020 [28] | Unknown | No | Partial [lower-alpha 4] | ||||||||||||
A320 | Feb 2017 [29] [30] | PCIe 2.0 ×4 | No | No | 1, 2, 6 | 4 | 0, 1, 10 | No | Limited [lower-alpha 5] | ~5.8 W [31] | Yes | Yes | Yes | Varies [lower-alpha 6] | Promontory | |
B350 | PCIe 2.0 ×6 | Yes | 2, 2, 6 | Yes | ||||||||||||
X370 | PCIe 2.0 ×8 | Yes | 2, 6, 6 | 8 | ||||||||||||
B450 | Mar 2018 [32] | PCIe 2.0 ×6 | No | 2, 2, 6 | 4 | Yes | Yes, with PBO | Varies [lower-alpha 7] | Yes | Varies [lower-alpha 7] [33] | ||||||
X470 | PCIe 2.0 ×8 | Yes | 2, 6, 6 | 8 | ||||||||||||
A520 | Aug 2020 [34] | PCIe 3.0 ×6 | No | 1, 2, 6 | 4 | No | Varies | |||||||||
B550 [lower-alpha 8] | Jun 2020 [35] [36] | PCIe 3.0 ×10 | Yes | Varies | 2, 2, 6 | 6 | Yes, with PBO | ~7W | ||||||||
X570 | Jul 2019 [37] [38] | PCIe 4.0 ×16 | Yes | 8, 0, 4 | 12 | ~15 W [39] [40] [lower-alpha 9] | No | Yes | Yes | Bixby |
In 2020, AMD faced some criticism when it was announced on May 7 that its Zen 3-based Ryzen 5000 microprocessors would only be compatible with newer 500-series chipset AM4 motherboards. [41] [42] [43] This was explained as motherboard BIOS's sizes not being large enough to support the full range of AM4 socket processors. [41] [43] This had upset some of the user base as, described by AnandTech, they "...had assumed that this meant any AM4 platform based motherboard would be able to accept all processor made from 2016 to 2020, including the new Zen 3...". [43] After the announcement some motherboard manufacturers announced they were planning to add in support for Zen 3 processors via BIOS updates. [41] [44]
On 19 May 2020, however, AMD changed its position and stated that Zen 3 would be coming to selected older X470 and B450 motherboards via a BIOS update. [45] This would be achieved by disabling support for some older AM4 processors in the BIOS ROM in order to allocate space to support the newer processors. [45] [46] [43]
On 12 November 2021, according to TechPowerUp, ASUS and Gigabyte were the few vendors that allowed Ryzen 5000 on A320 motherboard, and according to Tom's Hardware, it was done by removing support for AMD's 7th Generation A-series and Athlon X4 series (Bristol Ridge) processors. [47] [48] AMD later officially expanded Ryzen 5000 support to 300-series motherboards in March 2022. [49] [50]
AMD Accelerated Processing Unit (APU), formerly known as Fusion, is a series of 64-bit microprocessors from Advanced Micro Devices (AMD), combining a general-purpose AMD64 central processing unit (CPU) and 3D integrated graphics processing unit (IGPU) on a single die.
Socket FM1 is a CPU socket for desktop computers used by AMD early A-series APUs ("Llano") processors and Llano-derived Athlon II processors. It was released in July 2011. Its direct successors are Socket FM2 and Socket FM2+, while Socket AM1 is targeting low-power SoCs.
Socket FM2 is a CPU socket used by AMD's desktop Trinity and Richland APUs to connect to the motherboard as well as Athlon X2 and Athlon X4 processors based on them. FM2 was launched on September 27, 2012. Motherboards which feature the at the time new FM2 CPU socket also utilize AMD's at the time new A85X chipset.
Socket FM2+ is a zero insertion force CPU socket designed by AMD for their desktop "Kaveri" APUs (Steamroller-based) and Godavari APUs (Steamroller-based) to connect to the motherboard. The FM2+ has a slightly different pin configuration to Socket FM2 with two additional pin sockets. Socket FM2+ APUs are not compatible with Socket FM2 motherboards due to the aforementioned additional pins. However, socket FM2 APUs such as "Richland" and "Trinity" are compatible with the FM2+ socket.
Zen is the codename for the first iteration in a family of computer processor microarchitectures of the same name from AMD. It was first used with their Ryzen series of CPUs in February 2017. The first Zen-based preview system was demonstrated at E3 2016, and first substantially detailed at an event hosted a block away from the Intel Developer Forum 2016. The first Zen-based CPUs, codenamed "Summit Ridge", reached the market in early March 2017, Zen-derived Epyc server processors launched in June 2017 and Zen-based APUs arrived in November 2017.
Zen 2 is a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nm MOSFET node from TSMC. The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips, Ryzen 4000U/H and Ryzen 5000U for mobile applications, as Threadripper 3000 for high-end desktop systems, and as Ryzen 4000G for accelerated processing units (APUs). The Ryzen 3000 series CPUs were released on 7 July 2019, while the Zen 2-based Epyc server CPUs were released on 7 August 2019. An additional chip, the Ryzen 9 3950X, was released in November 2019.
Ryzen is a brand of multi-core x86-64 microprocessors designed and marketed by Advanced Micro Devices (AMD) for desktop, mobile, server, and embedded platforms based on the Zen microarchitecture. It consists of central processing units (CPUs) marketed for mainstream, enthusiast, server, and workstation segments and accelerated processing units (APUs) marketed for mainstream and entry-level segments and embedded systems applications.
Zen+ is the codename for a computer processor microarchitecture by AMD. It is the successor to the first gen Zen microarchitecture, and was first released in April 2018, powering the second generation of Ryzen processors, known as Ryzen 2000 for mainstream desktop systems, Threadripper 2000 for high-end desktop setups and Ryzen 3000G for accelerated processing units (APUs).
The Radeon RX Vega series is a series of graphics processors developed by AMD. These GPUs use the Graphics Core Next (GCN) 5th generation architecture, codenamed Vega, and are manufactured on 14 nm FinFET technology, developed by Samsung Electronics and licensed to GlobalFoundries. The series consists of desktop graphics cards and APUs aimed at desktops, mobile devices, and embedded applications.
Socket SP3 is a zero insertion force land grid array CPU socket designed by AMD supporting its Zen-, Zen 2- and Zen 3-based Epyc server processors, launched on June 20, 2017. Because the socket is the same size as socket TR4 and socket sTRX4, users can use CPU coolers not only designed for SP3, but also coolers designed for TR4 and sTRX4.
Socket TR4, also known as Socket SP3r2, is a zero insertion force land grid array (LGA) CPU socket designed by AMD supporting its first- and second-generation Zen-based Ryzen Threadripper desktop processors, launched on August 10, 2017 for the high-end desktop and workstation platforms. It was succeeded by Socket sTRX4 for the third generation of Ryzen Threadripper processors.
LGA 1200 is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Comet Lake and Rocket Lake (11th-gen) desktop CPUs, which was released in April 2020.
Zen 4 is the codename for a CPU microarchitecture designed by AMD, released on September 27, 2022. It is the successor to Zen 3 and uses TSMC's N6 process for I/O dies, N5 process for CCDs, and N4 process for APUs. Zen 4 powers Ryzen 7000 performance desktop processors, Ryzen 8000G series mainstream desktop APUs, and Ryzen Threadripper 7000 series HEDT and workstation processors. It is also used in extreme mobile processors, thin & light mobile processors, as well as EPYC 8004/9004 server processors.
Socket sTRX4, also known as Socket SP3r3, is a land grid array (LGA) CPU socket designed by AMD supporting its Zen 2-based third-generation Ryzen Threadripper desktop processors, launched on November 25, 2019 for the high-end desktop and workstation platforms.
Zen 3 is the codename for a CPU microarchitecture by AMD, released on November 5, 2020. It is the successor to Zen 2 and uses TSMC's 7 nm process for the chiplets and GlobalFoundries's 14 nm process for the I/O die on the server chips and 12 nm for desktop chips. Zen 3 powers Ryzen 5000 mainstream desktop processors and Epyc server processors. Zen 3 is supported on motherboards with 500 series chipsets; 400 series boards also saw support on select B450 / X470 motherboards with certain BIOSes. Zen 3 is the last microarchitecture before AMD switched to DDR5 memory and new sockets, which are AM5 for the desktop "Ryzen" chips alongside SP5 and SP6 for the EPYC server platform and sTRX8. According to AMD, Zen 3 has a 19% higher instructions per cycle (IPC) on average than Zen 2.
Socket AM5 is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Advanced Micro Devices (AMD) that is used for AMD Ryzen microprocessors starting with the Zen 4 microarchitecture. AM5 was launched in September 2022 and is the successor to AM4.
the X570 platform is targeting a release of Computex 2019, which takes place between May 28th and June 1st.
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One of the caveats to a more powerful chipset is that it draws around 11 W of power.
The source also mentions the TDP of the AMD X570 chipset to be at least 15 Watts, a 3-fold increase over the X470 with its 5W TDP.